JPH0370975A - Cooling structure for electronic part - Google Patents

Abstract

PURPOSE:To permit the cooling of electronic parts with a simple structure without using cooling water by a method wherein inert and insulating refrigerant is employed in a cooling cycle and the electronic parts are stored in an evaporating unit while heat from the electronic parts is absorbed directly by the refrigerant in the evaporating unit. CONSTITUTION:Refrigerant 6, inert and having insulating property, is employed in a cooling cycle. The land of a board 9, on which an electronic part or an LSI 10 is mounted, is connected to an evaporating unit 5 so as to be contacted closely with the unit 5 by bonding or the like so that the LSI 10 is exposed to the refrigerant 6 in the evaporating unit 5. The refrigerant 6, whose pressure and temperature are increased, discharges heat in a heat discharging unit 3 and passes through an expansion valve 8, then, is evaporated in the evaporating unit 5 whereby the temperature of the same becomes low. The refrigerant 6, whose temperature is reduced, deprives heat from the LSI 10 in the evaporating unit 5 and enters into a compressor 2 again. In this case, the LSI 10 can absorb the heat directly; therefore, secondary refrigerant or cooling water, cold plate or the like is not necessary to be used and heat exchanging efficiency may be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for electronic components that cools electronic components as objects to be cooled.

[Prior Art] Conventionally, in this type of cooling structure for electronic components, as shown in FIG. 2, an electronic device 21 and a cooling device 22 are provided separately. The cooling device 22 includes a compressor 28 and a condenser 29 that is cooled by a fan 41 . A cooling cycle is provided in which an expansion valve 30 and a heat exchanger 31 are connected by a pipe 32.
A primary refrigerant 33 is filled inside. The heat exchanger 31 performs heat exchange between the primary refrigerant 33, which has become low temperature through the cooling cycle, and the cooling water 27, which is a secondary refrigerant, and is sent to the electronic device 21 by the pump 35. That is, the cooled cooling water 27 is sent to the piping 25 inside the electronic device 21 and cools the object 23 by removing the heat from the cold plate 24 that is in close contact with the object 23 to be cooled.
It returns to the cooling device 22 through the heat exchanger 31 and exchanges heat with the primary refrigerant 33 again. Also, fan 41. The operation of the pump 35 and the compressor 28 is controlled by the control unit 34. That is, the capacity of the cooling device 22 is controlled by the control unit 34 by controlling the efficiency of the condenser 29 by adjusting the air volume of the fan 41, and by controlling the compressor 28 by controlling the compressor 28 by the gas or inverter.

In the object to be cooled 23 in the electronic device 21, as shown in FIG. The steps are performed in the following order: LSI case 36→film 38→heat transfer paste 37→cold brake 1˜24→cooling water 27.

[Problems to be Solved by the Invention] However, in the conventional cooling structure for electronic components described above, since the cooling water 27 is used as a secondary coolant, it is difficult to manage the water quality of the cooling water 27 and to control the inside of the electronic device 21. It is now impossible to lower the temperature of the refrigerant to an extremely low level in order to prevent condensation, and as a result, it is necessary to lower the thermal resistance between the LSI and the refrigerant using heat transfer paste 37, etc., making the jPI structure more complicated. It has the disadvantage of being

Therefore, an object of the present invention is to make it possible to cool electronic components without using cooling water and with a simplified structure.

[Means for Solving the Problems] The technical means of the present invention for solving these problems consists of a compressor that compresses refrigerant, a heat exhaust section that exhausts heat from the compressed refrigerant, and a The cooling cycle consists of an expansion valve that expands heated refrigerant and a refrigerant evaporation section that absorbs heat by the expanded refrigerant.In addition, an inert and insulating refrigerant is used in the cooling cycle, and electronic components are installed in the evaporation section. This is a cooling structure for electronic components in which heat is directly absorbed from the electronic components using the refrigerant in the evaporator.

[Example] Hereinafter, a cooling structure for an electronic component according to an example of the present invention will be described based on the accompanying drawings.

As shown in FIG. 1, the cooling VI structure according to the embodiment includes a cooling cycle. In this cooling cycle, the pressure at which the refrigerant 6 is compressed! From the I machine 2, a heat exhaust section 3 that exhausts heat from the compressed refrigerant 6, an expansion valve 8 that expands the exhausted refrigerant 6, and a refrigerant evaporation section 5 that absorbs heat by the expanded refrigerant 6. Each element is connected by piping 4. Further, the heat exhaust section 3 is configured to exhaust heat by rotation of the fan 13. Furthermore, the compressor 2 and fan 13 are controlled by a control section 12. That is, the control section 1
2 controls the efficiency of the heat exhaust section 3 by adjusting the air volume of the fan 13 and controls the compressor 2 with an inverter. The above cooling cycle is integrated into the electronic device 1.

Furthermore, in the cooling cycle, an inert and insulating refrigerant is used as the refrigerant 6.

Furthermore, in the electronic device 1, an LSI as an electronic component is used.
0 is housed in the evaporator 5. This storage means
L so that the LSI10 is exposed to the refrigerant 6 in the evaporator 5.
The mounting surface of the substrate 9 on which the SI10 is mounted is hermetically connected to the evaporator 5 by adhesive or the like.

Therefore, according to the cooling JI4 construction according to this embodiment, the high pressure and high temperature refrigerant 6 exhausts heat in the heat exhaust section 3, passes through the expansion valve 8, evaporates in the evaporation section 5, and becomes low temperature. The refrigerant 6 that has become low temperature is transferred to LSL, which is the object to be cooled in the evaporator 5.
It absorbs heat from lo and enters the compressor 2 again. In this case, the refrigerant 6 can absorb heat directly from the LSI 10, so there is no need to use cooling water as a secondary refrigerant or components such as cold plates as in the past, and the heat exchange efficiency is improved accordingly. It has become. In addition, in the evaporation section 5, L
Since the substrate 9 on which the SI10 is mounted is hermetically connected by adhesive or the like, the coolant 6 does not leak outside, and heat is reliably absorbed from the LSI10.

Note that if low thermal resistance is required between the LSI 10 and the coolant 6, a heat sink may be bonded to the LSI.

[Effects of the Invention] As explained above, according to the electronic component cooling structure of the present invention, the electronic component as the object to be cooled is taken into the evaporation section of the cooling cycle and is directly cooled by the low-temperature refrigerant. There is no need to use cooling water, which is a secondary refrigerant, so there is no need to manage the quality of the cooling water, the structure is simple, and the distance between the expansion valve and the pressure machine can be shortened. This has the effect of requiring fewer measures against condensation.

Furthermore, the temperature of the refrigerant in the evaporator can be lowered, making it unnecessary to provide extremely low thermal resistance, which is required when the temperature difference between the refrigerant and electronic components is small.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a cooling structure of the present invention, FIG. 2 is a diagram showing an example of a conventional cooling structure, and FIG. 3 is a sectional view of a main part thereof. 1; Electronic device 3: Heat exhaust section 5: Evaporation section 8: Expanding Nagai 10: LSL 13: Fan 22: Cooling device

Claims (1)

[Claims] A cooling cycle consists of a compressor that compresses refrigerant, a heat exhaust section that exhausts heat from the compressed refrigerant, an expansion valve that expands the exhausted refrigerant, and a refrigerant evaporator that absorbs heat by the expanded refrigerant. An electronic component characterized in that an inert and insulating refrigerant is used in the cooling cycle, electronic components are housed in an evaporator, and the refrigerant in the evaporator directly absorbs heat from the electronic components. cooling structure.