JPH0371101A - Module for optical communication - Google Patents
Module for optical communicationInfo
- Publication number
- JPH0371101A JPH0371101A JP1206762A JP20676289A JPH0371101A JP H0371101 A JPH0371101 A JP H0371101A JP 1206762 A JP1206762 A JP 1206762A JP 20676289 A JP20676289 A JP 20676289A JP H0371101 A JPH0371101 A JP H0371101A
- Authority
- JP
- Japan
- Prior art keywords
- reception
- optical
- ground
- transmission
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 23
- 230000006854 communication Effects 0.000 title claims abstract description 7
- 238000004891 communication Methods 0.000 title claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 239000003990 capacitor Substances 0.000 claims description 5
- 230000002457 bidirectional effect Effects 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 230000007257 malfunction Effects 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract description 2
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 206010068829 Overconfidence Diseases 0.000 description 1
- 230000007175 bidirectional communication Effects 0.000 description 1
- 210000004899 c-terminal region Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は光通信モジュールに係り、特に送信と受信を一
体にした双方向形光通信モジュールに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical communication module, and more particularly to a bidirectional optical communication module that integrates transmission and reception.
光ファイバを伝送媒体として通信を行うには、光−電気
、電気−光変換を行う光伝送モジュールが必須であり、
双方内形通信を行うために、送信と受信とを一体化した
双方向形光伝送モジュールの形態をとる。従来この種の
技術としては特公昭６０−５９７８８号がある。To communicate using optical fiber as a transmission medium, an optical transmission module that performs optical-to-electrical and electrical-to-optical conversion is essential.
In order to perform bidirectional communication, it takes the form of a bidirectional optical transmission module that integrates transmitting and receiving functions. A conventional technique of this type is Japanese Patent Publication No. 59788/1988.
第２図は従来の一例で、送信側の発光素子１とその駆動
ｉＣ２および受信側の受光ＩＣ３とその受信ｉＣ４とを
同一基板に実装し、導電性遮蔽部材５．金属カバー６、
メタライズＮ７によって送信部から受信部へのノイズの
影響を防いでいる。FIG. 2 shows a conventional example in which a transmitting side light emitting element 1 and its driving IC2, a receiving side light receiving IC3 and its receiving IC4 are mounted on the same substrate, and a conductive shielding member 5. metal cover 6,
The metallization N7 prevents the influence of noise from the transmitter to the receiver.
この種の実装方法では、発光及び受光素子、周辺ｉＣ等
をチップ状態で同一のセラミソクパッケージに実装する
ため、気密封止や、導体層のために複雑な構造となり高
価となる。またピン数は構造的に限られるので、受信側
でクロソク出力や他の機能端子が必要なモジュールには
不適である。In this type of mounting method, the light emitting and light receiving elements, peripheral ICs, etc. are mounted in the same ceramic package in chip form, resulting in a complicated structure due to hermetic sealing and conductor layers, resulting in an increase in cost. Furthermore, since the number of pins is structurally limited, it is unsuitable for modules that require crosslink outputs or other functional terminals on the receiving side.
光伝送モジュールの受信部は、受光素子で光から変換さ
れた微的な信号を扱うため外部雑音の影響を受けやすい
。特に双方向形の場合、発光素子を開動する数工○ｍＡ
の大きな′１ｉｌｉ流が受（ｆｉ側に雑音としてまわり
込むことが多い。The receiving section of the optical transmission module handles minute signals converted from light by the light receiving element and is therefore susceptible to external noise. Especially in the case of bidirectional type, the number of hours required to open the light emitting element is ○mA.
A large '1ili current often circulates to the receiving (fi side) as noise.
本発明の目的は、上述の問題を解決するものであり、汎
用パッケージの１０を用いて、小形に実装でき、受信部
へのノイズの影響の少ない双方向型の光通信用モジュー
ルをＵＨＩｔ：することにある。An object of the present invention is to solve the above-mentioned problems, and to provide a bidirectional optical communication module that can be mounted compactly using a general-purpose package 10 and that has less influence of noise on the receiving section. There is a particular thing.
上記目的は、配線基板の−・力の面に光送信用ｉＣなら
びに周辺部品を、他の面に光受信用コーＣならびに周辺
部品を搭載し、それぞれのｉ−Ｃの下面にクランド層を
設け、さらに受信用の電源系のパターンをＩＣ用と受光
素子用に分１つて設けることで達成される。The above purpose is to mount the optical transmitting IC and peripheral components on the negative surface of the wiring board, and the optical receiving core C and peripheral components on the other surface, and provide a ground layer on the bottom surface of each IC. Furthermore, this can be achieved by providing one pattern for the receiving power supply system and one for the light receiving element.
送信用ｊ−Ｃと受信用」Ｃとが配線基板を介して２板の
グランドブレーンを介して電気的に遮蔽され、電源系パ
ターンも端子を基点として分離して配線されるので送信
側で１．、 Ｅ Ｄを邸動する際に発生するノイズによ
る受信側の誤動作を避けることができる。The transmitting J-C and the receiving "C" are electrically shielded via the wiring board and two ground planes, and the power supply pattern is also separated from the terminal and wired, so the transmitting side ．． , it is possible to avoid malfunctions on the receiving side due to noise generated when operating the ED.
以下、本発明の詳細な説明する。 The present invention will be explained in detail below.
第１図において２１は配線基板、２２は光送信用］Ｃ１
２３は光受信用１Ｃであり、それぞれ配線基板２１を介
して反対側に大袋される。２４は］Ｃの端子２５を接続
するパターンである。２６Ａは送信用Ｉ Ｃ２２の下面
に設（つられたクラン［〜パターン、２６ Ｂは受信用
５Ｃ２３の下面に設けられたクラン［〜パターンである
。２７は発光あるいは受光素子で２８Ａはグラン［〜ピ
ン、２８ Ｂは電源ピンである。In Fig. 1, 21 is a wiring board, 22 is for optical transmission] C1
Reference numeral 23 denotes an optical receiver 1C, which is placed in a large bag on the opposite side with the wiring board 21 interposed therebetween. 24 is a pattern for connecting the terminal 25 of ]C. 26A is a clamp [~pattern] provided on the lower surface of the transmitting IC 22, 26B is a clamp [~pattern] provided on the lower surface of the receiving IC 23. 27 is a light emitting or light receiving element, and 28A is a gran [~pin]. , 28B is a power pin.
３０は発光および受光素子を収納し、光コネクタを接続
するレセプタクル、３２は外部ケースである。30 is a receptacle that houses a light emitting and light receiving element and connects an optical connector, and 32 is an external case.
第３図は第１図の平面図である。２５Ａ、２５Ｊ３は具
にＩＣのグランドピンである。２７Ａは発光素子、２７
Ｊ３は受光素子である。３３は受信側、３４は送信側の
それぞれグランド端子、３５ば受信側、３６は送信−側
のそれぞれクランド端子である。グランド端子３３から
のグランドパターンはＩＣ用の３７Ａと受光素子用の３
７Ｂの別ルー１〜分けて形威しである。同様に電源端子
３５からの電源パターンはＩＣ用の３８Ａ、受光素子用
の３８Ｂに９番づて形威しである。３９ Ａは受信用Ｉ
Ｃの電源パターンに設けたコンデンサ、３９１１は受光
素子用のコンデンサで、共にＩＣ及び受光素子のできる
だけ近くに実装する方が良い。コンデンサは外部から電
源に乗った微小ノイズを吸収する。ケース３２は外部か
らの数羽ノイズ防止上金属製が良い。FIG. 3 is a plan view of FIG. 1. 25A and 25J3 are the ground pins of the IC. 27A is a light emitting element, 27
J3 is a light receiving element. 33 is a ground terminal on the receiving side, 34 is a ground terminal on the transmitting side, 35 is a ground terminal on the receiving side, and 36 is a ground terminal on the transmitting side. The ground pattern from the ground terminal 33 is 37A for IC and 3 for photodetector.
7B's separate rule 1~ is a form of division. Similarly, the power supply pattern from the power supply terminal 35 is the same as 38A for IC and 38B for light receiving element. 39 A is for receiving I
The capacitor 3911 provided in the power supply pattern C is a capacitor for the light receiving element, and it is better to mount both of them as close as possible to the IC and the light receiving element. Capacitors absorb minute noises from the outside on the power supply. The case 32 is preferably made of metal in order to prevent noise from outside.
配線基板２１は、セラミック基板に導体印刷する厚膜セ
ラミック基板が垂直に用いられるか、ガラスエポキシ代
表とするいわゆるプリント配線基板でも良い。The wiring board 21 may be a vertical thick-film ceramic board in which conductors are printed on a ceramic board, or a so-called printed wiring board such as glass epoxy.
パ゛ターン３８Ｂは３７Ａと交叉しているが、いわゆる
クロスオーバ配線を示す。The pattern 38B intersects with the pattern 37A, indicating a so-called crossover wiring.
第１３図の導体パターンは受信用の電源とプランドパタ
ーンの一部を丞しただ旬で他は詳細しである。The conductor pattern shown in FIG. 13 only includes the receiving power supply and a part of the printed pattern, and the rest is not detailed.
以」−説明したように本発明によれば、送信用ｊＣと受
信用ｊＣとが配線基板を介して、２板のグランドプレー
ンを介して電気的に遮蔽され、電源系パターンも端子を
基点として、分離して配線しであるので、送信側でＬ
ＥＤを開動する際に発生するノイズによる受信側の誤動
作や受信感度劣化等の悪影響を防止できる。また送信ｊ
ｃと受信ｉＣを基板を介して互に反対面に実装したうえ
、いわゆるデュアルインライン−にに基板の両端に端子
を形成できるので、小形化できると同時に、伝送に必要
なタロツク信号や他の人出列用に多数の端子が必要なモ
ジュールを実現することができる。- As explained above, according to the present invention, the transmitting jack and the receiving jack are electrically shielded via the wiring board and the two ground planes, and the power supply pattern is also arranged with the terminal as the starting point. , and are wired separately, so L on the transmitting side
It is possible to prevent adverse effects such as malfunction on the receiving side and deterioration of receiving sensitivity due to noise generated when the ED is activated. Send again
In addition to mounting the IC and receiver IC on opposite sides of the board, terminals can be formed on both ends of the board in a so-called dual in-line manner, making it possible to reduce the size of the board and at the same time reduce the amount of data required for transmission and other terminals. It is possible to realize a module that requires a large number of terminals for line output.
さらに、ＩＣは標徨！の面付用プラスチックＩＣパッケ
ージを用いることができ、配線基板も厚膜セラミック基
板やプリン１へ配線基板を用いることができるので、低
価格化が可能である。Furthermore, IC is a standard! A plastic IC package for surface mounting can be used, and a thick film ceramic substrate or a wiring board for the printer 1 can be used as the wiring board, so that the cost can be reduced.
第」は本発明の一実施例の断面図、第２図は従来の光伝
送モジュールの断面図、第３図は第１図の平面図である
。
２］・配線基板、２２・送信用ｊＣ，２３受信用ｉＣ，
２４導体パターン、２５ ］Ｃ端子。
２６Ａ、２６Ｂ ・グランド層、２７Ａ・発光素子。
２７Ｂ 受光素子、２８Ａ・・受光素子のクラン１−
ピン、２８Ｂ・受光素子の電源ビン、３０ レセプタク
ル、３１・・光コネクタ接続穴、３２ ・外部ケース、
３３・・受信グラン１へ端子、３４ 送信グランド端子
、３５・・受信電源端子、３６ 過信電源端子、３７Ａ
、３７Ｂ クランドパターン。
３８Ａ、３８Ｂ−＠源パターン、３９Ａ、３９Ｂコンデ
ンサ。
菜
手
（方式）
事件の表示
讐オ １
発明の名称
年
特許願第
０６７６２
光通信用モジュール
補正をする者
事件との関係2 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of a conventional optical transmission module, and FIG. 3 is a plan view of FIG. 1. 2]・Wiring board, 22・JC for transmission, 23 iC for reception,
24 conductor patterns, 25]C terminal. 26A, 26B - Ground layer, 27A - Light emitting element. 27B light receiving element, 28A... light receiving element clan 1-
Pin, 28B・Power supply bottle for light receiving element, 30 Receptacle, 31・・Optical connector connection hole, 32・External case,
33...Terminal to reception ground 1, 34 Transmission ground terminal, 35...Reception power supply terminal, 36 Overconfidence power supply terminal, 37A
, 37B cland pattern. 38A, 38B-@source pattern, 39A, 39B capacitor. Nate (method) Display of the case 1 Name of the invention Year of patent application No. 06762 Relationship with the case of the person who corrects the optical communication module
Claims (1)
光受信用ｉＣを実装し、基板上各ｉＣの下面部分にグラ
ンド層を形成して、グランドパターンにより、グランド
端子に引き出し、該グランド端子からは、前記ＩＣへ向
うグランドパターンとは別のルートで受光素子のグラン
ドピンと接続するグランドパターンを形成し、同様に電
源端子からは、ＩＣ用と受光素子用に別ルートの電源パ
ターンを形成し、ＩＣの近傍および受光素子のピンの近
傍にそれぞれコンデンサを実装したことを特徴とする光
通信用モジュール。1. Mount the optical transmission IC on one side of the wiring board and the optical reception IC on the other side, form a ground layer on the bottom of each IC on the board, and connect it to the ground terminal using the ground pattern. From the ground terminal, a ground pattern is formed that connects to the ground pin of the light receiving element through a route different from the ground pattern going to the IC, and similarly, from the power supply terminal, a power supply is connected to the IC and the light receiving element through separate routes. An optical communication module characterized in that a pattern is formed and capacitors are mounted near an IC and near a pin of a light receiving element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1206762A JPH0371101A (en) | 1989-08-11 | 1989-08-11 | Module for optical communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1206762A JPH0371101A (en) | 1989-08-11 | 1989-08-11 | Module for optical communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0371101A true JPH0371101A (en) | 1991-03-26 |
Family
ID=16528669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1206762A Pending JPH0371101A (en) | 1989-08-11 | 1989-08-11 | Module for optical communication |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0371101A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485405U (en) * | 1990-11-30 | 1992-07-24 |
-
1989
- 1989-08-11 JP JP1206762A patent/JPH0371101A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485405U (en) * | 1990-11-30 | 1992-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6752539B2 (en) | Apparatus and system for providing optical bus interprocessor interconnection | |
| US7275937B2 (en) | Optoelectronic module with components mounted on a flexible circuit | |
| EP0314651B1 (en) | Electro-optical transducer assembly | |
| JP2544978Y2 (en) | Optical module | |
| EP0437954A1 (en) | Optical-electronic interface module | |
| US6963123B2 (en) | IC package, optical transmitter, and optical receiver | |
| GB2126795A (en) | Optical device | |
| WO1994001987A1 (en) | Component module | |
| EP0508613B1 (en) | Multichip system and method of supplying clock signal therefor | |
| JP3926724B2 (en) | Receptacle type optical transmission / reception module and receptacle type optical transmission / reception module | |
| JP2003304004A (en) | Optical transmission chip and mounting structure thereof | |
| JPH0371101A (en) | Module for optical communication | |
| US6824315B2 (en) | Optical module | |
| JP2000277814A (en) | Optical communication module | |
| JPS62124780A (en) | Optical semiconductor module | |
| EP0118554B1 (en) | Optical device | |
| JPH0832106A (en) | Optical semiconductor device and substrate mounting device | |
| US20030231671A1 (en) | Small format optoelectronic package | |
| JP2001015793A (en) | Optical transmission/reception module | |
| JP4197569B2 (en) | Infrared data communication module | |
| JPS6059788A (en) | Semiconductor device for optical communication | |
| JPS59175150A (en) | Mounting structure of electronic component | |
| JPS58204573A (en) | Optically linked transmitting/receiving circuit | |
| US20030234403A1 (en) | Optical package structure | |
| JP2586931Y2 (en) | Remote control light receiving unit |