JPH0374937B2 - - Google Patents

Info

Publication number
JPH0374937B2
JPH0374937B2 JP59087959A JP8795984A JPH0374937B2 JP H0374937 B2 JPH0374937 B2 JP H0374937B2 JP 59087959 A JP59087959 A JP 59087959A JP 8795984 A JP8795984 A JP 8795984A JP H0374937 B2 JPH0374937 B2 JP H0374937B2
Authority
JP
Japan
Prior art keywords
spacer
housing
pressure
pressure sensor
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59087959A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59210338A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23952952&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0374937(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of JPS59210338A publication Critical patent/JPS59210338A/ja
Publication of JPH0374937B2 publication Critical patent/JPH0374937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
JP59087959A 1983-05-04 1984-05-02 圧力伝送器 Granted JPS59210338A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/491,613 US4502335A (en) 1983-05-04 1983-05-04 Fluid pressure transmitter assembly
US491613 1983-05-04

Publications (2)

Publication Number Publication Date
JPS59210338A JPS59210338A (ja) 1984-11-29
JPH0374937B2 true JPH0374937B2 (US06265458-20010724-C00056.png) 1991-11-28

Family

ID=23952952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59087959A Granted JPS59210338A (ja) 1983-05-04 1984-05-02 圧力伝送器

Country Status (5)

Country Link
US (1) US4502335A (US06265458-20010724-C00056.png)
EP (1) EP0126989B2 (US06265458-20010724-C00056.png)
JP (1) JPS59210338A (US06265458-20010724-C00056.png)
CA (1) CA1217647A (US06265458-20010724-C00056.png)
DE (1) DE3465517D1 (US06265458-20010724-C00056.png)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6073325A (ja) * 1983-09-30 1985-04-25 Toshiba Corp 半導体圧力センサ
JPS629106U (US06265458-20010724-C00056.png) * 1984-08-09 1987-01-20
EP0215140B1 (de) * 1985-09-11 1989-04-26 Kunz, Manfred Drucksensor
US4888992A (en) * 1988-04-15 1989-12-26 Honeywell Inc. Absolute pressure transducer and method for making same
JPH01301134A (ja) * 1988-05-30 1989-12-05 Nippon Beeles- Kk 圧力伝送器
US4939497A (en) * 1989-04-18 1990-07-03 Nippon Soken, Inc. Pressure sensor
KR930011091B1 (ko) * 1990-06-08 1993-11-20 미쯔비시 덴끼 가부시끼가이샤 압력 센서
US5174156A (en) * 1990-07-27 1992-12-29 Honeywell Inc. Pressure transducer with reduced offset signal
JP2719448B2 (ja) * 1991-01-24 1998-02-25 三菱電機株式会社 半導体圧力検出装置
JPH04258176A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp 半導体圧力センサ
DE4133061A1 (de) * 1991-10-04 1993-04-15 Bosch Gmbh Robert Drucksensor
DE4211816C2 (de) * 1992-04-08 1995-08-31 Danfoss As Drucksensor
DE4244459C1 (de) * 1992-12-23 1994-05-11 Siemens Ag Druckmeßumformer
CA2217754A1 (en) * 1995-04-28 1996-10-31 Rosemount Inc. Mounting assembly for a pressure transmitter
MX9707606A (es) * 1995-04-28 1997-12-31 Rosemount Inc Transmisor de presion con grupo de montaje aislador de alta presion.
US5596147A (en) 1995-11-17 1997-01-21 Wilda; Douglas W. Coplanar pressure sensor mounting for remote sensor
US20020003274A1 (en) * 1998-08-27 2002-01-10 Janusz Bryzek Piezoresistive sensor with epi-pocket isolation
US6006607A (en) * 1998-08-31 1999-12-28 Maxim Integrated Products, Inc. Piezoresistive pressure sensor with sculpted diaphragm
US6346742B1 (en) 1998-11-12 2002-02-12 Maxim Integrated Products, Inc. Chip-scale packaged pressure sensor
US6351996B1 (en) 1998-11-12 2002-03-05 Maxim Integrated Products, Inc. Hermetic packaging for semiconductor pressure sensors
US6229190B1 (en) 1998-12-18 2001-05-08 Maxim Integrated Products, Inc. Compensated semiconductor pressure sensor
US6255728B1 (en) 1999-01-15 2001-07-03 Maxim Integrated Products, Inc. Rigid encapsulation package for semiconductor devices
EP1570247B1 (en) 2002-12-12 2012-10-24 Danfoss A/S A pressure sensor
WO2005040748A1 (en) * 2003-09-30 2005-05-06 Honeywell International Inc. Diaphragm for bonded element sensor
US20060272405A1 (en) * 2005-06-07 2006-12-07 Lajos Feher Casing for in-tank hall effect sensor used for fuel level sensing
JP4919024B2 (ja) * 2006-11-16 2012-04-18 横河電機株式会社 圧力センサ
JP2009098062A (ja) * 2007-10-18 2009-05-07 Denso Corp 圧力センサ
KR101545765B1 (ko) 2008-04-17 2015-08-20 알러간, 인코포레이티드 이식가능한 액세스 포트 장치 및 부착 시스템
US9023063B2 (en) * 2008-04-17 2015-05-05 Apollo Endosurgery, Inc. Implantable access port device having a safety cap
DE102009001133A1 (de) * 2009-02-25 2010-08-26 Endress + Hauser Gmbh + Co. Kg Drucksensor mit Halbleiterdruckmesswandler
US8215176B2 (en) * 2009-05-27 2012-07-10 Continental Automotive Systems, Inc. Pressure sensor for harsh media sensing and flexible packaging
US8506532B2 (en) * 2009-08-26 2013-08-13 Allergan, Inc. System including access port and applicator tool
US8715158B2 (en) * 2009-08-26 2014-05-06 Apollo Endosurgery, Inc. Implantable bottom exit port
US8708979B2 (en) 2009-08-26 2014-04-29 Apollo Endosurgery, Inc. Implantable coupling device
US20110196195A1 (en) * 2010-02-05 2011-08-11 Allergan, Inc. Implantable subcutaneous access port
US8882728B2 (en) * 2010-02-10 2014-11-11 Apollo Endosurgery, Inc. Implantable injection port
US8992415B2 (en) 2010-04-30 2015-03-31 Apollo Endosurgery, Inc. Implantable device to protect tubing from puncture
US20110270025A1 (en) 2010-04-30 2011-11-03 Allergan, Inc. Remotely powered remotely adjustable gastric band system
US20110270021A1 (en) 2010-04-30 2011-11-03 Allergan, Inc. Electronically enhanced access port for a fluid filled implant
US20120041258A1 (en) 2010-08-16 2012-02-16 Allergan, Inc. Implantable access port system
US20120065460A1 (en) 2010-09-14 2012-03-15 Greg Nitka Implantable access port system
US9784633B2 (en) 2010-11-03 2017-10-10 Avgi Engineering, Inc. Differential pressure transmitter with intrinsic verification
US9207140B2 (en) 2010-11-03 2015-12-08 Avgi Engineering, Inc. Differential pressure transmitter with intrinsic verification
US10466127B2 (en) 2010-11-03 2019-11-05 Avgi Engineering, Inc. Differential pressure transmitter with intrinsic verification
US8821373B2 (en) 2011-05-10 2014-09-02 Apollo Endosurgery, Inc. Directionless (orientation independent) needle injection port
US8801597B2 (en) 2011-08-25 2014-08-12 Apollo Endosurgery, Inc. Implantable access port with mesh attachment rivets
US9199069B2 (en) 2011-10-20 2015-12-01 Apollo Endosurgery, Inc. Implantable injection port
US8858421B2 (en) 2011-11-15 2014-10-14 Apollo Endosurgery, Inc. Interior needle stick guard stems for tubes
US9089395B2 (en) 2011-11-16 2015-07-28 Appolo Endosurgery, Inc. Pre-loaded septum for use with an access port
JP6329095B2 (ja) * 2015-03-13 2018-05-23 アズビル株式会社 圧力センサ
US10620071B2 (en) * 2016-06-29 2020-04-14 Danfoss A/S Pressure sensor and method for manufacturing a pressure sensor
US10132705B2 (en) * 2016-07-19 2018-11-20 Kulite Semiconductor Products, Inc. Low-stress floating-chip pressure sensors
DE102016115197A1 (de) 2016-08-16 2018-02-22 Endress + Hauser Gmbh + Co. Kg Füllkörper zur Reduktion eines Volumens einer Druckmesskammer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112437B2 (US06265458-20010724-C00056.png) * 1971-10-01 1976-04-19

Also Published As

Publication number Publication date
DE3465517D1 (en) 1987-09-24
EP0126989B1 (en) 1987-08-19
JPS59210338A (ja) 1984-11-29
EP0126989B2 (en) 1992-02-12
US4502335A (en) 1985-03-05
CA1217647A (en) 1987-02-10
EP0126989A1 (en) 1984-12-05

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