JPH0369274U - - Google Patents
Info
- Publication number
- JPH0369274U JPH0369274U JP13077089U JP13077089U JPH0369274U JP H0369274 U JPH0369274 U JP H0369274U JP 13077089 U JP13077089 U JP 13077089U JP 13077089 U JP13077089 U JP 13077089U JP H0369274 U JPH0369274 U JP H0369274U
- Authority
- JP
- Japan
- Prior art keywords
- male mold
- integrated circuit
- hybrid integrated
- case lid
- female hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 230000013011 mating Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案実施例の組立構造を示す断面図
、第２図は第１図におけるクリツプ雄型の配置斜
視図、第３図は嵌め合い式クリツプの拡大断面図
、第４図はクリツプ雄型の配置に関する応用実施
例の斜視図、第５図は従来構造の断面図である。
図において、１……基板、３……電子部品、４
……外部引出しリード、５……ケーク蓋、７……
雄型、９……雌穴。
Fig. 1 is a sectional view showing the assembly structure of the embodiment of the present invention, Fig. 2 is a perspective view of the arrangement of the male clip in Fig. 1, Fig. 3 is an enlarged sectional view of the mating type clip, and Fig. 4 is the clip. FIG. 5 is a perspective view of an applied embodiment regarding the arrangement of the male die, and a sectional view of a conventional structure. In the figure, 1... board, 3... electronic component, 4
... External drawer lead, 5 ... Cake lid, 7 ...
Male type, 9...female hole.
Claims (1)
装した回路組立体に体してケース蓋を被着した混
成集積回路のパツケージであつて、基板の上面に
嵌め合い式クリツプの雄型を取付け、かつケース
蓋の内面側には前記雄型と嵌合し合う雌穴を形成
し、雄型を雌穴に嵌合して基板とケース蓋とを結
合したことを特徴とする混成集積回路のパツケー
ジ。 A hybrid integrated circuit package consisting of a circuit assembly in which electronic components and external lead leads are mounted on a board and a case lid attached to the circuit assembly. A package for a hybrid integrated circuit, characterized in that a female hole is formed on the inner surface of the lid to fit into the male mold, and the male mold is fitted into the female hole to connect the substrate and the case lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13077089U JPH0369274U (en) | 1989-11-09 | 1989-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13077089U JPH0369274U (en) | 1989-11-09 | 1989-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369274U true JPH0369274U (en) | 1991-07-09 |
Family
ID=31678320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13077089U Pending JPH0369274U (en) | 1989-11-09 | 1989-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369274U (en) |
-
1989
- 1989-11-09 JP JP13077089U patent/JPH0369274U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0369274U (en) | ||
| JPS63100889U (en) | ||
| JPS63178374U (en) | ||
| JPS63178315U (en) | ||
| JPS6437057U (en) | ||
| JPS63469U (en) | ||
| JPS6344475U (en) | ||
| JPS6191879U (en) | ||
| JPH0410379U (en) | ||
| JPS6416640U (en) | ||
| JPS63137954U (en) | ||
| JPS58106999U (en) | shield case | |
| JPS6373944U (en) | ||
| JPS63172082U (en) | ||
| JPH0444174U (en) | ||
| JPH0231138U (en) | ||
| JPH03126071U (en) | ||
| JPH0359671U (en) | ||
| JPS6393696U (en) | ||
| JPH0467350U (en) | ||
| JPH03101544U (en) | ||
| JPS62158838U (en) | ||
| JPH0339876U (en) | ||
| JPH03124679U (en) | ||
| JPS59101481U (en) | Electrical component mounting structure |