JPH06221738A - Electronic refrigerating and heating plant - Google Patents

Abstract

PURPOSE:To improve heat transmission between an element mounting plate of a radiator and an operative fluid inside the radiator and to enable the radiator to resist against inside pressure due to the operative fluid. CONSTITUTION:An electronic refrigerating and heating plant is provided with a thermionic element 5 to make a heat pump operation corresponding to power supply conditions between the inside and the outside of the plant, and also a heat pipe type radiator 7 to radiate heat of the thermionic element 5 to the outside of the plant. In the radiator 7, an operative fluid passage is shaped in a grid in a radiating part 7e and enlarged in a flat plane in a heat absorbing part 7f which contacts with the thermionic element 5. Further an element mounting plate 7c is connected to one side surface of the heat absorbing part 'If and a reinforcing plate 7g is connected to the other side surface and the thermionic element 5 is mounted on the element mounting plate 7c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cold storage for cooling or heating by energizing a semiconductor thermoelectric element.
Its application is widely applicable to automobiles, households and the like.

[0002]

2. Description of the Related Art A conventional cold storage cabinet of this type is shown in FIGS. The cold storage shown is a main body 2 with an open top.
And a lid 3 for closing the opening of the main body 2. An object to be cooled (heated) is accommodated in the inside space 1a formed by the heat insulating box 1 to cool (heat) it. Insulation wall 2 of this insulation box 1
An outside space 1b is provided outside a. The outside space 1b is partitioned by an enclosure plate 10 having an inlet 10b and an outlet 10a, and communicates with the atmosphere. The semiconductor thermoelectric element 5 is provided in contact with the heat conduction block 6 installed in the opening of the heat insulating wall 2a. This semiconductor thermoelectric element 5 has an inside heat collecting plate 5a facing the inside space 1a and an outside heat collecting plate 5b facing the outside space 1b. This semiconductor thermoelectric element 5 is made of, for example, Bi ₂ Te ₃ —Bi ₂ Se ₃ alloy, Sb ₂ T.
It is made of a semiconductor such as e ₃ -Bi ₂ Te ₃ alloy, and when the inner heat collecting plate 5a absorbs heat (radiates heat) depending on the direction of current flow, the outer heat collecting plate 5b releases heat (absorbs). It is something to do. Both of the heat collecting plates 5a and 5b are formed of a material having the highest heat conductivity in the electric insulating material, such as alumina ceramics. The tank wall 4 corresponding to the inner wall of the main body 2 is formed of a good heat conductor having a plate thickness of about 1.0 to 2.0 mm, such as an aluminum plate, and the main body 2 is formed by insert molding or the like.
Is stuck to. The tank wall 4 also serves as a cooling (heating) plate. On the other hand, in order to cool (heat) the tank wall 4 and the inside space 1a surrounded by the tank wall 4 to a low temperature (high temperature), the tank wall 4 is closely attached to the heat conduction block 6 and the semiconductor thermoelectric element 5 The inside heat collecting plate 5a is in close contact with the heat conducting block 6 made of metal such as aluminum, and the outside heat collecting plate 5b is in close contact with the radiator 7. Heat is conducted between the inside-side heat collecting plate 5a of the semiconductor thermoelectric element 5 and the tank wall 4 via the heat conduction block 6, while heat conduction between the outside-side heat collecting plate 5b and the radiator 7. Done. In order to improve heat transfer, the heat conduction block 6 and the radiator 7 are fastened with screws to sandwich the semiconductor thermoelectric element 5 therebetween, while the heat conduction block 6 is also fastened with screws to the tank wall 4 to be integrated. It is fixed to the target. Further, the radiator 7 uses forced air blowing by the fan 8 and has a heat absorbing portion 7f adjacent to the outer heat collecting plate 5b of the semiconductor thermoelectric element 5 and a heat radiating portion 7e adjacent to the heat radiating fin 7b. The radiator 7 is a roll-bond type heat pipe having a plate thickness of about 1.6 mm, which is formed by rolling and pressure bonding. Further, the heat absorbing portion 7f of the heat pipe is not provided with the heat radiating fins 7b, and only the heat radiating portion 7e is provided with the heat radiating fins 7b.
The working fluid passages between e and e are provided in a grid pattern so that the temperature of each part is made uniform, and the fins 7b for heat radiation are joined to the heat radiation part 7e with a brazing material having good heat conduction. There is.
Similarly, the element mounting plate 7c is joined to the heat absorbing portion 7f. A packing 9 is attached between the back surface of the element mounting plate 7c and the main body 2 so as to surround the heat conduction block 6, and performance deterioration or semiconductor thermoelectricity due to dew condensation on the heat conduction block 6 or the semiconductor thermoelectric element 5 portion during cooling. The element 5 is waterproof. The roll-bonding method for forming the grid-like passages is that a circuit is printed on one plate with a pressure-preventing agent, and then the plates are stacked and rolled and pressure-bonded. After that, it is a manufacturing method in which the circuit is expanded with high-pressure air. Therefore, the plate thickness of 1.6 mm mentioned here refers to the final plate thickness obtained by pressure bonding two plate materials by the roll bonding method.

Next, the operation will be described. Cold storage (hot storage)
When the switch is turned ON, the heat pump action (heat pump action and self-heating) of the semiconductor thermoelectric element 5 cools (heats) the inside heat collecting plate 5a from the inside heat collecting plate 5a to the heat conducting block 6 in that order (warming), Decrease (increase) temperature. At the same time, the heat absorbing portion 7f of the radiator 7 is heated (cooled) by the heat transfer amount from the inside of the storage and the heat generation amount (heat absorption amount) of the semiconductor thermoelectric element 5 by the heat storage plate 5b outside the storage. Thus, during the refrigerating operation, the working fluid 7a enclosed in the passage portion of the radiator 7 is vaporized and vaporized by the heat absorbing portion 7f and serves to carry the heat to the heat radiating portion 7e. This heat is radiated to the atmosphere from the fins 7b formed in the heat radiating portion 7e by forced blowing by the fan 8, the working fluid 7a is condensed and liquefied, and returns to the heat absorbing portion 7f by gravity or the capillary force of the wick, Repeat the cycle of carrying heat again. In addition, direct heat radiation from the surfaces of the heat radiating portion 7e and the heat absorbing portion 7f is also performed by a small amount due to heat transfer through the plate material (about 1.6 mm) itself constituting the radiator 7. As a result, the temperature inside the refrigerator is lower than the outdoor temperature up to the specified temperature difference which is the capacity setting value of the semiconductor thermoelectric element 5, and the refrigerated state is maintained. When used as a warm storage, the radiator 7 is cooled by the amount of heat transferred to the inside by the outside heat collecting plate 5b, and the working fluid inside the radiator 7 does not operate, so heat from the atmosphere does not flow. The fan 8 forcibly blows air to the fins 7b, transmits the heat to the outside heat collecting plate 5b through the plate material (about 1.6 mm) of the radiator 7, collects heat from the outside, and is attached to the heat conduction block 6. Do not use the thermal switch to keep energizing / de-energizing to keep the temperature at the set temperature.

[0004]

During the refrigerating operation, the inside heat collecting plate 5a of the semiconductor thermoelectric element 5 is a cooling surface, and the outside heat collecting plate 5 is inside.
The heat transfer inside the semiconductor thermoelectric element 5 is from b inside to outside of the cabinet. The semiconductor thermoelectric element 5 usually has a power consumption of about 100 W within a 50 mm × 50 mm square, and the heat absorption amount from the inside of the refrigerator is also added to 120-
It requires heat dissipation of 130 W or more. However,
In the above-mentioned conventional technique, there is a problem during refrigeration that heat transfer from the element mounting plate 7c to the working fluid 7a is insufficient, the temperature of the outside heat collecting plate 5b is not sufficiently lowered, and high cooling performance cannot be obtained. there were.

The present invention has been made in order to solve the above-mentioned problems, and the element mounting plate 7c of the radiator provided for improving the adhesion with the outside heat collecting plate 5b during refrigeration. It is intended to improve the heat transfer with the working fluid inside the radiator and to withstand the radiator against the internal pressure of the working fluid.

[0006]

An electronic cold storage according to the present invention has a thermoelectric element that acts as a heat pump between the inside and the outside of the refrigerator depending on the energization state, and the outside of the refrigerator to dissipate this heat. In an electronic cold storage equipped with a heat pipe type radiator, the heat pipe type radiator has a planarly enlarged passage of the working fluid in the heat absorbing portion in contact with the thermoelectric element, and the passage of the working fluid in the heat radiating portion is Made in a grid,
Further, the area of the heat radiating portion is larger than the area of the heat absorbing portion, the element mounting plate is joined to one side surface of the heat absorbing portion, and the reinforcing plate is joined to the other side surface of the heat absorbing portion, and the element mounting plate is attached to the element mounting plate. The thermoelectric element is attached.

[0007]

According to the present invention, when the high heat of the outside heat collecting plate due to the self-heating of the semiconductor thermoelectric element during the refrigerating operation and the heat absorption from the inside of the refrigerator is transmitted to the radiator, the heat of the element mounting plate is planar. The large working fluid is efficiently transmitted to the working fluid enclosed in the space in the passage, and this working fluid spreads quickly over the entire surface of the radiator, so that heat is quickly diffused and the temperature distribution of the radiator is The difference is equalized to 3 ° C. or less. Thus, the temperature of the heat collecting plate on the outside of the refrigerator of the semiconductor thermoelectric element becomes lower than before, and the refrigerating performance is improved. In addition, the decrease in withstand pressure against the filling pressure of the working fluid in this part due to the enlargement of the working fluid passage in the heat absorbing part is reinforced by the reinforcing plate provided on the opposite side of the element mounting plate, The above pressure resistance can be realized at low cost and with little increase in weight.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Since the basic structure other than the radiator is the same as that of the conventional example, it is omitted, and only the radiator will be described. FIG. 1 is a sectional view showing an electronic cold storage according to an embodiment of the present invention. FIG. 2 is a plan view of the radiator 7 which is a feature of the present invention. FIG. 3 shows a side view of the radiator 7 of FIG. 2 and also shows accessories. FIG. 4 is a sectional view taken along line IV-IV in FIG. The radiator 7 includes a heat collecting plate 5b on the outside of the refrigerator and a heat radiating portion 7
It is a roll-bond type heat pump that is provided with e and includes working fluid 7a and has a plate thickness of about 1.6 mm by rolling and pressure bonding. Further, the heat radiating fin 7b is provided on the heat absorbing portion 7f of the heat pipe.
The heat dissipating fins 7b are provided only in the heat dissipating portion 7e. A feature of the present invention is that the working fluid passage in the heat absorbing portion 7f is made large in a plane shape to increase the heat transfer area from the element mounting plate 7c to the working fluid 7a (see FIG. 4). The working fluid passage in the heat radiating portion 7e is the heat absorbing portion 7
The heat-dissipating fins 7b are joined to the heat-dissipating portion 7e with a brazing material or the like having good heat conduction. An element mounting plate 7 for mounting the semiconductor thermoelectric element 5 on one side surface of the heat absorbing portion 7f.
c is joined, and a reinforcing plate 7g is joined to the surface on the opposite side. This allows the expansion tube portion, which is enlarged in the above-mentioned plane, to withstand the internal pressure of the working fluid.

Next, the operation will be described. Cold storage (hot storage)
When the switch is turned ON, the heat pump action (heat pump action and self-heating) of the semiconductor thermoelectric element 5 cools (heats) the inside heat collecting plate 5a to the heat conduction block 6 and then the tank wall 4 in that order. Decrease (increase) temperature. On the contrary, the heat absorbing portion 7f of the radiator 7 is heated (cooled) by the heat transfer amount from the inside of the storage and the heat generation amount (heat absorption amount) of the semiconductor thermoelectric element 5 by the heat collection plate 5b outside the storage. At this time, since the contact surface between the element mounting plate 7c of the radiator 7 and the working fluid 7a is sufficiently larger than before (see FIG. 4), and the amount of working fluid retained in this portion is large, a large amount of heat is generated during refrigeration operation. Is transmitted to the heat absorber 7f of the radiator 7. Then, the working fluid 7a sealed in the passage portion is vaporized and vaporized by the heat absorbing portion 7f and carries more heat to the heat radiating portion 7e than before, and is condensed and liquefied by the heat radiating portion 7e. The heat radiated there is radiated to the atmosphere by forced air blowing by the fan 8 through the fins 7b formed on the heat radiating portion 7e. The condensed and liquefied working fluid 7a returns to the heat absorbing portion 7f by gravity or the capillary force of the wick, and repeats the cycle of carrying heat again. on the other hand,
Direct heat dissipation (direct heat dissipation from the surfaces of the heat dissipation part 7e and the heat absorption part 7f) through the plate material (about 1.6 mm) of the heat dissipation device 7 itself is also carried out though it is a small amount. Due to these heat conduction effects, the internal cold storage temperature becomes lower than the external cold storage temperature up to the specified temperature difference which is the capacity setting value of the semiconductor thermoelectric element 5, and the cold storage state is maintained. During the warming operation, the heat absorbing portion 7f of the radiator 7 is cooled by the amount of heat transferred to the inside of the refrigerator by the semiconductor thermoelectric element 5. Therefore, the working fluid inside the radiator does not work. But radiator 7
The semiconductor thermoelectric element 5 is kept in a warmed state so that heat is replenished from the atmosphere through the plate material (about 1.6 mm) and the temperature is set by a thermal switch (not shown) mounted on the heat conduction block 5b. maintain.

[0010]

As described above, according to the present invention, only the element mounting plate of the radiator for mounting the semiconductor thermoelectric element of the electronic cold storage has a large passage for the working fluid, and the other portions have this area. Since the working fluid passages are provided in a smaller grid and the reinforcing plate is joined to the element side of this element mounting part by brazing, the contact surface between the element mounting plate of the radiator and the working fluid is more sufficient than before. Since the working fluid is large and the amount of working fluid accumulated in this portion is large, the working fluid enclosed in this passage is vaporized and vaporized in this heat absorbing portion during refrigeration, and carries more heat to the heat radiating portion than in the conventional cooling fan. The heat is radiated extremely efficiently by the forced air flow, and the temperature of the outside heat collecting plate of the semiconductor thermoelectric element becomes lower than before,
The refrigeration performance can be improved. In addition, even if the working fluid passage of the element mounting part is enlarged in a planar shape, the pressure resistance of this portion against the filling pressure of the working fluid is also reduced by this reinforcing plate, and the pressure resistance equal to or higher than the conventional pressure is reduced. It can be realized at low cost with little weight increase.

[Brief description of drawings]

FIG. 1 is a schematic structural diagram of an electronic cold storage according to an embodiment of the present invention.

FIG. 2 is a front view of a main body of a roll bond type heat pipe showing a working fluid passage of a radiator in the electronic cold storage of FIG.

FIG. 3 is a right side view of the radiator shown in FIG.

4 is a cross-sectional view taken along the line IV-IV of the radiator of FIG.

FIG. 5 is a schematic structural diagram of a conventional electronic cold storage.

6 is a front view of a main body of a roll bond type heat pipe showing a working fluid passage of a radiator in the electronic cold storage of FIG.

FIG. 7 is a right side view of the radiator shown in FIG.

8 is a sectional view of the radiator of FIG. 5, taken along the line VIII-VIII.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulation box 1a Inside space 1b Outside space 2 Main body 2a Insulation wall 3 Lid 4 Tank wall 5 Thermoelectric element 5a Inside heat collecting plate 5b Outside heat collecting plate 6 Heat conduction block 7 Radiator 7a Working fluid 7b Fin 7c Element mounting plate 7e Heat dissipation part 7f Heat absorption part 7g Reinforcement plate 8 Fan 9 Packing 10 Enclosure plate 10a Air outlet 10b Suction port

Claims (1)

[Claims] 1. An electronic refrigerating and refrigerating system comprising: a thermoelectric element, which acts as a heat pump depending on the energization state, between the inside and the outside of the refrigerator; and a heat pipe type radiator on the outside of the refrigerator to dissipate this heat. In this case, this heat pipe type radiator has a large passage for the working fluid in the heat absorbing portion which is in contact with the thermoelectric element, the passage for the working fluid in the heat radiating portion has a lattice shape, and the area of the heat radiating portion absorbs heat. Is larger than the area of the heat absorbing portion, the element mounting plate is joined to one side surface of the heat absorbing portion, and the reinforcing plate is joined to the other side surface of the heat absorbing portion,
An electronic cold storage, wherein the thermoelectric element is attached to the element mounting plate.