JP2003314942A - Heat collector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the workability in repairing and replacing work of a heat generator. <P>SOLUTION: A valve (solenoid valve 104a) is mounted at an upstream side of a fluid channel for supplying fluid pressure to a heat collecting diaphragm 101. Whereby the collector 100 is demounted from the heat generator 120 without discharging a heat medium from the heat collector 100, and the workability in repairing or replacing the heat generator 120 is improved without impairing the heat collecting performance of the heat collector 100. Accordingly, this heat collector 100 is effectively applied to a cooling system for cooling an electronic apparatus in a portable telephone base station. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat collector that collects heat of a heat generating device, and is effective when used as a cooling device for cooling electronic devices and the like in a mobile phone base station.

[0002]

2. Description of the Related Art As a heat collector for collecting heat of a heat generating device such as an electronic device, in the invention disclosed in Japanese Patent Laid-Open No. 63-283048, a thin plate is accordion-shaped at a position facing a heat radiating surface of the heat generating device. When collecting heat from the heat-generating device, cooling water is filled and circulated in the bellows so as to bring the bellows into close contact with the heating element by fluid pressure of the cooling water.

[0003]

By the way, when repairing or replacing a heat-generating device, it is necessary to remove the heat collector from the heat-generating device. However, as in the invention described in the above publication, a bellows or the like is applied by fluid pressure. In a heat collector that displaces and expands the responsive member, it is necessary to drain the fluid from the heat collector when removing the heat collector from the heat generating device, so work to remove the heat collector from the heat generating device, that is, repair or There is a problem that the replacement work is complicated and the workability is low. Hereinafter, this problem will be referred to as the first problem.

Further, the invention described in the above publication requires a pump for generating a sufficient fluid pressure for displacing and expanding the bellows, so that it is difficult to reduce the manufacturing cost of the heat collector. Hereinafter, this problem will be referred to as the second problem.

Further, since it is difficult to completely bring the bellows and the heat-generating device into close contact with each other only by the fluid pressure inside the bellows, there is a problem that it is difficult to improve the heat collecting ability. Hereinafter, this problem will be referred to as the third problem.

In view of the above points, the present invention has an object to solve at least one of the first to third problems, or to improve the heat collecting ability of a heat collector.

[0007]

In order to achieve the above object, the present invention provides a heat collector for collecting heat of a heat generating device (120), which receives a fluid pressure. The heat collecting diaphragm (101) that is displaced by contacting with the heat radiating surface (122a) of the heat generating device (120) and the heat collecting diaphragm (101) are fixed, and a fluid pressure is applied to the heat collecting diaphragm (101). A heat collector casing (103) forming a pressure chamber (102) for
2) A valve device (104) provided on the side of the fluid introduction port for opening and closing the fluid passage is provided.

Thus, during repair or replacement work of the heat generating device (120), if the valve device (104) is closed,
Since the supply of the fluid to the pressure chamber (102) is stopped, the fluid pressure acting on the heat collecting diaphragm (101) disappears, and the heat collecting diaphragm (101) dissipates the heat radiating surface (122).
Leave a).

Therefore, since the heat collector can be removed from the heat generating device (120) without discharging the fluid from the heat collector, the workability of repairing or replacing the heat generating device (120) can be improved.

According to the second aspect of the present invention, the valve device (104) is configured to close the fluid passage when the heat generation amount of the heat generating device (120) becomes equal to or less than a predetermined amount. And

Thus, the amount of fluid leakage can be minimized, and at the time of repair or replacement of the heat generating device (120), the valve device (104) can be immediately closed without a switch operation for closing the valve device (104). Heating equipment (120)
Repair or replacement work can be started, and the workability of repairing or replacing the heat generating device (120) can be improved.

According to the third aspect of the present invention, the valve device (104) is configured so that when the fluid pressure becomes equal to or lower than a predetermined pressure,
It is characterized in that it is configured to close the fluid passage.

With this, the amount of fluid leakage can be minimized, and at the time of repair or replacement of the heat generating device (120), immediately without performing a switch operation for closing the valve device (104). Heating equipment (120)
Repair or replacement work can be started, and the workability of repairing or replacing the heat generating device (120) can be improved.

The invention according to claim 4 is characterized in that the valve device (104) is configured to close the fluid passage when there is no energization signal of the heat generating device (120).

Thus, the amount of fluid leakage can be minimized, and at the time of repair or replacement of the heat generating device (120), the valve device (104) can be immediately closed without a switch operation for closing the valve device (104). Heating equipment (120)
Repair or replacement work can be started, and the workability of repairing or replacing the heat generating device (120) can be improved.

In the invention described in claim 5, the pressure chamber (10
Pump device (10a, 10b) for supplying fluid to 2)
Is configured to stop when the pressure in the pressure chamber (102) becomes equal to or lower than a predetermined pressure.

This makes it possible to minimize the amount of fluid leakage and to perform a switch operation for stopping the pump device (10a, 10b) when the heat generating device (120) is repaired or replaced. Instead, the work of repairing or replacing the heat generating device (120) can be immediately started, and the workability of repairing or replacing the heat generating device (120) can be improved.

In the invention described in claim 6, the pressure chamber (10
Pump device (10a, 10b) for supplying fluid to 2)
Is characterized in that it is configured to stop when the heat generation amount of the heat generating device (120) becomes equal to or less than a predetermined amount.

This makes it possible to minimize the amount of fluid leakage and to perform a switch operation for stopping the pump device (10a, 10b) when the heat generating device (120) is repaired or replaced. Instead, the work of repairing or replacing the heat generating device (120) can be immediately started, and the workability of repairing or replacing the heat generating device (120) can be improved.

In the invention according to claim 7, the pressure chamber (10
Pump device (10a, 10b) for supplying fluid to 2)
Is configured to stop when there is no energization signal of the heat generating device (120).

This makes it possible to minimize the amount of fluid leakage and to perform a switch operation for stopping the pump device (10a, 10b) when the heat generating device (120) is repaired or replaced. Instead, the work of repairing or replacing the heat generating device (120) can be immediately started, and the workability of repairing or replacing the heat generating device (120) can be improved.

In the invention described in claim 8, the heat generating device (1
A heat collector for collecting the heat radiated by the heat generating device (20), the pressure chamber (10) having an internal pressure changed by receiving heat from the heat generating device (120).
7), and when the heat radiating diaphragm (108) that displaces according to the pressure in the pressure chamber (107) and the pressure in the pressure chamber (107) rises and the heat radiating diaphragm (108) is displaced. In addition, the heat dissipation diaphragm (1
08) and a heat collecting plate (109) in contact therewith.

As described above, in the present invention, the heat generating device (12
The diaphragm for heat collection (10
Since 8) can be displaced, the pump work of the pump that pumps the fluid or the discharge pressure of the pump can be reduced.

Therefore, since a pump having a relatively small discharge pressure can be used as the pump, the manufacturing cost of the heat collector can be reduced.

In the invention described in claim 9, the heat collecting plate (10
A valve device (104) for opening and closing a fluid passage through which a fluid for collecting the heat collected in 9) flows is provided.

As a result, as in the first aspect of the invention, the heat collector can be removed from the heat generating device (120) without discharging the fluid from the heat collecting device, so that the heat generating device (120) can be repaired. Alternatively, the workability of replacement can be improved.

According to the tenth aspect of the present invention, the valve device (104) includes:
It is characterized in that it is configured to close the fluid passage.

As a result, the amount of fluid leakage can be minimized, and at the time of repair or replacement of the heat generating device (120), immediately without performing a switch operation for closing the valve device (104). Heating equipment (120)
Repair or replacement work can be started, and the workability of repairing or replacing the heat generating device (120) can be improved.

According to the invention of claim 11, the heat collecting plate (1
09) has a pump device (10a, 10b) that circulates the fluid that collects the heat collected in (09), so that the pump device (10a, 10b) stops when the fluid pressure falls below a predetermined pressure. It is characterized in that it is configured.

This makes it possible to minimize the amount of fluid leakage and to perform a switch operation for stopping the pump device (10a, 10b) when the heat generating device (120) is repaired or replaced. Instead, the work of repairing or replacing the heat generating device (120) can be immediately started, and the workability of repairing or replacing the heat generating device (120) can be improved.

In the twelfth aspect of the invention, the heat collecting plate (1
09) has a pump device (10a, 10b) that circulates a fluid that collects the heat collected in the pump device (10a, 10b). It is characterized in that it is configured to stop when it hits.

This makes it possible to minimize the amount of fluid leakage and to perform a switch operation for stopping the pump device (10a, 10b) when the heat generating device (120) is repaired or replaced. Instead, the work of repairing or replacing the heat generating device (120) can be immediately started, and the workability of repairing or replacing the heat generating device (120) can be improved.

In the thirteenth aspect of the present invention, the diaphragm (101, 108) which is displaced according to the internal pressure is brought into contact with the heat transfer surface (122a, 109) to generate the heat generating device (120).
A collector for collecting the heat of a diaphragm (101,
A closed space (110) is provided outside the closed space (108), and the pressure in the closed space (110) is reduced to reduce the heat transfer surface (122a, 109) and the diaphragm (101, 10).
It is characterized in that it is configured to be in close contact with (8).

As a result, the diaphragm (101) can be surely brought into close contact with the heat transfer surfaces (122a, 109) even if the internal pressure is low, so that the contact between the diaphragm (101) and the heat transfer surfaces (122a, 109). The thermal resistance can be reduced.

In the fourteenth aspect of the invention, after the pressure in the closed space (110) is reduced, at least a fluid having a higher thermal conductivity than air can be filled in the closed space (110). It is characterized by being configured.

As a result, the contact thermal resistance between the diaphragm (101) and the heat transfer surfaces (122a, 109) can be reliably reduced.

According to the fifteenth aspect of the present invention, there is provided a cooling device for cooling a heating device (120) including a plurality of heating elements (121), the number of which corresponds to each of the plurality of heating elements (121). A heat collector (100) according to any one of claims 1 to 10, which is provided and collects the heat of the heating element (121), and the heat collected in the heat collector (100) is recovered and cooled. And a cooling means (4).

As a result, the heating element (1
Since only the heat collector (100) corresponding to 21) can be removed, the workability of repair or replacement can be improved.

In the sixteenth aspect of the present invention, the base member (1) provided with the positioning means (131, 132) for determining the positions of the heat generating device (120) and the heat collector (100).
06).

As a result, for example, after removing the heat generating device (120) from the heat collector (100), the heat generating device (1
When attaching 20) to the heat collector (100), the size of the gap between the heat generating device (120) and the heat collector (100) can be easily and accurately controlled, so that the heat generating device (120).
Repair or replacement work can be facilitated.

Further, since it is possible to accurately control the gap size, it is possible to accurately control the degree of contact (contact surface pressure) of the diaphragm (101), and the heat generating device (120).
It is possible to prevent the heat collecting ability from being greatly reduced at the time of repair or replacement work of.

In the seventeenth aspect of the present invention, a heat collector for collecting the heat of the heat generating device (120), for collecting heat contacting the heat radiating surface (122a) of the heat generating device (120) under fluid pressure. A diaphragm (101) and a collector having a protrusion (113), which is located on the side opposite to the heat dissipation surface (122a) with the heat collecting diaphragm (101) sandwiched therebetween and which is arranged to face the heat collecting diaphragm (101). Heater inner surface structure (11
4) and are provided.

As a result, the projection (113) functions as a turbulent flow promoting body that disturbs the fluid flow, and increases the heat transfer coefficient between the fluid and the heat collecting diaphragm (101). Heat transfer to the heat collecting diaphragm (101) is promoted, and the heat generating device (120) can be reliably cooled.

In the eighteenth aspect of the invention, the heat collecting diaphragm (101) is a thin film having no irregularities.

Thus, the heat collecting diaphragm (10
Since 1) is easily bent and deformed, when the heat collecting diaphragm (101) comes into contact with the heat radiating surface (122a) due to the fluid pressure, the heat collecting diaphragm (101) fits into the heat radiating surface (122a).

Therefore, since the contact thermal resistance between the heat radiation surface (122a) and the heat collecting diaphragm (101) can be reduced, the heat transfer from the heat radiation surface (122a) to the heat collecting diaphragm (101) is promoted. The heat generating device (1
20) can be reliably cooled.

According to the nineteenth aspect of the invention,
If the gap size (Δ1) between the heat collecting diaphragm (101) and the tip of the protrusion (113) is set to 1 mm or less, the heat flowing through the gap between the heat collecting diaphragm (101) and the tip of the protrusion (113). Since the flow velocity of the medium can be increased, the heat transfer coefficient between the heat collecting diaphragm (101) and the heat medium can be increased.

According to the invention of claim 20, the protrusion (1
13) is provided in plural with a predetermined interval in the fluid flow direction, and further, the outer dimension (L1) of the portion of the protrusion (113) substantially parallel to the fluid flow direction is
It is characterized in that it is smaller than the outer dimension (L2) of a portion of the heating element (121) substantially parallel to the fluid flow direction.

As a result, the projection (113) reflects the light and collides with the projection (113) on the upstream side, and the flow direction is changed to the heat collecting diaphragm (101) side to collect the heat collecting diaphragm (101). Since the reversal flow that collides with the heat collection diaphragm (101) can be made to collide with the portion corresponding to the heating element (121), the heat of the heating element (121) can be more reliably transferred from the heat radiation surface (122a). Heat can be dissipated to the heat collecting diaphragm 101 side.

According to the invention of claim 21, the projection (1
When the protrusion (113) and the heating element (121) are viewed from the side of (13), the heating element (12
In 1), the end (121a) on the downstream side of the fluid flow is located.

As a result, the reversal flow can be reliably made to collide with the portion of the heat collecting diaphragm (101) corresponding to the heating element (121), so that the heating element (121).
It is possible to more reliably radiate the heat from the heat radiation surface (122a) to the heat collecting diaphragm (101) side.

The invention as set forth in claim 22 is characterized in that the fluid flows so as to be concentrated in a portion corresponding to the heating element (121).

As a result, the heating element (121) can be surely cooled.

According to the twenty-third aspect of the present invention, there is provided a cooling device for cooling a heat-generating device (120) comprising a plurality of heat-generating elements (121), which is displaced by receiving fluid pressure to generate heat. A heat collecting diaphragm (101) in contact with the heat dissipation surface (122a), and a heat collecting diaphragm (101) fixed to form a pressure chamber (102) for applying a fluid pressure to the heat collecting diaphragm (101). Container casing (103), an on-off valve (104a) provided on the fluid inlet side of the pressure chamber (102) to open and close a fluid passage, and a predetermined pressure loss provided on the fluid outlet side of the pressure chamber (102). A plurality of heat collectors (100) having a throttling means (104d) for generating heat and collecting heat of the heating element (121);
Provided on the fluid outlet side of the plurality of heat collectors (100),
The heat collecting diaphragm (101) is provided with a fluid pressure generating means (130) for generating a predetermined fluid pressure such that the diaphragm (101) does not come into contact with the heat radiation surface (122a).

As a result, even if the fluid pressure acts on the pressure chamber (102), there is the throttling means (104d), so the pressure on the fluid outlet side of the pressure chamber (102) is the fluid pressure generating means (1
The pressure is set by 30).

An on-off valve (104a) on the fluid body inlet side
When is closed, the pressure in the pressure chamber (102) becomes the pressure set by the fluid pressure generating means (130).

At this time, the fluid outlet side communicates with the other heat collector (100), but since the throttling means (104d) is provided on the fluid outlet side, the on-off valve (104a).
The pressure in the pressure chamber (102) that is closed does not rise.

Therefore, by closing the on-off valve (104a), the heat-collecting diaphragm (101) can be reliably separated from the heat-dissipating surface (122a), which facilitates repair and replacement of the specific heat-generating device (120). It can be carried out.

In the twenty-fourth aspect of the present invention, the fluid pressure generating means is a reserve tank (130) which generates a predetermined fluid pressure by the weight of the stored fluid.

Incidentally, the reference numerals in the parentheses of the above-mentioned respective means are examples showing the correspondence with the concrete means described in the embodiments described later.

[0061]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment)
The heat collector according to the present invention is applied to a cooling system for cooling electronic devices in a mobile phone base station 1, and FIG. 1 is a schematic diagram of the cooling system.

In the mobile phone base station 1, a first heating element 2 including a circuit control board and a battery, and a second heating element 3 including a radio wave output amplifier, a radio wave output control board, a rectifier, and the like are provided. A refrigerator 4 (a portion surrounded by a chain line) for cooling both heating elements 2 and 3 is provided.

Here, the refrigerator 4 is an adsorption refrigerator that operates by absorbing heat from the first heating element 2 and heating the adsorbent by the absorbed heat. The refrigerator 4 will be described below.

The adsorbent is a refrigerant (in the present embodiment,
Water) is adsorbed and the adsorbed refrigerant is desorbed by being heated. In the present embodiment, a solid adsorbent such as silica gel or zeolite is adopted.

The adsorber 5 is one in which a refrigerant is sealed while the inside of the adsorber 5 is maintained in a substantially vacuum state. Inside the adsorber 5, the first heat exchanger 6 for exchanging heat between the adsorbent and the heat medium. And a second heat exchanger 7 for exchanging heat between the heat medium and the refrigerant enclosed in the adsorber 5. In this embodiment, water containing an ethylene glycol-based antifreeze liquid is used as the heat medium.

In this embodiment, a plurality of adsorbers 5 are provided.
a and 5b, and a suction device 5a on the right side of the drawing.
(Hereinafter, referred to as the first suction device 5a) and the suction device 5b on the left side of the drawing (hereinafter, referred to as the second suction device 5b) have the same configuration, and therefore, when both are collectively called, It is written as a container 5. Further, the subscript a of the heat exchangers 6 and 7 indicates that it is a heat exchanger in the first adsorber 5a, and b indicates the second adsorber 5a.
It shows that it is a heat exchanger inside b, and the adsorber 5 on the right side of the drawing
Hereinafter, a will be referred to as a first suction device 5a, and the suction device 5 on the left side of the drawing will be referred to as "a".
Hereinafter, b will be referred to as the second adsorber 5b.

The outdoor heat exchanger 8 is arranged outside the building of the mobile phone base station 1 to exchange heat between the heat medium and the outdoor air (heat radiation target). The outdoor heat exchanger 8 is the first heat exchanger. 2 radiators 8a and 8b and a fan 8c that blows cooling air. The first radiator 8a is provided upstream of the cooling air flow with respect to the second radiator 8b.

The first heat collector 100a has the first heating element 2
The heat generated by the second heat collector 100b collects the heat generated in the second heat collector 3 and collects the heat generated by the second heat generator 3 in the second heat collector 100b. The valves 9a to 9e are rotary valves for switching the heat medium flow, and the valves 10a to 10c are pumps for circulating the heat medium. The first heat collector 100a
Since the second heat collector 100b and the second heat collector 100b have the same structure,
When collectively referring to both heat collectors 100a and 100b, the heat collector 1
00, and the first heating element 2 and the second heating element 3 are collectively referred to as the heating element 121.

Next, the heat collector 100 will be described with reference to FIG.

FIG. 2A is a perspective view showing a state in which the heat collector 100 is attached to the heat generating device 120 to which the heat generating element 121 is attached, and FIG. 2B is a view showing the heat collector 100 in the heat generating device 120.
It is sectional drawing which shows the state which mounted | worn.

The heat radiating plate 122 is in contact with the heat generating element 121 and constitutes a heat radiating surface 122a of the heat generating device 120.
The cover 123 is fixed to the heat radiating plate 122 and is fixed to the heat generating member 121.
The cover 123, the heat dissipation plate 122,
The heating element 121 and the like constitute the heating device 120.

On the other hand, the heat collector 100 is a thin film heat collecting diaphragm 101 which is displaced by receiving the pressure of a fluid heat medium and comes into contact with the heat radiating surface 122a, and the heat collecting diaphragm 101 is fixed and collected. A heat collector casing 103 that constitutes a pressure chamber 102 that applies a fluid pressure to the heat diaphragm 101, a valve device 104 that is provided on the heat medium inlet side of the pressure chamber 102 to open and close a heat medium passage, and a heat collector diaphragm 101. It is composed of a wavy fin 105 or the like which is joined to the surface of the pressure chamber 102 side and promotes heat exchange between the heat medium and the collected heat.

Incidentally, the valve device 104 includes a solenoid valve 104a for opening and closing the heat medium passage, a pressure sensor 104b for detecting the pressure in the pressure chamber 102, the temperature of the heat radiating plate 122 or the heat collecting diaphragm 101 (in the present embodiment, Heat sink 12
2) and the electromagnetic valve 104a based on the detection signals of the pressure sensor 104b and the temperature sensor 104c, the energization signal of the heating element 121, and the like.
And an electronic control unit (not shown) for opening and closing.

As will be described later, when the fluid pressure is not applied to the pressure chamber 102, as shown by the solid line in FIG. 2B, the heat radiating plate 122 and the heat collecting diaphragm 101 have a predetermined gap. separated by δ.

The heat dissipation plate 122 is preferably made of a metal having a high thermal conductivity such as copper, lead, aluminum, iron, gold, silver, beryllium, magnesium, tungsten and zinc.

Next, the operation of the heat collector 100 and its characteristics will be described.

The pumps 10a and 10b are operated to fill and circulate the heat medium in the pressure chamber 102. As a result, the fluid pressure of the heat medium acting on the pressure chamber 102 side of the heat collecting diaphragm 101 becomes larger than the pressure (atmospheric pressure) on the heat radiating plate 122 side of the heat collecting diaphragm 101, so that the heat collecting diaphragm 101 is As shown by the wavy line in FIG. 2 (b), it is displaced so as to expand until it contacts the heat dissipation plate 122.

Therefore, the heat collecting diaphragm 101 comes into contact with the heat radiating plate 122 under the influence of the fluid pressure.
The entire heat collecting diaphragm 101 has a substantially uniform heat dissipation plate 122.
And the contact heat resistance between the heat collecting diaphragm 101 and the heat dissipation plate 122 decreases,
The amount of heat radiation from 2 to the heat collector 100 increases.

When repairing or replacing the heating device 120, the pumps 10a and 10b are stopped and the solenoid valve 104a is closed. As a result, the supply of the heat medium to the pressure chamber 102 is stopped, so that the heat collecting diaphragm 1
The fluid pressure acting on 01 disappears, and the heat collecting diaphragm 101 separates from the heat dissipation plate 122.

Therefore, since the heat collector 100 can be removed from the heat generating device 120 without draining the heat medium from the heat collector 100, the workability of repairing or replacing the heat generating device 120 can be improved.

Further, the electronic control unit includes the pressure sensor 104.
When the detected pressure of b is below a predetermined pressure, the heat collector 1
00, that is, it is considered that the heat medium has leaked at any part of the cooling system, and the electromagnetic valve 104a is closed and the pumps 10a and 10b are stopped. In addition,
When only the pump 10c is operating, the pump 10c is stopped.

As a result, the amount of heat medium leakage can be minimized, and when the heating device 120 is repaired or replaced, the switch operation for closing the solenoid valve 104a and the pump 10a, 10b or the pump 10c are performed. The work of repairing or replacing the heat-generating device 120 can be immediately started without performing a switch operation for stopping, and the workability of repairing or replacing the heat-generating device 120 can be improved.

Similarly, the electronic control unit includes a temperature sensor 10
When the detected temperature of 4c becomes equal to or lower than a predetermined temperature, or when there is no energization signal of the heating element 121, it is considered that a failure has occurred in the heating device 120, the electromagnetic valve 104a is closed, and the pumps 10a and 10b are stopped. When only the pump 10c is operating, the pump 10c is stopped.

As a result, the amount of heat medium leakage can be minimized, and at the time of repair or replacement of the heat generating device 120, the switch operation for closing the solenoid valve 104a and the pump 10a, 10b or the pump 10c can be performed. The work of repairing or replacing the heat-generating device 120 can be immediately started without performing a switch operation for stopping, and the workability of repairing or replacing the heat-generating device 120 can be improved.

In this embodiment, at the same time as closing the solenoid valve 104a, the pump 10a, 10b or the pump 10c is closed.
Pump 10a, 10b or pump 10
The solenoid valve 104a may be closed while the valve c is operated, or the pumps 10a, 10b or the pump 10c may be stopped while the solenoid valve 104a is opened. However, when removing the heat generating device 120 from the heat collector 100, the pumps 10a, 1
It is necessary to stop 0b or the pump 10c.

Next, the operation of the cooling system according to this embodiment will be described.

1. Basic Operation Mode of Refrigerator 4 (Adsorption Type Refrigerator) In this mode, the first and second basic operation modes described below are switched at predetermined intervals. Incidentally, the predetermined time is appropriately selected based on the time required to desorb the refrigerant adsorbed by the adsorbent.

In the present embodiment, the first heating element 2 is 1
It is cooled (endothermic) to 50 ° C or below,
The heating element 3 is cooled to an ambient temperature (35 ° C. to 45 ° C.) or lower, and the refrigerator 4 has various specifications determined so that a predetermined refrigerating capacity is exhibited at 70 ° C. or higher and 100 ° C. or lower. There is.

1.1 First Basic Operation Mode In this mode, as shown in FIG.
b and the second heat exchanger 7b of the second adsorber 5b, the heat medium is circulated to evaporate the refrigerant in the second adsorber 5b to cool the second heat collector 100b. Is supplied to cool the second heating element 3, and at the same time, the vapor phase refrigerant evaporated in the second adsorber 5b, that is, water vapor is adsorbed by the adsorbent in the second adsorber 5b.

At this time, the adsorbent generates a quantity of heat equivalent to the heat of condensation, and the adsorbing capacity decreases as the temperature of the adsorbent rises, so that the heat medium cooled in the outdoor heat exchanger 8 is cooled to the second position. The adsorbent is cooled by supplying it to the first heat exchanger 6b of the adsorber 5b.

On the other hand, the first heat exchanger 6a of the first adsorber 5a
The heat absorbed by the heat medium in the first heat collector 100a is supplied to the adsorbent of the first adsorber 5a via the heat medium to heat the adsorbent and adsorb it to the adsorbent. The refrigerant is desorbed and the second heat exchanger 7 of the first adsorber 5a is removed.
The heat medium cooled by the outdoor heat exchanger 8 is supplied to a, and the desorbed vapor phase refrigerant (steam) is cooled and condensed by the second heat exchanger 7a.

Hereinafter, the adsorber 5 in a state where the refrigerant is evaporated to exert its refrigerating capacity and the evaporated gas-phase refrigerant is adsorbed by the adsorbent is referred to as "adsorber 5 in adsorption step". The adsorber 5 in a state in which the adsorbent is heated and the adsorbed refrigerant is desorbed while the desorbed refrigerant is cooled and condensed is referred to as "adsorber in desorption step". 5 ”.

1.2 Second Basic Operation Mode In this mode, contrary to the first basic operation mode, the first adsorber 5a is the adsorption step and the second adsorber 5b is the desorption step. .

Specifically, as shown in FIG. 4, by circulating a heat medium between the second heat collector 100b and the second heat exchanger 7a of the first adsorber 5a, the first adsorber 5b is circulated. The second heating element 3 is cooled by evaporating the refrigerant in 5a and supplying the cooled heat medium to the second heat collector 100b, and at the same time, the vapor phase refrigerant (steam) evaporated in the first adsorber 5a.
Is adsorbed by the adsorbent in the first adsorber 5a.

At this time, the adsorbent is cooled by supplying the heat medium cooled by the outdoor heat exchanger 8 to the first heat exchanger 6a of the first adsorber 5a.

On the other hand, the first heat exchanger 6b of the second adsorber 5b
In addition, the heat absorbed by the heat medium in the first heat collector 100a is supplied to the adsorbent of the second adsorber 5b via the heat medium to heat the adsorbent and adsorb it to the adsorbent. The refrigerant is desorbed and the second heat exchanger 7 of the second adsorber 5b is released.
The heat medium cooled by the outdoor heat exchanger 8 is supplied to b, and the desorbed vapor phase refrigerant is cooled and condensed by the second heat exchanger 7b.

2. Overheat operation mode This operation mode is a mode executed when the amount of heat generated by the first heating element 2 exceeds a predetermined amount of heat that can be adsorbed by the refrigerator 4. Here, the predetermined amount of heat means, for example, the refrigerator 4
Is a value obtained by dividing the maximum refrigerating capacity of 1 by the maximum coefficient of performance of the refrigerator 4.

Specifically, when switching between the first basic operation mode and the second basic operation mode, the valve 9b for switching the heat medium outlet side of the first heat exchanger 6 is set to the first heat exchanger 6
The valve 9a is operated after a predetermined time has elapsed after the valve 9a for switching the heat medium inlet side has been switched and operated.

As a result, as shown in FIGS.
The heat absorbed by the heat medium in the heat collector 100a is absorbed by the adsorbent,
That is, the heat is radiated from the outdoor heat exchanger 8 into the outside air without being supplied to the refrigerator 4.

The time during which the overheat operation mode is executed is appropriately selected based on the amount of heat generated by the first heating element 2, the amount of heat that can be adsorbed by the refrigerator 4, the outside air temperature, and the like.

Incidentally, FIG. 5 shows an overheat operation mode executed when shifting from the first basic operating mode to the second basic operating mode, and FIG. 6 shows the first basic operating mode to the first basic operating mode.
The overheat operation mode performed when shifting to the basic operation mode is shown.

3. Low heat operation mode This mode is a mode executed when the amount of heat generated by the first heating element 2 falls below a predetermined amount of heat required to operate the refrigerator 4.

Specifically, when switching between the first basic operation mode and the second basic operation mode, the valve 9a for switching the heat medium inlet side of the first heat exchanger 6 is set to the first heat exchanger 6
The valve 9b is operated after a predetermined time has elapsed after the valve 9b for switching the heat medium outlet side is switched and operated.

As a result, as shown in FIGS. 7 and 8, the heat medium supplied to the first heat exchanger 6 for heating the adsorbent does not flow to the outdoor heat exchanger 8 and the first heat exchanger 8 is collected. Since it returns to the heater 100a, the heat generated in the first heating element 2 can be supplied to the refrigerator 4 without waste.

As in the overheat operation mode, the time during which the low heat operation mode is executed is the amount of heat generated by the first heating element 2, the amount of heat that can be adsorbed by the refrigerator 4, that is, the adsorbent, and the outside air temperature. It is appropriately selected based on.

Incidentally, FIG. 7 shows a low heat operation mode executed when shifting from the first basic operation mode to the second basic operation mode, and FIG. 8 shows the second basic operation mode to the first basic operation mode.
The low heat operation mode performed when shifting to the basic operation mode is shown.

4. Direct cooling mode In this mode, the outside air temperature in winter is sufficiently low, and the outside air temperature is the cooling temperature of the second heating element 3, that is, the second heating element 3.
This is a mode that is executed when the temperature is lower than the allowable heat resistant temperature of 1. or when the refrigerator 4 is out of order, and as shown in FIG. 9, the pumps 10a and 10b are stopped and the first heating element 2, that is, the first collector. The heat medium cooled by only the first radiator 8a is supplied to the heat generator 100a, and the second heat generating element 3, that is, the second heat collector 100b, is provided with the first heat radiator 8a and the second heat radiator 8a.
The heat medium cooled by the radiator 8b is supplied.

The outside air temperature is detected by an outside air temperature sensor (not shown), and the detected value is 1 in this embodiment.
This mode is executed when the temperature becomes 5 ° C or less.

Further, the determination as to whether or not the refrigerator 4 is out of order is made by determining the pressure in the adsorber 5 to a predetermined value (70 in this embodiment).
KPa) or more, when the temperature of the heat medium flowing out from the second heat exchanger 7 of the adsorber 5 in the adsorption step is a predetermined value (20 ° C. in this embodiment) or more, the adsorption step is performed. When the temperature of the heat medium flowing out from the second heat exchanger 7 of a certain adsorber 5 becomes equal to the temperature of the heat medium at the inlet of the second heat exchanger 7, and flows into the first heat exchanger 6 of the adsorber 5. It is considered that the refrigerator 4 is out of order when either of the heat medium temperature that occurs and the heat medium temperature that flows out from the first heat exchanger 6 becomes equal.

(Second Embodiment) In the present embodiment, as shown in FIG. 10, a positioning projection 131 and this positioning projection 131 are used as positioning means for determining the positions of the heat generating device 120 and the heat collector 100. A positioning groove 132 to be fitted is provided.

Specifically, the collector casing 103 is fixed to the plate-shaped base member 106 by welding or a joining method such as bolts, and the base member 106 is provided with a positioning projection 131, while the heat-generating device 120 is provided. The positioning groove 132 is provided in the heat radiating plate 122 in this embodiment.

Thus, for example, when the heat generating device 120 is removed from the heat collector 100 and then the heat generating device 120 is attached to the heat collector 100 again, the heat dissipation plate 122 and the heat collector 10 are attached.
Since the size of the gap δ with respect to 0 can be easily and accurately managed, repairing or replacing work of the heat generating device 120 can be facilitated.

Further, since the size of the gap δ can be accurately controlled, the degree of contact (contact surface pressure) between the heat collecting diaphragm 101 and the heat radiating plate 122 can be accurately controlled, and the heat radiating plate 122 can collect the heat. It is possible to prevent the amount of heat radiated to the heating device 100 from being greatly reduced when repairing or replacing the heat generating device 120.

(Third Embodiment) This embodiment is a modification of the second embodiment. Specifically, as shown in FIG. 11, a plurality of positioning protrusions 131 and positioning grooves 132 ( In this embodiment, the heat collector 100 and the heat generating device 120 are horizontally arranged so that the heat dissipation plate 122 and the heat collecting diaphragm 101 are substantially horizontal.

(Fourth Embodiment) In the above embodiment, the heat collecting diaphragm 101 is inflated so as to be displaced by the fluid pressure of the heat medium pumped from the pump 10a, 10b or the pump 10c. As shown in FIG. 12, the sealed pressure chamber 107 whose internal pressure is changed by receiving heat from the heat generating device 120 is connected to the heat dissipation plate 122 and the pressure chamber 10.
And a pump 10a, 10b or pump 1 in place of the heat collecting diaphragm 101.
The heat collecting plate 109 having a rigidity that is hardly displaced by the fluid pressure of the heat medium pumped from 0c is fixed to the heat collecting casing 103.

Further, in the pressure chamber 107, a heating element 121
A refrigerant having a boiling point and a latent heat of vaporization to such an extent that it can be evaporated by the heat generated from the inside is sealed, and the refrigerant and the heat radiating diaphragm 108 (heat collecting plate 109) are provided on the pressure chamber 107 side of the heat radiating diaphragm 108. A fin 108a that promotes heat exchange with is joined.

Incidentally, the refrigerant sealed in the pressure chamber 107 is
For example, water, alcohol, freon, ammonia, lithium bromide, oil, water mixed with an ethylene glycol antifreeze, or the like is suitable.

The fins 108a are formed in the shape of a thin strip plate, and the longitudinal direction of the fins 108a extends vertically so that the refrigerant condensed in the liquid refrigerant reservoir 107a arranged on the lower side can quickly flow down. .

Incidentally, it is desirable that the heat collecting plate 109 is made of a metal having a high thermal conductivity such as copper, lead, aluminum, iron, gold, silver, beryllium, magnesium, tungsten and zinc.

Next, the characteristic operation of this embodiment and its effect will be described.

When the heat generating element 121, that is, the heat generating device 120 generates heat, the refrigerant existing in the pressure chamber 107 near the heat generating element 121 evaporates and the pressure in the pressure chamber 107 rises, so that the heat radiating diaphragm 108 gathers. It is displaced so as to expand toward the heating plate 109 side, and as shown by the wavy line in FIG.
The radiating diaphragm 108 and the heat collecting plate 109 are in contact with each other.

Therefore, the heat-dissipating diaphragm 108 contacts the heat collecting plate 109 under the condition that the fluid pressure in the pressure chamber 107, that is, the vapor pressure acts, so that the heat-dissipating diaphragm 1
The entire 08 contacts the heat collecting plate 109 substantially uniformly, and the contact thermal resistance between the heat radiating diaphragm 108 and the heat collecting plate 109 decreases, and the amount of heat radiated from the heat radiating diaphragm 108 to the heat collecting plate 109 increases. .

The refrigerant that has absorbed the heat from the heating element 121 in the liquid refrigerant reservoir 107a and evaporated is cooled and condensed by the fins 108a, flows down the surface of the fins 108a, and flows downward to the liquid refrigerant reservoir 107a. Again heating element 121
It is heated at and evaporates.

As described above, in the present embodiment, the heat generating device 1
Since the heat-dissipating diaphragm 108 is displaced using the heat generated by 20, the pump 10a for pumping the heat medium,
It is possible to reduce the pump work of the pump 10b or the pump 10c or the discharge pressure of the pump.

Therefore, a pump having a relatively small discharge pressure can be adopted as the pump 10a, 10b or the pump 10c, so that the manufacturing cost of the heat collector 100, that is, the cooling system can be reduced.

When the heat generating device 120 is repaired or replaced, if the heat generating body 121 is stopped, the heat radiating diaphragm 108 naturally separates from the heat collecting plate 109, so that the heat medium in the heat collector 100 circulates. Part, that is, heat collecting plate 1
09 and the heat collector casing 103 and the like, and the pressure chamber 107 side such as the heat radiating diaphragm 108 can be separated.

Therefore, since the heat collector 100 can be removed from the heat generating device 120 without draining the heat medium from the heat collector 100, the workability of repairing or replacing the heat generating device 120 can be improved.

Since the operation of the valve device 104 is the same as that of the above-mentioned embodiment, the detailed description will be omitted.

(Fifth Embodiment) This embodiment is different from the fourth embodiment in the same manner as in the second embodiment.
And as a positioning means for determining the position of the heat collector 100,
Positioning protrusion 131 and this positioning protrusion 13
1 is provided with a positioning groove 132 for fitting with 1.

However, in this embodiment, as shown in FIG. 13, the pressure chamber 107 side of the heat radiating diaphragm 108 of the heat collector 100, the heat generating device 120, and the base member 106.
Are integrated by welding or a joining method such as bolts, and a positioning groove 132 is provided in the heat collector casing 103.

(Sixth Embodiment) In this embodiment, the third embodiment is applied to the fourth embodiment. Specifically, as shown in FIG. 14, the positioning protrusion 13
1 and a plurality of positioning grooves 132 (in the present embodiment,
2), and the heat collector 100 and the heat generating device 120 are horizontally placed so that the heat radiating plate 109 and the heat radiating diaphragm 108 are substantially horizontal.

In the present embodiment, the liquid refrigerant reservoir 1
Since it is necessary to position 07a on the lower side, the heat generating device 120 is arranged on the lower side of the heat collector 100.

(Seventh Embodiment) This embodiment is shown in FIG.
As shown in FIG. 16, the heat collecting diaphragms 101, 10
8, that is, O so as to surround the outside of the pressure chambers 102 and 107.
A packing such as a ring 110a is arranged, a closed space 110 is provided outside the heat collecting diaphragms 101, 108, that is, the pressure chambers 102, 107, and the pressure in the closed space 110 is reduced to release the heat that is a heat transfer surface. The plate 122 or the heat collecting plate 109 and the heat collecting diaphragms 101 and 108 are closely contacted with each other without a gap.

Note that FIG. 15 shows the present embodiment applied to the first embodiment, and FIG. 16 shows the present embodiment applied to the fourth embodiment.
The operation and effect of this embodiment will be described with reference to FIG.

The pump 10a, 10b or the pump 10c is operated to fill and circulate the heat medium in the pressure chamber 102,
As shown by the wavy line in FIG. 15B, the heat collecting diaphragm 101 is displaced so as to expand until it comes into contact with the heat dissipation plate 122, and at the same time, from the discharge port 111 to the closed space 110.
The air inside is discharged by a pump means such as a vacuum pump.

As a result, even if the fluid pressure in the pressure chamber 102 is low, the pressure difference between the pressure chamber 102 and the closed space 110 becomes large, so that the heat-collecting diaphragm 101 can be reliably brought into close contact with the heat dissipation plate 122. it can.

Then, when the pressure in the closed space 110 drops to a predetermined pressure, the valve 112 is used to discharge the exhaust port 11.
1 is closed and a fluid having a higher thermal conductivity than that of air is filled from a liquid filling port (not shown).

As a result, the air gap remaining between the heat collecting diaphragm 101 and the heat radiating plate 122 is filled with a fluid having a higher thermal conductivity than that of air, and therefore the heat collecting diaphragm 101.
The contact thermal resistance between the heat sink 122 and the heat dissipation plate 122 can be reduced.

The fluid having a higher thermal conductivity than air preferably has a boiling point at 1 atm of 373.15 K or higher. Specifically, water, ethylene glycol, glycerin, toluene, octane, chlorobenzene, lubricating Oil, spindle oil, transformer oil, kerosene, silicone oil,
Examples include mercury, cesium, potassium, rubidium and sodium.

The present embodiment can also be applied to a heat collector using a bellows, as described in the above publication.

(Eighth Embodiment) FIG. 17 is a schematic view showing a heat collector 100 according to this embodiment. The heat collector 100 according to this embodiment is for collecting heat in a heat collector casing 103. A heat collector inner surface structure 114 having a plurality of protrusions 113 is arranged at a position opposite to the heat radiation surface 122a with the diaphragm 101 sandwiched therebetween and facing the heat collecting diaphragm 101. To do. Incidentally, FIG. 18 is a perspective view showing the protruding portion 113 portion.

The collector inner surface structure 114 and the collector casing 103 are preferably made of a material having low thermal conductivity such as polypropylene or phenol, but may be made of metal.

FIG. 19 shows the protrusion 113 and the heat dissipation surface 1.
FIG. 22A is an enlarged view of a portion 22 a, in which at least the number of heating elements 121 of the plurality of protrusions 113 is equal to that of the heating device 120.
The gap dimension Δ1 of the gap 113a between the heat collecting diaphragm 101 and the tip of the protrusion 113 is 1 mm or less.

Furthermore, the outer dimension L1 of the portion of the protrusion 113 that is substantially parallel to the heat medium flow direction is the heating element 1
It is set to be smaller than the outer dimension L2 of a portion of 21 that is substantially parallel to the flow direction of the heat medium.

As a result, the protrusion 113 functions as a turbulent flow promoting body that disturbs the flow of the heat medium that is the refrigerant, and increases the heat transfer coefficient between the heat medium and the heat collecting diaphragm 101. Heat transfer to the heat collecting diaphragm 101 is promoted, and the heat generating element 121 can be reliably cooled.

Further, in this embodiment, since the heat collecting diaphragm 101 is a thin film having no irregularities such as the fins 105, the heat collecting diaphragm 101 is easily bent and deformed.

Therefore, when the heat-collecting diaphragm 101 is displaced by the pressure of the heat medium and comes into contact with the heat-dissipating surface 122a, the heat-collecting surface 122a and the heat-collecting diaphragm 101 are fitted to the heat-dissipating surface 122a. It is possible to reduce the contact thermal resistance with. As a result, heat transfer from the heat radiation surface 122a to the heat collecting diaphragm 101 is promoted, so that the heating element 121 can be cooled reliably.

Since the gap size Δ1 is as small as 1 mm or less, the flow velocity of the heat medium flowing through the gap 113a can be increased. Therefore, the heat collecting diaphragm 101
Since the heat transfer coefficient between the heat medium and the heat medium can be increased, the heat transfer from the heat radiating surface 122a to the heat collecting diaphragm 101 is promoted, and the heating element 121 can be reliably cooled.

Further, since the projection 113 is located at a portion corresponding to the heat generating element 121, the heat of the heat generating element 121 can be more surely radiated from the heat radiating surface 122a to the heat collecting diaphragm 101 side.

By the way, as shown in FIG. 19, the heat medium flowing over the upstream side projection 113 located on the left side of the drawing sheet to the downstream side is the downstream projection section 1 located on the right side of the drawing sheet.
Collide with 13. Then, a part of the heat medium is the protrusion 113.
And then collides with the projection 113 on the upstream side, and further, the flow direction thereof is turned to the heat collecting diaphragm 101 side and collides with the heat collecting diaphragm 101. Hereinafter, the flow of the heat medium that collides with the projection 113 on the downstream side and is reversed will be referred to as a reverse flow.

At this time, in this embodiment, the protrusion 113
Outer dimension L1 of a portion of the portion that is substantially parallel to the heat medium flow direction
However, since it is smaller than the outer dimension L2 of the portion of the heat generating element 121 that is substantially parallel to the flow direction of the heat medium, the reverse flow can collide with the portion of the heat collecting diaphragm 101 that corresponds to the heat generating element 121. As a result, the heat of the heating element 121 can be more reliably transferred from the heat radiating surface 122a to the heat collecting diaphragm 10.
The heat can be dissipated to the 1 side.

(Ninth Embodiment) This embodiment is a modification of the eighth embodiment, and in this embodiment, as shown in FIG. 20, the pumps 10a and 10b are operated to heat the heat medium in the pressure chamber 102. The heat dissipation surface 1 at the stage before filling and circulating
The heat generating device 120 and the heat collector 100 are installed so that 22a and the heat collecting diaphragm 101 are in contact with each other.

Next, the function and effect of this embodiment will be described.

As in the above-described embodiment, at the stage before the heat medium is filled and circulated in the pressure chamber 102, the heat dissipation surface 1
A gap δ (see FIG.
7)), the heat generating device 120 and the heat collector 10
There is a possibility that the gap δ may fluctuate significantly due to installation variation with zero.

If the gap δ becomes large, the contact pressure between the heat radiating surface 122a and the heat collecting diaphragm 101 decreases and the contact thermal resistance between the two 122a, 101 increases, so that the heat radiating surface The heat transfer from 122a to the heat collecting diaphragm 101 is hindered.

Therefore, as in the above-described embodiment, there is a gap δ (see FIG. 17) between the heat radiating surface 122a and the heat collecting diaphragm 101 before the heat medium is filled and circulated in the pressure chamber 102. The heating device 120
It is necessary to accurately manage the installation positions of the heat collector 100 and the heat collector 100.

On the other hand, in this embodiment, the pump 1
0a and 10b are operated to fill the heat medium in the pressure chamber 102 and circulate the heat medium, so that the heat radiating surface 122a and the heat collecting diaphragm 101 are in contact with each other.
Since the heat collector 100 and the heat collector 100 are installed, even if the pressure in the pressure chamber 102 is reduced, the contact pressure between the heat radiation surface 122a and the heat collecting diaphragm 101 is prevented from becoming a predetermined pressure or less, It is possible to prevent large variations in the contact pressure.

Therefore, the heat collector 100 and the heat generating device 1
Since the pressure resistant structure of 20 can be simplified and the pumps 10a and 10b having a relatively small discharge pressure can be employed, the manufacturing cost of the heat collector 100 can be reduced and the heat generating device 120 can be stabilized. Can be cooled to.

(Tenth Embodiment) In the eighth and ninth embodiments, the center line CL of the protrusion 113 and the center line CL of the heating element 121 are substantially coincident with each other (see FIG. 19). 21, when viewed from the protrusion 113 side, that is, from the arrow A, the protrusion 113 and the heating element 121.
When projected onto an imaginary plane S parallel to the flow of the heat medium (in particular, refer to FIG. 21B), a heating element is provided on the heat medium flow downstream side of the end portion 113b of the protrusion 113 on the heat medium flow downstream side. The center line CL of the heating element 121 is shifted to the downstream side of the heat medium flow with respect to the center line CL of the protrusion 113 so that the end 121 a of the heat medium flow downstream side 121 is positioned.

As a result, the reverse flow can be made to collide with the portion of the heat collecting diaphragm 101 corresponding to the heat generating element 121 without fail, so that the heat of the heat generating element 121 can be more reliably discharged from the heat radiating surface 122a. The heat can be radiated to the 101 side.

(Eleventh Embodiment) This embodiment is shown in FIG.
As shown in FIG. 27, a plurality of protrusions 101a are provided on the heat collecting diaphragm 101 on the side that comes into contact with the heat medium.

As a result, the flow of the heat medium is further disturbed and the heat transfer area of the heat medium with the heat collecting diaphragm 101 is increased, so that the heat transfer from the heat radiating surface 122a to the heat collecting diaphragm 101 is promoted. As a result, the heating element 121 can be cooled reliably.

In the example shown in FIG. 27, the protrusion 113
Of the above, by rounding or chamfering the corner portion 113c in the heat medium flow direction, it is possible to prevent generation of a vortex that induces a pressure loss on the downstream side of the protrusion 113, and to prevent heat in the pressure chamber 102. This is intended to reduce the pressure loss of the medium. Incidentally, FIG. 28 is a perspective view of FIG.

(Twelfth Embodiment) In the eighth to tenth embodiments, the flow velocity of the heat medium is increased by reducing the gap 113a, but in the present embodiment, as shown in FIG.
The second protrusion 113d is provided to reduce the heat medium passage so that the heat medium collectively flows to the portion corresponding to the heating element 121.

As a result, the heating element 121 can be cooled reliably.

(Thirteenth Embodiment) This embodiment is shown in FIG.
As shown in FIG. 4, when a plurality of heat collectors 100 are provided, a fixed throttle 104d that generates a predetermined pressure loss is provided on the heat medium outlet side of each pressure chamber 102, and each pressure is reduced by the weight of the stored fluid. Reserve tank 1 for applying a predetermined fluid pressure (static pressure) to the heat medium outlet side of the chamber 102
30 is provided.

Here, the height of the reserve tank 130 and the heat medium amount are such that the heat collecting diaphragm 101 contacts the heat radiating surface 122a when the fluid pressure by the pumps 10a and 10b does not act on the heat collecting diaphragm 101. The height and the amount of heat medium are such that a pressure that does not occur is generated in the pressure chamber 102.

Next, the function and effect of this embodiment will be described.

In the case of having a plurality of heat collectors 100, a specific heat-generating device 12 of the plurality of heat collectors 100 is used.
Even if the electromagnetic valve 104a on the heat medium inlet side is closed for repair and replacement of No. 0, the heat medium outlet side communicates with the other heat collectors 100. Therefore, the heat medium outlet side of the pressure chamber 102 described above. Fixed diaphragm 104d and reserve tank 13
When there is no 0, the pressure in the pressure chamber 102 does not decrease,
The heat collecting diaphragm 101 remains in contact with the heat radiation surface 122a.

On the other hand, in this embodiment, the pressure chamber 1
Since the fixed throttle 104d and the reserve tank 130 are provided on the heat medium outlet side of No. 02, when the electromagnetic valve 104d on the heat medium inlet side is closed, the pressure inside the pressure chamber 102 and the pressure on the heat medium outlet side are set by the reserve tank 130. It becomes the set pressure.

At this time, the heat medium outlet side communicates with the other heat collectors 100, but since the fixed throttle 104d is provided on the heat medium outlet side, the pressure in the pressure chamber 102 with the electromagnetic valve 104a closed is Does not rise.

Therefore, by closing the solenoid valve 104a, the heat-collecting diaphragm 101 can be reliably released from the heat radiating surface 12.
Since it can be separated from 2a, the specific heat generating device 120
The repair and replacement can be easily performed.

Further, since the fixed throttle 104d suppresses the fluid pressure from sneaking in from the other pressure chamber 102, the pumps 10a and 10b are not stopped, that is, the cooling of the other heat-generating device 120 is not stopped. Heating device 1
20 can be repaired and replaced.

If the position of the reserve tank 130 is located above the pressure chamber 102, the air in the pressure chamber 102 can be easily evacuated.

Also, in this embodiment, the reserve tank 1
Although the atmospheric pressure is applied to the pressure chamber 102 by opening 30 to the atmosphere, the present embodiment is not limited to this, and a predetermined pressure may be applied to the pressure chamber 102 by, for example, a weight.

(Other Embodiments) The heating element 121
Are not limited to those shown in the above-mentioned embodiments, and include, for example, rectifiers, transformers, electric converters, electric devices, electronic devices, radio wave amplifiers, radio wave transmitters, inverters,
Electric devices such as power modules, capacitors, heaters, fuel cells, semiconductor devices, batteries, etc. are conceivable.

Further, the heat medium is not limited to those shown in the above-mentioned embodiments, and for example, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as Fluorinert, and fluorocarbons such as HCFC123 and HFC134a. Based refrigerants, alcohol refrigerants such as methanol and ethanol, ketone refrigerants such as acetone, etc. are considered.

Further, although the present invention has been described in the above embodiment by taking the portable telephone base station as an example, the present invention is not limited to this, and it includes buildings, basements, factories, warehouses, houses, garages and vehicles. Applicable to cooling multiple types of heating elements (for example, gas turbine engine, gas engine, diesel engine, gasoline engine, fuel cell, electronic equipment, electrical equipment, electrical converter, storage battery, etc.) can do.

Further, in the above-described embodiment, one heat collector 100 is provided for a plurality of (for example, two) heat generating elements 121, but the present invention is not limited to this.
If the number corresponding to each of the plurality is provided, only the heat collector 100 corresponding to the heating element 121 to be repaired or replaced needs to be removed, so that the workability of repairing or replacing can be improved.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a cooling system according to an embodiment of the present invention.

FIG. 2 shows a heat collector according to the first embodiment of the present invention,
(A) is a perspective view showing a state in which a heat collector is attached to a heat-generating device to which a heating element is attached, and (b) is a cross-sectional view showing a state in which the heat collector is attached to the heat-generating device.

FIG. 3 is a schematic diagram showing a heat medium flow in a first basic operation mode according to the first embodiment of the present invention.

FIG. 4 is a schematic diagram showing a heat medium flow in a second basic operation mode according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram showing a heat medium flow in a superheat operation mode according to the first embodiment of the present invention.

FIG. 6 is a schematic diagram showing a heat medium flow in a superheat operation mode according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram showing a heat medium flow in a low heat operation mode according to the first embodiment of the present invention.

FIG. 8 is a schematic diagram showing a heat medium flow in a low heat operation mode according to the first embodiment of the present invention.

FIG. 9 is a schematic diagram showing a heat medium flow in a direct cooling mode according to the first embodiment of the present invention.

FIG. 10 is a perspective view showing a state where the heat collector according to the second embodiment of the present invention has a heat collector attached to a heat-generating device having a heating element, and FIG. It is sectional drawing which shows the state which attached the heat collector to the apparatus.

FIG. 11A is a perspective view showing a state in which a heat collector is attached to a heat generating device to which a heating element is attached, and FIG. 11B is a heat collector according to the third embodiment of the present invention; It is sectional drawing which shows the state which attached the heat collector to the apparatus.

FIG. 12 is a perspective view showing a state where the heat collector according to the fourth embodiment of the present invention has a heat collector mounted on a heat-generating device having a heating element mounted thereon, and FIG. It is sectional drawing which shows the state which attached the heat collector to the apparatus.

FIG. 13 is a perspective view showing a state in which a heat collector according to a fifth embodiment of the present invention has a heat collector mounted on a heat-generating device having a heating element, and (b) shows heat generation; It is sectional drawing which shows the state which attached the heat collector to the apparatus.

FIG. 14A is a perspective view showing a state in which a heat collector is attached to a heat-generating device having a heat-generating body, and FIG. 14B shows heat generation in a heat collector according to a sixth embodiment of the present invention. It is sectional drawing which shows the state which attached the heat collector to the apparatus.

FIG. 15 (a) is a perspective view showing a state in which a heat collector is attached to a heat-generating device having a heating element attached thereto, and (b) shows heat generation in the heat collector according to the seventh embodiment of the present invention. It is sectional drawing which shows the state which attached the heat collector to the apparatus.

16A and 16B are perspective views showing a state in which a heat collector is attached to a heat generating device to which a heat generating element is attached, and FIG. 16B is a heat collector according to a seventh embodiment of the present invention. It is sectional drawing which shows the state which attached the heat collector to the apparatus.

FIG. 17 is a schematic diagram of a heat collector according to an eighth embodiment of the present invention.

FIG. 18 is a perspective view of a heat collector according to an eighth embodiment of the present invention.

FIG. 19 is a partially enlarged view of the heat collector according to the eighth embodiment of the present invention.

FIG. 20 is a schematic diagram of a heat collector according to a ninth embodiment of the present invention.

FIG. 21 is a schematic view of a heat collector according to the tenth embodiment of the present invention.

FIG. 22 is a schematic diagram of a heat collector according to an eleventh embodiment of the present invention.

FIG. 23 is a schematic diagram of a heat collector according to an eleventh embodiment of the present invention.

FIG. 24 is a schematic view of a heat collector according to an eleventh embodiment of the present invention.

FIG. 25 is a schematic view of a heat collector according to an eleventh embodiment of the present invention.

FIG. 26 is a schematic view of a heat collector according to an eleventh embodiment of the present invention.

FIG. 27 is a perspective view of a heat collector according to an eleventh embodiment of the present invention.

FIG. 28 is a perspective view of a heat collector according to an eleventh embodiment of the present invention.

FIG. 29 is a perspective view of a heat collector according to the twelfth embodiment of the present invention.

FIG. 30 is an explanatory diagram of a cooling device according to a thirteenth embodiment of the present invention.

[Explanation of symbols]

100 ... Heat collector, 101 ... Diaphragm, 104a ... Solenoid valve, 120 ... Heating device, 121 ... Heating element.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideaki Sato             1-1, Showa-cho, Kariya city, Aichi stock market             Inside the company DENSO (72) Inventor Mitsuharu Inagaki             1-1, Showa-cho, Kariya city, Aichi stock market             Inside the company DENSO (72) Inventor Kazutoshi Nishizawa             1-1, Showa-cho, Kariya city, Aichi stock market             Inside the company DENSO (72) Inventor Seiji Inoue             1-1, Showa-cho, Kariya city, Aichi stock market             Inside the company DENSO F term (reference) 3L044 AA01 AA04 BA06 CA12 CA14                       DB01 DB02 DD07 FA02 FA04                       GA02 HA03 JA00 JA03 KA04                       KA05                 5E322 AA05 AA08 DA01 DA02

Claims (24)

[Claims] 1. A heat collector for collecting heat of a heat-generating device (120), the heat-collecting diaphragm (10) being displaced by a fluid pressure and being in contact with a heat-dissipating surface (122a) of the heat-generating device (120).
1) and the heat collecting diaphragm (101) are fixed, and a heat collector casing (103) constituting a pressure chamber (102) for applying a fluid pressure to the heat collecting diaphragm (101).
And a valve device (104) provided on the fluid introduction port side of the pressure chamber (102) for opening and closing a fluid passage. 2. The valve device (104), when the heat generation amount of the heat generating device (120) is less than a predetermined amount,
The heat collector according to claim 1, wherein the heat collector is configured to close the fluid passage. 3. The valve device (104) according to claim 1, wherein the valve device is configured to close the fluid passage when the fluid pressure becomes equal to or lower than a predetermined pressure. Collector. 4. The valve device (104) according to claim 1, wherein the valve device is configured to close the fluid passage when there is no energization signal of the heat generating device (120). The heat collector according to one. 5. A pump device (10a, 10b) for supplying a fluid to the pressure chamber (102) comprises:
5. It is configured to stop when the pressure in 2) becomes equal to or lower than a predetermined pressure.
The heat collector according to any one of 1. 6. A pump device (10a, 10b) for supplying a fluid to the pressure chamber (102) comprises the heat generating device (12).
The heat collector according to any one of claims 1 to 5, wherein the heat collector (0) is configured to stop when the amount of heat generated is equal to or less than a predetermined amount. 7. A pump device (10a, 10b) for supplying a fluid to the pressure chamber (102) comprises the heat generating device (12).
7. The heat collector according to claim 1, wherein the heat collector is configured to stop when there is no energization signal of 0). 8. A heat collector for collecting heat radiated by a heat generating device (120), which constitutes a pressure chamber (107) whose internal pressure is changed by receiving heat from the heat generating device (120), Room (1
08) and the heat-dissipating diaphragm (108) that is displaced according to the pressure in the heat-dissipating diaphragm (108) and the heat-dissipating diaphragm (108) when the pressure in the pressure chamber (107) is increased and the heat-dissipating diaphragm (108) is displaced. ) And a heat collecting plate (109) in contact with the heat collecting plate. 9. A valve device (104) for opening and closing a fluid passage through which a fluid for collecting heat collected in the heat collecting plate (109) flows is provided.
The heat collector described in 1. 10. The valve device (104) is configured to close the fluid passage when the fluid pressure falls below a predetermined pressure.
The heat collector described in 1. 11. A pump device (10a, 10a) for circulating a fluid for recovering the heat collected in the heat collecting plate (109).
b), wherein the pump device (10a, 10b) is configured to stop when the fluid pressure falls below a predetermined pressure. The heat collector according to one. 12. A pump device (10a, 10a) for circulating a fluid for recovering the heat collected in the heat collecting plate (109).
b), and the pump device (10a, 10b) is configured to stop when the amount of heat generated by the heat generating device (120) is less than or equal to a predetermined amount. Item 12. The heat collector according to any one of items 8 to 11. 13. A heat collector for collecting the heat of a heat generating device (120) by bringing a diaphragm (101, 108) that is displaced according to an internal pressure into contact with a heat transfer surface (122a, 109), the diaphragm (101). , 108) is provided with an enclosed space (110) outside, and the pressure in the enclosed space (110) is reduced to cause the heat transfer surfaces (122a, 109).
A heat collector characterized in that the diaphragm and the diaphragm (101, 108) are closely attached. 14. The structure is configured such that, after reducing the pressure in the closed space (110), at least a fluid having a higher thermal conductivity than air can be filled in the closed space (110). The heat collector according to claim 3. 15. A cooling device for cooling a heating device (120) comprising a plurality of heating elements (121), the number of which corresponds to each of the plurality of heating elements (121). The heat collector (100) according to any one of claims 1 to 10, wherein the heat of the (121) is collected.
And a cooling means (4) for collecting and cooling the heat collected in the heat collector (100). 16. Positioning means (131, 1) for determining the positions of said heat generating device (120) and said heat collector (100).
16. Cooling device according to claim 15, characterized in that it comprises a base member (106) provided with 32). 17. A heat collector for collecting heat of a heat generating device (120), the heat radiating surface (12) of the heat generating device (120) receiving a fluid pressure.
2a) which is in contact with the heat collecting diaphragm (101), and which faces the heat collecting diaphragm (101) and is located on the opposite side of the heat radiating surface (122a) with the heat collecting diaphragm (101) interposed therebetween. Placed and protruding (113)
And a heat collector inner surface structure (114) having a heat collector. 18. The heat collector according to claim 17, wherein the heat collecting diaphragm (101) is a thin film having no unevenness. 19. The clearance dimension (Δ1) between the heat collecting diaphragm (101) and the tip of the protrusion (113) is
It is 1 mm or less, 17 or 18 characterized by the above-mentioned.
The heat collector described in 1. 20. A plurality of the protrusions (113) are provided at a predetermined interval in the fluid flow direction, and the protrusions (113) are substantially parallel to the fluid flow direction. The outer dimension (L1) of a portion of the heat generating element (121) is smaller than the outer dimension (L2) of a portion of the heat generating element (121) substantially parallel to the flow direction of the fluid.
The heat collector according to any one of 7 to 19. 21. When the projection (113) and the heating element (121) are viewed from the projection (113) side,
Of the protrusion (113), the end (1
13b) downstream of the fluid flow, the heating element (121)
21. An end portion (121a) on the downstream side of the fluid flow is located, of the above.
Collector described in one. 22. The heat collector according to claim 17, wherein the fluid is configured to flow so as to be concentrated in a portion corresponding to the heating element (121). . 23. A cooling device for cooling a heat generating device (120) comprising a plurality of heat generating elements (121), wherein the heat generating device (120) is displaced by being subjected to fluid pressure and is dissipated on a heat dissipation surface (122a) of the heat generating device (120). Contact heat collecting diaphragm (10
1), a heat collector casing (1) in which the heat collecting diaphragm (101) is fixed to form a pressure chamber (102) for applying a fluid pressure to the heat collecting diaphragm (101)
03), an opening / closing valve (104a) provided on the fluid inlet side of the pressure chamber (102) to open and close a fluid passage, and a predetermined pressure loss provided on the fluid outlet side of the pressure chamber (102). A plurality of heat collectors (10) having a throttling means (104d) for generating and collecting the heat of the heating element (121).
0) and a predetermined fluid pressure that is provided on the fluid outlet side of the plurality of heat collectors (100) and is such that the heat collecting diaphragm (101) does not contact the heat radiation surface (122a). A cooling device comprising a fluid pressure generating means (130). 24. The cooling apparatus according to claim 23, wherein the fluid pressure generating means is a reserve tank that generates the predetermined fluid pressure by the weight of the stored fluid.