JPH0373044B2 - - Google Patents
Info
- Publication number
- JPH0373044B2 JPH0373044B2 JP61235147A JP23514786A JPH0373044B2 JP H0373044 B2 JPH0373044 B2 JP H0373044B2 JP 61235147 A JP61235147 A JP 61235147A JP 23514786 A JP23514786 A JP 23514786A JP H0373044 B2 JPH0373044 B2 JP H0373044B2
- Authority
- JP
- Japan
- Prior art keywords
- tic
- substrate material
- film magnetic
- density
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 10
- 229910021193 La 2 O 3 Inorganic materials 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- 238000001513 hot isostatic pressing Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
- Hard Magnetic Materials (AREA)
- Thin Magnetic Films (AREA)
- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
Description
〔産業上の利用分野〕
本発明は、コンピユータの周辺装置であるフロ
ツピーデイスク装置やハードデイスク装置に組み
込まれる磁気ヘツドの基板材料で、特に薄膜磁気
ヘツドの非磁性基板材料に関するものである。
〔従来の技術〕
一般にコンピユータ、VTR、又はオーデイオ
関係の磁気ヘツドは、磁性材料であるフエライト
と非磁性材料のセラミツクスをガラスボンデイン
グして構成されている。これに対し薄膜磁気ヘツ
ドの場合には、磁性あるいは非磁性セラミツクス
基板上へセンダスト、パーマロイなどの磁性薄膜
をメツキ、蒸着あるいはスパツタリングして成膜
し作製される。一般的には、薄膜型磁気ヘツドの
基板材料としては、Al2O3−TiCセラミツクスが
用いられているが、この理由として、他材料に比
較し耐摩耗性に優れている事、基板上に成膜され
る磁性膜とのぬれ性が良い事などがあげられる。
近年デジタル磁気記録用ヘツドは、高記録密度化
への技術推移に伴つてより小型化、狭ギヤツプ
化、高信頼性化が要求されてきている。このた
め、薄膜型磁気ヘツドの基板材料としては、高密
度で気孔が少ない事、耐摩耗特性に優れている
事、加工性に優れている事などが要求される。具
体的には、理論密度の99.95%以上の相対密度が
必要であり、耐摩耗性の点ではビツカース硬度で
2500以上の硬度が必要である。ところが一般に薄
膜磁気ヘツドの基板材料として用いられている
Al2O3−TiCセラミツクスはAl2O3とTiCとの間の
ぬれ性が良くない事から焼結性が悪く、残存する
気孔が多い。また加工性も極めて悪く小型化の要
求に対応できない。ところで、現在用いられてい
るAl2O3−TiCセラミツクスの製造方法としては
HIP(熱間静水圧プレス)法を利用したものがあ
げられるが、HIP処理によるち密化の効果を得る
ためには、その前処理として相対密度95%以上の
焼結体を得る事が必要となる。
しかし、Al2O3−TiCセラミツクスは焼結性が
悪いため、1850℃〜1900℃の高温での焼結を行わ
ないと相対密度95%以上のものは得られない。さ
らに、この様な高温にさらされるためAl2O3、
TiC粒子の著しい粒成長が起こり機械強度が低下
し、故に加工性の低下も見られ、また高温処理の
ために作業性が悪く、省エネルギーの観点からも
問題があつた。
このため、Al2O3とTiCの主成分に対して副成
分を添加する試みがなされ、例えば、特開昭56−
140068、特開昭57−205372などに開示されてい
る。
本発明は上記のような問題を解決すべく研究し
た結果、焼結促進効果を示す添加物と粒成長抑制
効果を示す添加物とを同時に添加する事により良
好な基板を得る事を可能としたものである。
〔発明の目的〕
本発明は、上記の問題点に鑑みて、焼結性に優
れ、従つて高密度かつ気孔が少なく、耐摩耗性に
優れ、良好な加工特性を示す薄膜磁気ヘツド用基
板材料を提供するものである。
〔発明の概要〕
本発明者は種々の実験を行つた結果、TiC15〜
60wt%、残部Al2O3よりなる主成分100wt%に対
し、La2O3、CeO2、Sm2O3の一種又は二種以上
を1〜10wt%添加する事により、Al2O3とTiCと
の間のぬれ性が向上するため、焼結性が向上し残
存する気孔が少なく相対密度99.95%以上を示し、
かつ耐摩耗性に優れ、さらに粒成長抑制効果を示
す添加物であるCr2O3、TiO2、NiOを1〜5wt%
添加する事で小粒径組織とし加工性に優れた薄膜
磁気ヘツド用基板材料を容易に製造するものであ
る。
以下本発明を実施例に従つて詳細に説明する。
〔実施例〕
平均粒径0.1〜0.2μm、純度99%以上のAl2O3、
TiC、La2O3、CeO2、Sm2O3、Cr2O3、TiO2、
NiOの各粉末原料を表−1に示す組成比となるよ
うに秤量し、No.1〜No.16の各試料とした。なお
La2O3、CeO2、Sm2O3(添加葡B)の各秤量値お
よびCr2O3、TiO2、NiO(添加物C)の各秤量値
は、すべてAl2O3とTiCを合わせて100wt%とし
た主成分に対する割合である。また試料No.8〜16
は比較のためのものである。
各試料をそれぞれ上述のように秤量後エタノー
ルを溶媒とし、ボールミルにて20〜40時間混合
し、炉過、乾燥後有機系バインダーを添加し、30
mm×30mm×10mmのブロツク体に加圧成形した。さ
らにこれをArガス雰囲気中で1700℃の温度で2
時間の焼結を行つた後、Arガスを圧力媒体とし
て用い、圧力1000Kg/cm2、温度1600℃、保持時間
2時間の条件で熱間静水圧プレス(HIP)処理を
行つた。
以上の工程により得られた各試料よりそれぞれ
5mm×5mm×20mmの角柱を切り出した後、該角柱
の隣接する5mm×20mmの2面をそれぞれ鏡面に加
工し、陵部に生じた2×2μm以上のチツピング数
を1000倍の倍率を有する光学顕微鏡を用いてカウ
ントし、1cm当りのチツピング発生率に換算し、
加工性の評価項目とした。なおチツピングの大き
さをその長さ別に2〜10μm、11〜50μm、51μm
以上に分類した。また、各試料の破断面につい
て、走査型電子顕微鏡を用いて50〜100ケの粒子
の径を測定し、その平均値をもつて各試料の粒径
とした。さらに、機械強度の評価項目として、ビ
ツカース硬度Hv(荷重1Kg)及び抗折強度Fを測
定した。また、アルキメデス法により、各試料の
密度を測定し、理論密度に対する相対密度を計算
した。以上の結果を表−1に示す。
[Industrial Field of Application] The present invention relates to a substrate material for a magnetic head incorporated in a floppy disk device or a hard disk device that is a peripheral device of a computer, and particularly relates to a nonmagnetic substrate material for a thin film magnetic head. [Prior Art] Magnetic heads for computers, VTRs, or audio devices are generally constructed by glass-bonding ferrite, which is a magnetic material, and ceramic, which is a non-magnetic material. On the other hand, in the case of a thin film magnetic head, a magnetic thin film such as sendust or permalloy is formed on a magnetic or non-magnetic ceramic substrate by plating, vapor deposition or sputtering. Generally, Al 2 O 3 -TiC ceramics are used as the substrate material for thin-film magnetic heads.The reasons for this are that they have superior wear resistance compared to other materials, and that Examples include good wettability with the magnetic film being deposited.
In recent years, digital magnetic recording heads have been required to be smaller, have narrower gaps, and have higher reliability as technology advances toward higher recording densities. For this reason, substrate materials for thin-film magnetic heads are required to have high density, few pores, excellent wear resistance, and excellent workability. Specifically, a relative density of 99.95% or more of the theoretical density is required, and in terms of wear resistance, it is necessary to have a relative density of 99.95% or more of the theoretical density.
Hardness of 2500 or higher is required. However, it is generally used as a substrate material for thin-film magnetic heads.
Al 2 O 3 -TiC ceramics has poor sinterability due to poor wettability between Al 2 O 3 and TiC, and has many residual pores. Furthermore, the workability is extremely poor and it cannot meet the demand for miniaturization. By the way, the currently used manufacturing method for Al 2 O 3 −TiC ceramics is
One example uses the HIP (hot isostatic pressing) method, but in order to obtain the densification effect of HIP treatment, it is necessary to obtain a sintered body with a relative density of 95% or more as a pretreatment. Become. However, since Al 2 O 3 -TiC ceramics have poor sinterability, a relative density of 95% or higher cannot be obtained unless sintering is performed at a high temperature of 1850°C to 1900°C. Furthermore, due to exposure to such high temperatures, Al 2 O 3 ,
Significant grain growth of the TiC particles occurred, resulting in a decrease in mechanical strength, resulting in a decrease in workability.Workability was also poor due to high-temperature treatment, and there were also problems from the perspective of energy conservation. For this reason, attempts have been made to add subcomponents to the main components of Al 2 O 3 and TiC.
140068, Japanese Patent Application Laid-open No. 57-205372, etc. As a result of research to solve the above problems, the present invention has made it possible to obtain a good substrate by simultaneously adding an additive that promotes sintering and an additive that inhibits grain growth. It is something. [Object of the Invention] In view of the above-mentioned problems, the present invention provides a substrate material for a thin film magnetic head that has excellent sinterability, has high density, has few pores, has excellent wear resistance, and has good processing characteristics. It provides: [Summary of the Invention] As a result of various experiments, the present inventor found that TiC15~
By adding 1 to 10 wt% of one or more of La 2 O 3 , CeO 2 , and Sm 2 O 3 to 100 wt % of the main component consisting of 60 wt % and the remainder Al 2 O 3 , Al 2 O 3 and Because the wettability with TiC is improved, sinterability is improved, and there are few remaining pores and the relative density is 99.95% or more.
It also contains 1 to 5 wt% of Cr 2 O 3 , TiO 2 , and NiO, which are additives that have excellent wear resistance and exhibit grain growth suppressing effects.
By adding this, it is possible to easily produce a thin film magnetic head substrate material with a small grain size structure and excellent workability. The present invention will be described in detail below with reference to Examples. [Example] Al 2 O 3 with an average particle size of 0.1 to 0.2 μm and a purity of 99% or more,
TiC, La 2 O 3 , CeO 2 , Sm 2 O 3 , Cr 2 O 3 , TiO 2 ,
Each powder raw material of NiO was weighed so as to have the composition ratio shown in Table 1, and samples No. 1 to No. 16 were prepared. In addition
The weighed values of La 2 O 3 , CeO 2 , and Sm 2 O 3 (Additive B) and the weighed values of Cr 2 O 3 , TiO 2 , and NiO (Additive C) are based on Al 2 O 3 and TiC. This is the ratio to the main components, with a total of 100wt%. Also, sample No. 8 to 16
is for comparison. After weighing each sample as described above, using ethanol as a solvent, mixing in a ball mill for 20 to 40 hours, filtering and drying, adding an organic binder,
It was pressure molded into a block body measuring mm x 30 mm x 10 mm. Furthermore, this was heated at 1700℃ in an Ar gas atmosphere for 2 hours.
After sintering for a period of time, hot isostatic pressing (HIP) treatment was performed using Ar gas as a pressure medium at a pressure of 1000 Kg/cm 2 , a temperature of 1600° C., and a holding time of 2 hours. After cutting out a 5 mm x 5 mm x 20 mm square prism from each sample obtained through the above steps, the two adjacent 5 mm x 20 mm sides of the prism were processed into a mirror surface, and the ridges of 2 x 2 μm or more were formed. The number of chips was counted using an optical microscope with a magnification of 1000 times, and converted to the chipping incidence rate per 1 cm.
The evaluation item was workability. The size of the chipping is determined by its length: 2-10μm, 11-50μm, 51μm.
Classified above. Furthermore, on the fracture surface of each sample, the diameters of 50 to 100 particles were measured using a scanning electron microscope, and the average value was taken as the particle diameter of each sample. Furthermore, as evaluation items for mechanical strength, Bitkers hardness Hv (load: 1 kg) and bending strength F were measured. Furthermore, the density of each sample was measured using the Archimedes method, and the relative density with respect to the theoretical density was calculated. The above results are shown in Table-1.
【表】【table】
以上の結果から明らかな様に、本発明によれ
ば、従来、製造の困難であつた耐摩耗性に優れ、
気孔が少なく、機械加工性も良好な薄膜磁気ヘツ
ド用高密度セラミツクス基板材料を容易に製造す
る事ができた。
As is clear from the above results, the present invention has excellent wear resistance, which has been difficult to manufacture in the past.
We were able to easily produce a high-density ceramic substrate material for thin-film magnetic heads that has few pores and good machinability.
Claims (1)
主成分100重量部に対し、さらにLa2O3、CeO2、
Sm2O3の一種又は二種以上を1〜10wt%、
Cr2O3、TiO2、NiOの一種又は二種以上を1〜
5wt%添加する事を特徴とする薄膜磁気ヘツド用
基板材料。1 Contains 15 to 60 wt% of TiC, and the remainder is Al 2 O 3 for 100 parts by weight of the main component, and further contains La 2 O 3 , CeO 2 ,
1 to 10 wt% of one or more types of Sm 2 O 3 ,
One or more of Cr 2 O 3 , TiO 2 , NiO
Substrate material for thin film magnetic heads, characterized by the addition of 5wt%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61235147A JPS6390016A (en) | 1986-10-01 | 1986-10-01 | Substrate material for thin film magnetic head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61235147A JPS6390016A (en) | 1986-10-01 | 1986-10-01 | Substrate material for thin film magnetic head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6390016A JPS6390016A (en) | 1988-04-20 |
JPH0373044B2 true JPH0373044B2 (en) | 1991-11-20 |
Family
ID=16981748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61235147A Granted JPS6390016A (en) | 1986-10-01 | 1986-10-01 | Substrate material for thin film magnetic head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6390016A (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105513A (en) * | 1977-02-25 | 1978-09-13 | Ngk Spark Plug Co | Method of manufacturing ceramic sintered articles |
JPS57135772A (en) * | 1981-01-09 | 1982-08-21 | Nippon Tungsten | Material for alumina magnetic head |
JPS5926967A (en) * | 1982-07-29 | 1984-02-13 | 松下電器産業株式会社 | Manufacture of ceramic for thin film substrate |
JPS60231308A (en) * | 1984-05-01 | 1985-11-16 | Sumitomo Special Metals Co Ltd | Alumina magnetic head substrate material and manufacture thereof |
JPS60260464A (en) * | 1984-06-01 | 1985-12-23 | ダイジヱツト工業株式会社 | Ceramic sintered body and manufacture |
JPS61158862A (en) * | 1984-12-29 | 1986-07-18 | ティーディーケイ株式会社 | Magnetic head slider material |
JPS632855A (en) * | 1986-06-20 | 1988-01-07 | ティーディーケイ株式会社 | Ceramic material |
-
1986
- 1986-10-01 JP JP61235147A patent/JPS6390016A/en active Granted
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53105513A (en) * | 1977-02-25 | 1978-09-13 | Ngk Spark Plug Co | Method of manufacturing ceramic sintered articles |
JPS57135772A (en) * | 1981-01-09 | 1982-08-21 | Nippon Tungsten | Material for alumina magnetic head |
JPS5926967A (en) * | 1982-07-29 | 1984-02-13 | 松下電器産業株式会社 | Manufacture of ceramic for thin film substrate |
JPS60231308A (en) * | 1984-05-01 | 1985-11-16 | Sumitomo Special Metals Co Ltd | Alumina magnetic head substrate material and manufacture thereof |
JPS60260464A (en) * | 1984-06-01 | 1985-12-23 | ダイジヱツト工業株式会社 | Ceramic sintered body and manufacture |
JPS61158862A (en) * | 1984-12-29 | 1986-07-18 | ティーディーケイ株式会社 | Magnetic head slider material |
JPS632855A (en) * | 1986-06-20 | 1988-01-07 | ティーディーケイ株式会社 | Ceramic material |
Also Published As
Publication number | Publication date |
---|---|
JPS6390016A (en) | 1988-04-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS61158862A (en) | Magnetic head slider material | |
JP3933523B2 (en) | Ceramic substrate materials for thin film magnetic heads | |
US4902651A (en) | Material for magnetic head substrate member | |
JPH0373044B2 (en) | ||
JPH0373043B2 (en) | ||
KR0142702B1 (en) | Nonmagnetic ceramic substrate for magnetic head and the manufacturing method | |
US20090068498A1 (en) | Material of ceramic substrate for thin-film magnetic head | |
US5648303A (en) | Non-magnetic ceramics for recording/reproducing heads and method of producing the same | |
JP2640471B2 (en) | Substrate material for thin film magnetic head | |
JPH0477372B2 (en) | ||
JP2571070B2 (en) | Method of manufacturing substrate material for thin film magnetic head | |
JP3152740B2 (en) | Non-magnetic ceramics | |
JPS63134559A (en) | Non-magnetic ceramics for magnetic head | |
JP2832863B2 (en) | Non-magnetic ceramics for magnetic heads | |
JPS6066361A (en) | Magnetic head | |
KR0137076B1 (en) | Non-magnetic ceramic substrate for magnetic head | |
JP2968736B2 (en) | Ceramic material for magnetic head slider | |
JP3085619B2 (en) | Non-magnetic ceramics | |
JPH0559067B2 (en) | ||
JPH0329739B2 (en) | ||
JP2949297B2 (en) | Porcelain composition for magnetic head | |
JPS5945969A (en) | High hardness high tenacity zirconium oxide ceramic and manufacture | |
JPH07315916A (en) | Substrate material for thin film head | |
JPH0798687B2 (en) | Non-magnetic ceramics for magnetic heads | |
JPH0612611A (en) | Nonmagnetic ceramics for magnetic head |