JPH0369128A - Sealing of electronic component - Google Patents
Sealing of electronic componentInfo
- Publication number
- JPH0369128A JPH0369128A JP20625489A JP20625489A JPH0369128A JP H0369128 A JPH0369128 A JP H0369128A JP 20625489 A JP20625489 A JP 20625489A JP 20625489 A JP20625489 A JP 20625489A JP H0369128 A JPH0369128 A JP H0369128A
- Authority
- JP
- Japan
- Prior art keywords
- aromatic
- resin
- sealed
- pps resin
- pps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 51
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 37
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 37
- 125000003118 aryl group Chemical group 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011256 inorganic filler Substances 0.000 claims abstract description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 8
- 239000004642 Polyimide Substances 0.000 claims abstract description 6
- 229920001721 polyimide Polymers 0.000 claims abstract description 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 5
- 239000004697 Polyetherimide Substances 0.000 claims abstract description 5
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 5
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 5
- 229920001601 polyetherimide Polymers 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 abstract description 21
- 239000002904 solvent Substances 0.000 abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 238000001746 injection moulding Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 2
- 239000007822 coupling agent Substances 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 229910000077 silane Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 238000003780 insertion Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 35
- 239000003960 organic solvent Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 11
- 238000005406 washing Methods 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 238000010306 acid treatment Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000007385 chemical modification Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- -1 methyl ethyl Chemical group 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000012765 fibrous filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 241000270298 Boidae Species 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004963 Torlon Substances 0.000 description 1
- 229920003997 Torlon® Polymers 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- VHHHONWQHHHLTI-UHFFFAOYSA-N hexachloroethane Chemical compound ClC(Cl)(Cl)C(Cl)(Cl)Cl VHHHONWQHHHLTI-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- IWELDVXSEVIIGI-UHFFFAOYSA-N piperazin-2-one Chemical class O=C1CNCCN1 IWELDVXSEVIIGI-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はポリフェニレンスルフィド樹脂とリード線との
高温、高湿下での密着性を改善した電子部品の封止方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for sealing electronic components that improves the adhesion between a polyphenylene sulfide resin and a lead wire under high temperature and high humidity conditions.
〈従来の技術〉
ポリフェニレンスルフィド樹脂(以下、PP5vIJ脂
と称する〉は、耐薬品性、電気的特性および機械的強度
に優れており、電気・電子部品や自動車部品として幅広
く利用されている。<Prior Art> Polyphenylene sulfide resin (hereinafter referred to as PP5vIJ resin) has excellent chemical resistance, electrical properties, and mechanical strength, and is widely used as electrical/electronic parts and automobile parts.
また、近年、ppstm脂は電子部品封止、プリント基
板および電線被覆などの用途にも用いられてきており、
これらの用途では特に金属との密着性の優れていること
が要求されている。In addition, in recent years, ppstm resin has been used for applications such as electronic component sealing, printed circuit boards, and electric wire coatings.
In these applications, excellent adhesion to metals is particularly required.
このような金属との密着性が改善されたPP5v!J脂
としては、無機充填材とともにシランカップリング剤を
配合した組成物(特開昭52−52958号公報)が知
られている。PP5v has improved adhesion to such metals! As J fat, a composition containing a silane coupling agent together with an inorganic filler (Japanese Unexamined Patent Publication No. 52-52958) is known.
他方、電子部品の封止用途においては、リード線とPP
S樹脂との界面からの水の侵入を防止する目的で、リー
ド線を予めシランカップリング剤で処理したのち、PP
S樹脂で封止する方法(特開昭61−154135号公
報〉およびリード線に予めエポキシ接着剤を塗布したの
ちppss脂で封止する方法(特開昭61−11324
0号公報)などが知られている。On the other hand, in electronic component sealing applications, lead wires and PP
In order to prevent water from entering from the interface with the S resin, the lead wires are treated with a silane coupling agent in advance, and then the PP
A method of sealing with S resin (Japanese Patent Application Laid-Open No. 61-154135) and a method of applying epoxy adhesive to the lead wire in advance and then sealing with ppss resin (Japanese Patent Laid-Open No. 61-11324)
Publication No. 0) and the like are known.
〈発明が解決しようとする課題〉
しかし、特開昭52−52958号公報に記載される組
成物は、封止材料自体の耐湿性が向上しているものの、
リード線との密着性が不十分である。<Problems to be Solved by the Invention> However, although the composition described in JP-A-52-52958 has improved moisture resistance of the sealing material itself,
Adhesion to the lead wire is insufficient.
また、特開昭61−154135号公報に記載される封
止方法では、リード線との密着性改善効果はあるものの
、実用的なレベルに到達しているとはいえず、特開昭6
1−113240号公報に記載される方法では、エポキ
シ接着剤の耐熱性が低いために、高温高湿下での密着性
が不足しているなどの問題があった。Furthermore, although the sealing method described in JP-A-61-154135 has the effect of improving adhesion with lead wires, it cannot be said to have reached a practical level.
The method described in Japanese Patent No. 1-113240 has problems such as insufficient adhesion under high temperature and high humidity conditions due to the low heat resistance of the epoxy adhesive.
本発明者らは、上記のごとき状況に鑑み、電子部品にお
けるリード線とPPS樹脂の高温、高湿下での密着性を
改良する方法について鋭意検討した結果、リード線に特
定の耐熱性接着剤を塗布し、次いでPPS樹脂で封止す
る方法が有効であることを見出し本発明に到達した。In view of the above circumstances, the inventors of the present invention have conducted intensive studies on methods for improving the adhesion between lead wires and PPS resin in electronic components under high temperature and high humidity conditions. The present invention was achieved by discovering that a method of applying PPS resin and then sealing with PPS resin is effective.
く課題を解決するための手段〉
すなわち、本発明は電子部品をppstet脂で封止す
るに際し、リード線に対し芳香族ポリイミド、芳香族ポ
リアミドイミド、芳香族ポリエーテルイミドおよびビス
マレイミド樹脂のうちから選ばれた少なくとI:J1種
の耐熱性接着剤を塗布し、次いでこれを無機充填材を含
有するPPS樹脂で封止することを特徴とする電子部品
の封止方法を提供するものである。Means for Solving the Problems> That is, when sealing electronic parts with ppstet resin, the present invention uses aromatic polyimide, aromatic polyamideimide, aromatic polyetherimide, and bismaleimide resin for lead wires. The present invention provides a method for encapsulating electronic components, which comprises applying a heat-resistant adhesive of at least one selected type I:J, and then encapsulating it with a PPS resin containing an inorganic filler. .
本発明で用いるPPS樹脂とは、構造式モル%以上、よ
り好ましくは90モル%以上を含む重合体であり、上記
繰返し単位が70モル%未満では、耐熱性が損なわれる
ため好ましくない。The PPS resin used in the present invention is a polymer containing a structural formula of mol % or more, more preferably 90 mol % or more. If the repeating unit is less than 70 mol %, it is not preferable because heat resistance will be impaired.
またPPSはその@返し単位の30モル%未満を、下記
の構造式を有する繰返し単位などで構成することが可能
である。In addition, PPS can have less than 30 mol % of its @ repeating units composed of repeating units having the following structural formula.
本発明で使用するPPS樹脂としては、なかでも(1)
酸処理、(2)熱水洗浄または(3)有機溶媒洗浄を施
されたものあるいは(4)ナトリウム含有量が900p
pl以下であるものが本発明の効果がより一層発現され
るため好ましい。Among the PPS resins used in the present invention, (1)
Acid treated, (2) hot water washed or (3) organic solvent washed, or (4) sodium content 900p
pl or less is preferable because the effects of the present invention are further expressed.
以下これらの好ましいPP5v!J脂の処理方法につい
て説明する。These preferred PP5v below! The method for processing J fat will be explained.
まず、酸処理を行う場合は次のとおりである。First, the case of acid treatment is as follows.
酸処理の方法は、酸または酸の水溶液にPP5lill
脂を浸漬せしめるなどの方法があり、必要により適宜撹
拌または加熱することも可能である0例えば、酢酸を用
いる場合、pH4の水溶液を80〜90″Cに加熱した
中にPPS樹脂粉末を浸漬し、30分間撹拌することに
より十分な効果が得られる。酸処理を施されたPPS樹
脂は残留している酸または塩などを物理的に除去するた
め、水または温水で数回洗浄することが必要である。The acid treatment method involves adding PP5lill to an acid or an aqueous solution of an acid.
For example, when using acetic acid, PPS resin powder is immersed in a pH 4 aqueous solution heated to 80 to 90''C. , a sufficient effect can be obtained by stirring for 30 minutes.Acid-treated PPS resin needs to be washed several times with water or warm water to physically remove residual acids or salts. It is.
洗浄に用いる水は、酸処理によるPPS樹脂の好ましい
化学的変性の効果を損なわない意味で、蒸留水、脱イオ
ン水であることが好ましい。The water used for washing is preferably distilled water or deionized water in the sense that it does not impair the effect of chemical modification of the PPS resin by acid treatment.
次に、熱水で洗浄する場合は次のとおりである。すなわ
ちPPS樹脂を熱水処理するにあたり、熱水の温度を1
00″C以上、より好ましくは120℃以上、さらに好
ましくは150″C以上、特に好ましくは170°C以
上とすることが重要であり、100℃未満ではPPS樹
脂の好ましい化学的変性の効果が小さいため好ましくな
い。Next, the case of washing with hot water is as follows. In other words, when treating PPS resin with hot water, the temperature of the hot water is
It is important to set the temperature to 00"C or higher, more preferably 120"C or higher, even more preferably 150"C or higher, particularly preferably 170"C or higher. If it is lower than 100"C, the effect of the preferred chemical modification of the PPS resin will be small. Therefore, it is undesirable.
なお、熱水洗浄によるppsts脂の好ましい化学的変
性の効果を発現するため、使用する水は蒸留水あるいは
脱イオン水であることが好ましい、熱水処理の操作は、
通常、所定量の水に所定量のPPS樹脂を投入し、圧力
容器内で加熱、撹拌することにより行われる。PP5t
!I脂と水との割合は、水の多い方が好ましいが、通常
、水II!、に対し、pps樹脂200g以下の浴比が
選択される。In order to achieve the desired chemical modification effect of ppsts fat by hot water washing, the water used is preferably distilled water or deionized water.The hot water treatment operation is as follows:
Usually, this is carried out by adding a predetermined amount of PPS resin to a predetermined amount of water, and heating and stirring the same in a pressure vessel. PP5t
! Regarding the ratio of I fat to water, it is preferable to have more water, but usually water II! , a bath ratio of 200 g or less of pps resin is selected.
また、処理の雰囲気は、末端基の分解は好ましくな−い
ので、これを回避するため不活性雰囲気下とすることが
好ましい。さらに、この熱水処理操作を終えたPPS樹
脂は、残留している成分を物理的に除去するため温水で
数回洗浄するのが好ましい。Furthermore, since decomposition of terminal groups is undesirable, the treatment atmosphere is preferably an inert atmosphere to avoid this. Furthermore, the PPS resin that has undergone this hot water treatment is preferably washed several times with hot water in order to physically remove any remaining components.
また、有機溶媒で洗浄する場合は次のとおりである。Further, when washing with an organic solvent, the procedure is as follows.
PPS樹脂の洗浄に用いる有機溶媒は、PP5vfJ脂
を分解する作用などを有しないものであれば特に制限は
なく、例えばN−メチルピロリドン、ジメチルホルムア
ミド、ジメチルアセトアミド、1,3−ジメチルイミダ
ゾリジノン、ヘキサメチルホスホラスアミド、ピペラジ
ノン類などの含窒素極性溶媒、ジメチルスルホキシド、
ジメチルスルホン、スルホランなどのスルホキシド・ス
ルホン系溶媒、アセトン、メチルエチルゲトン、ジエチ
ルケトン、アセトフェノンなどのゲトン系ン容媒、ジメ
チルエーテルピルエーテル、ジオキサン、テトラヒドロ
フランなどのエーテル系溶媒、クロロホルム、塩化メチ
レン、トリクロロエチレン、2塩化エチレン、パークロ
ルエチレン、モノクロルエタン、ジクロルエタン、テト
ラクロルエタン、パークロルエタン、クロルベンゼンな
どのハロゲン系溶媒、メタノール、エタノール、プロパ
ノール、ブタノール、ペンタノール、エチレングリコー
ル、プロピレングリコール、フェノール、クレゾール、
ポリエチレングリコール、ポリプロピレングリコールな
どのアルコール・フェノール系溶媒およびベンゼン、ト
ルエン、キシレンなどの芳香族炭化水素系溶媒などが挙
げられる。The organic solvent used for cleaning the PPS resin is not particularly limited as long as it does not have the effect of decomposing the PP5vfJ fat, and examples thereof include N-methylpyrrolidone, dimethylformamide, dimethylacetamide, 1,3-dimethylimidazolidinone, Nitrogen-containing polar solvents such as hexamethylphosphorus amide and piperazinones, dimethyl sulfoxide,
Sulfoxide/sulfone solvents such as dimethyl sulfone and sulfolane, getone solvents such as acetone, methyl ethyl getone, diethyl ketone, and acetophenone, ether solvents such as dimethyl ether pylether, dioxane, and tetrahydrofuran, chloroform, methylene chloride, trichloroethylene, Halogenated solvents such as ethylene dichloride, perchlorethylene, monochloroethane, dichloroethane, tetrachloroethane, perchloroethane, chlorobenzene, methanol, ethanol, propanol, butanol, pentanol, ethylene glycol, propylene glycol, phenol, cresol,
Examples include alcohol/phenol solvents such as polyethylene glycol and polypropylene glycol, and aromatic hydrocarbon solvents such as benzene, toluene, and xylene.
これらの有機溶媒のうちでも、N−メチルピロリドン、
アセトン、ジメチルホルムアミドおよびクロロホルムな
どの使用が特に好ましい.また、これらの有機溶媒は、
1種類または2種類以上の混合で使用される。Among these organic solvents, N-methylpyrrolidone,
Particular preference is given to using acetone, dimethylformamide and chloroform. In addition, these organic solvents are
Used alone or in combination of two or more.
有機溶媒による洗浄の方法としては、有機溶媒中にPP
S樹脂を浸漬せしめるなどの方法があり、必要により適
宜撹拌または加熱することも可能である。As a method of cleaning with an organic solvent, PP is added in an organic solvent.
There are methods such as immersing the S resin, and it is also possible to stir or heat as appropriate, if necessary.
有機溶媒でPPS樹脂を洗浄する際の洗浄温度について
は特に制限はなく、常温〜300℃程度の任意の温度が
選択できる.洗浄温度が高くなるほど洗浄効率が高くな
る傾向があるが、通常は常温〜150℃の洗浄温度で十
分効果が得られる。There are no particular restrictions on the cleaning temperature when cleaning PPS resin with an organic solvent, and any temperature between room temperature and about 300°C can be selected. Although there is a tendency that the higher the cleaning temperature, the higher the cleaning efficiency, a sufficient effect can usually be obtained at a cleaning temperature of room temperature to 150°C.
圧力容器中で、有機溶媒の沸点以上の温度で加圧下に洗
浄することも可能である。また、洗浄時間についても特
に制限はない.洗浄条件にもよるが、バッチ式洗浄の場
合、通常5分間以上洗浄することにより、十分な効果が
得られる。It is also possible to wash under pressure in a pressure vessel at a temperature above the boiling point of the organic solvent. There is also no particular limit to the cleaning time. Although it depends on the cleaning conditions, in the case of batch cleaning, sufficient effects can usually be obtained by cleaning for 5 minutes or more.
また連続式で洗浄することも可能である。It is also possible to wash continuously.
重合により生成したppsvIJ脂を有11!I!溶媒
で洗浄するのみで十分であるが、本発明の効果をさらに
発揮させるために、水洗浄または温水洗浄と組合わせる
のが好ましい。また、N−メチルピロリドンなどの高沸
点水溶性有機溶媒を用いた場合は、有機溶媒洗浄後、水
または温水で洗浄することにより、残存有機溶媒の除去
が容易に行えて好ましい.これらの洗浄に用いる水は蒸
留水、脱イオン水であることが好ましい。Contains ppsvIJ fat produced by polymerization 11! I! Although washing with a solvent alone is sufficient, in order to further exhibit the effects of the present invention, it is preferable to combine washing with water or hot water. Further, when a high-boiling water-soluble organic solvent such as N-methylpyrrolidone is used, it is preferable to wash with water or warm water after washing with the organic solvent, since the residual organic solvent can be easily removed. The water used for these washings is preferably distilled water or deionized water.
また、本発明で用いるPPS樹脂は、本発明の効果を十
分に発現させるためにナトリウムの含有量が900pp
n以下であることが好ましい。In addition, in order to fully express the effects of the present invention, the PPS resin used in the present invention has a sodium content of 900 pp.
It is preferably n or less.
ナトリウム含有量が90oppm以上であるPP]11
1脂のナトリウム含有量を9 0 0ppn以下に落と
す有効な手段として、上述の酸処理、熱水処理あるいは
有機溶媒による洗浄などの処理を用いることができる。PP with sodium content of 90 oppm or more] 11
As an effective means for reducing the sodium content of 1 fat to 900 ppn or less, treatments such as the above-mentioned acid treatment, hot water treatment, or washing with an organic solvent can be used.
上記記載のPPSII脂の酸処理、熱水処理および有機
溶媒による洗浄、またナトリウム含有量が9 0 op
pn以下のppsというのは、あくまでも本発明の効果
をより発現させるために好ましいということで、決して
本発明の必須条件ではない。本発明においてはあらゆる
PP5t!ll脂が使用可能である。The above-mentioned PPS II fat was treated with acid, hot water and washed with an organic solvent, and the sodium content was 90 op.
A pps of pn or less is only preferable in order to further express the effects of the present invention, and is by no means an essential condition of the present invention. In the present invention, any PP5t! 1 l fat can be used.
本発明で耐熱性接着剤として用いる芳香族ポリイミドと
は、下式■の繰返し単位からなる重合体であり、
本発明で耐熱性接着剤として用いる芳香族ポリアミドイ
ミドとは、下式〇の繰返し単位からなる重合体であり、
ト「
(式中、Arは少なくとも1つの炭素6員環を含む4価
の芳香族残基、Rは2価の芳香族および/または脂肪族
残基を示す、)
好適な例としては、次の′WI造式のものが挙げられる
。The aromatic polyimide used as a heat-resistant adhesive in the present invention is a polymer consisting of repeating units of the following formula (■), and the aromatic polyamide-imide used as a heat-resistant adhesive in the present invention is a polymer consisting of repeating units of the following formula It is a polymer consisting of (wherein, Ar is a tetravalent aromatic residue containing at least one carbon 6-membered ring, and R is a divalent aromatic and/or aliphatic residue) A suitable example is the following 'WI structure.
す
(Ar−は少なくとも1つの炭素6員環を含む3価の芳
香族基、Rは弐〇で示すものと同じである。)
好適な例としては次の構造式のものが挙げられる。(Ar- is a trivalent aromatic group containing at least one carbon 6-membered ring, and R is the same as shown in ⑧.) Suitable examples include those of the following structural formula.
” HI 400”
(日立)
“セミコファイン”5P810(東し)m/n=70/
30モル%比
LLトーロン″
(アモコ)
本発明で耐熱接着剤として用いる芳香族ポリエーテルイ
ミドとは、下式■の繰返し単位からなる重合体であり、
1′ウルテム”(GE)
(Ar−およびRは、上記■式および0式で示すものと
同じである。)
好適な例として次の構造式のものを挙げることができる
。"HI 400" (Hitachi) "Semico Fine" 5P810 (East) m/n=70/
30 mol% ratio LL Torlon'' (Amoco) The aromatic polyetherimide used as a heat-resistant adhesive in the present invention is a polymer consisting of repeating units of the following formula (1), 1'Ultem'' (GE) (Ar- and R is the same as shown in the above formulas (■) and (0).) Suitable examples include those of the following structural formulas.
合体であり、
(式中、Ar″は少なくとも1つの炭素6員環を含む2
価の芳香族基、Rは弐〇で示すものと同じである。)
好適な例として、次の構造式のものが挙げられる。(wherein Ar'' is 2 containing at least one 6-membered carbon ring)
The valent aromatic group, R, is the same as that shown by ⑧. ) Suitable examples include those of the following structural formula.
本発明で耐熱接着剤として用いるビスマレイミド樹脂と
は、下式〇の繰返し単位からなる重゛ケルイミド″(ロ
ータ・ブーラン)
本発明における電子部品のリード線への耐熱性接着剤の
塗布は、該接着剤を有機溶剤により希釈して、吹付は塗
装やスクリーン印刷などの方法によって行われる。接着
剤の塗膜厚は、1〜5011mが好ましく、より好まし
くは2〜30μmである。The bismaleimide resin used as the heat-resistant adhesive in the present invention is a heavy kelimide resin (Rota-Boulin) consisting of the repeating unit of the following formula 〇. The adhesive is diluted with an organic solvent and sprayed by a method such as painting or screen printing.The coating thickness of the adhesive is preferably 1 to 5011 m, more preferably 2 to 30 m.
接着剤を塗布したリード線は、有機溶剤の除去および接
着剤のキユアリングを行うために、次いで加熱乾燥され
る。The lead wire coated with the adhesive is then heated and dried in order to remove the organic solvent and cure the adhesive.
本発明における電子部品のリード線の材質としては、特
に限定するものでないが、鉄、ニッケル、銅、アルミニ
ウム、錫、亜鉛、コバルトおよびジルコニウムなどの各
種金属を組合せた任意の材料が使用できる。The material for the lead wire of the electronic component in the present invention is not particularly limited, but any material that is a combination of various metals such as iron, nickel, copper, aluminum, tin, zinc, cobalt, and zirconium can be used.
本発明においてpps樹脂と組合せて用いる無機質充填
材とは、繊維状お上び/または粒状の充填剤であり、P
P51!I脂100重量部に対して10〜300重量部
の範囲で配合することができる。配合量が10重量部未
満では機械的強度が低く、線膨脹係数が大きくなるため
、封止成形品にクラックが生じやすくなり、また300
重量部以上では溶融粘度が高くなり、金線の@線を生じ
やすくなるため好ましくない。In the present invention, the inorganic filler used in combination with the pps resin is a fibrous filler and/or a granular filler.
P51! It can be blended in an amount of 10 to 300 parts by weight per 100 parts by weight of I fat. If the blending amount is less than 10 parts by weight, the mechanical strength will be low and the coefficient of linear expansion will be large, making it easy for cracks to occur in the sealed molded product.
If it exceeds 1 part by weight, the melt viscosity becomes high and gold wire @ lines are likely to occur, which is not preferable.
かかる繊維状充填材としては、ガラスピーズ、アルミナ
繊維、炭化珪素繊維、セラミック1a維、アスベスト繊
維、石こう繊維、金属繊維などの無@繊維および炭素繊
維が挙げられる。Examples of such fibrous fillers include non-@ fibers and carbon fibers such as glass beads, alumina fibers, silicon carbide fibers, ceramic 1a fibers, asbestos fibers, gypsum fibers, and metal fibers.
また粒状の充填材としては、ワラステナイト、セリサイ
ト、カオリン、マイカ、クレー、ベントナイト、アスベ
スト、タルク、アルミナシリケートなどの珪酸塩、アル
ミナ、塩化珪素、酸化マグネシウム、酸化ジルコニウム
、酸化チタンなどの金属酸化物、炭酸カルシウム、炭酸
マグネシウム、・ドロマイトなどの炭酸塩、硫酸カルシ
ウム、硫酸バリウムなどのKM塩、ガラスピーズ、窒化
ホウ素、炭化珪素、シリカなどが挙げられ、これらは中
空であってもよい、これら充填材は2種以上を併用する
ことも可能であり、必要によりシラン系およびチタン系
カップリング剤で予備処理して使用することができる。Granular fillers include wollastenite, sericite, kaolin, mica, clay, bentonite, asbestos, talc, silicates such as alumina silicate, and metal oxides such as alumina, silicon chloride, magnesium oxide, zirconium oxide, and titanium oxide. Examples include carbonates such as calcium carbonate, magnesium carbonate, and dolomite, KM salts such as calcium sulfate and barium sulfate, glass beads, boron nitride, silicon carbide, and silica, which may be hollow. It is also possible to use two or more kinds of fillers in combination, and if necessary, the fillers can be pretreated with a silane-based and titanium-based coupling agent before use.
PP5l!!脂と無機質充填剤からなる組成物の製造方
法は、一般的な方法が用いられ特に限定されるものでは
ない。例えば室温においてリボン羽根型混合機、ドラム
型回転混合機を用いて各成分を一緒に混合した後、単軸
押出機、多軸押出iまたはニーダ−などにより溶融混練
を行い、ペレット化することにより製造することができ
る。PP5l! ! The method for producing the composition consisting of fat and inorganic filler is not particularly limited and may be a general method. For example, by mixing each component together at room temperature using a ribbon blade type mixer or a drum type rotating mixer, melt-kneading is performed using a single-screw extruder, multi-screw extruder, or kneader, and then pelletized. can be manufactured.
なお溶融混練温度は280〜340’Cが好ましく、2
80 ”C未満ではPPS樹脂の溶融が不十分になるこ
とがあるので注意を要する。The melt-kneading temperature is preferably 280 to 340'C, and 280 to 340'C.
If the temperature is less than 80"C, the melting of the PPS resin may become insufficient, so care must be taken.
本発明でいう電子部品とは、通常電子部品の概念で考え
られるものであれば特に制限はないが、例えば□コンデ
ンサー、抵抗器、集積回路(IC)、トランジスター、
ダイオード、トライオード、サイリスター、コイル、バ
リスターコネクター、変換器、マイクロスイッチなどお
よびこれらの複合部品などが挙げられる。The electronic components used in the present invention are not particularly limited as long as they can be considered in the concept of electronic components, but include, for example, □ capacitors, resistors, integrated circuits (ICs), transistors,
Examples include diodes, triodes, thyristors, coils, varistor connectors, converters, microswitches, and composite parts thereof.
本発明におけるppsvIJ脂と無機質充填剤からなる
組成物によるリード線の側止方法にも特に制限はなく、
金型中にリード線を固定しておき、射出成形あるいはト
ランスファー成形で成形する方法あるいはあらかじめフ
ィルム状に成形しであるPPS樹脂組成物を用いて、加
熱、加圧下にリード線を封包する方法などが挙げられる
。There is no particular restriction on the method of side-stopping the lead wire using the composition comprising ppsvIJ resin and inorganic filler in the present invention.
A method in which the lead wire is fixed in a mold and molded by injection molding or transfer molding, or a method in which the lead wire is sealed under heat and pressure using a PPS resin composition that has been previously formed into a film shape. can be mentioned.
さらに、本発明で得られる電子部品は、成形後過酸化水
素水などの過酸化物で処理することあるいはPPS樹脂
の融点以下の温度で熱処理することなどにより、P P
S f!j脂の架橋度または結晶化度を増大させ、機
械特性などを改善することが可能である。Furthermore, the electronic component obtained by the present invention can be treated with a peroxide such as a hydrogen peroxide solution after molding, or heat treated at a temperature below the melting point of the PPS resin.
S f! It is possible to increase the degree of crosslinking or crystallinity of J fat and improve its mechanical properties.
以下に実施例および比較例を挙げて本発明をさらに詳細
に説明する。The present invention will be explained in more detail by giving Examples and Comparative Examples below.
なお、本実施例に示す部および%はすべて重量基準であ
る。Note that all parts and percentages shown in the examples are based on weight.
〈実施例〉
参考例1 (PPS樹脂の重合)
オートクレーブに硫化ナトリウム3.26 kf(25
モル、結晶水40%を含む)、水酸化ナトリウム4gお
よびN−メチル−2−ピロリドン(以下NMPと称する
) 7.9 kIrを仕込み、撹拌しながら徐々に20
5°Cまで昇温し、水1.36 klを含む留出水約1
.51を除去した。残留混合1勿に1,4−ジクロルベ
ンゼン3.75 kg (25゜5モル)およびN M
P 2 kgを加え、・265℃で4時間加熱した。<Example> Reference Example 1 (Polymerization of PPS resin) Sodium sulfide 3.26 kf (25
(containing 40% water of crystallization), 4 g of sodium hydroxide, and 7.9 kIr of N-methyl-2-pyrrolidone (hereinafter referred to as NMP), and gradually added 20 kIr with stirring.
Distillate water heated to 5°C and containing 1.36 kl of water
.. 51 was removed. Remaining mixture 1, 3.75 kg (25° 5 mol) of 1,4-dichlorobenzene and N M
P 2 kg was added and heated at 265° C. for 4 hours.
反応生成物を70°Cの温水で5回洗浄し、80℃で2
4時間減圧乾燥して、溶融粘度約100ボイズ(310
°C1剪断速度1.000秒−1)の粉末状PPS樹脂
約2 kgを得た。The reaction product was washed 5 times with warm water at 70°C and incubated at 80°C for 2
After drying under reduced pressure for 4 hours, the melt viscosity was approximately 100 boids (310
Approximately 2 kg of powdered PPS resin was obtained at a shear rate of 1.000 s-1).
次に、上記PPS樹脂粉末2 kgを90℃に加熱した
pH4の酢酸水溶液201中に投入し、約30分間撹拌
し続けたのち濾過し、vP ?&のpHが7になるまで
約90℃の脱イオン水で洗浄し、120℃で24時間減
圧乾燥してPPS樹脂乾燥粉末を得た。このppst!
I脂中の全ナトリウム含有量は270ppImであった
。Next, 2 kg of the above PPS resin powder was poured into a pH 4 acetic acid aqueous solution 201 heated to 90°C, stirred continuously for about 30 minutes, filtered, and vP? The mixture was washed with deionized water at about 90°C until the pH of the mixture became 7, and dried under reduced pressure at 120°C for 24 hours to obtain a PPS resin dry powder. This ppst!
The total sodium content in I fat was 270 ppIm.
参考例2
参考例1で得たPPS樹脂粉末35部、溶融シリカ(平
均粒径12n+)50部、ウレイドプロピルトリエトキ
シシラン0.5部およびガラス繊維(m雑兵3a+L)
15部をトライブレンドした後、30關φ2軸押出機に
供給して、処理温度270〜320 ’Cで溶融混練し
て、均一溶融ブレンドペレット化して実施例に供した。Reference Example 2 35 parts of the PPS resin powder obtained in Reference Example 1, 50 parts of fused silica (average particle size 12n+), 0.5 part of ureidopropyltriethoxysilane, and glass fiber (m 3a+L)
After tri-blending 15 parts, it was supplied to a 30 mm diameter twin-screw extruder, and melt-kneaded at a processing temperature of 270 to 320'C to form homogeneous melt-blended pellets, which were used in Examples.
実施例1〜4
第1表に示した各種接着剤溶媒で希釈したものを、16
ピンDIP型のリードフレーム(材質:42アロイ)に
塗布したのち、120℃で60分乾燥して溶剤を除去し
た。接着剤の塗膜厚は5〜l0IJI11であった。Examples 1 to 4 Various adhesive solvents shown in Table 1 were diluted with 16
After applying it to a pin DIP type lead frame (material: 42 alloy), it was dried at 120° C. for 60 minutes to remove the solvent. The coating thickness of the adhesive was 5-10IJI11.
次に、上記リードフレームを金型(温度200℃)にセ
ットし、インサート専用射出成形機(温度300〜32
0℃)にて、参考例2で得なベレットで封止成形して1
6ピンDIP型IC封止成形品を得た。Next, set the above lead frame in a mold (temperature: 200°C) and insert it into an injection molding machine (temperature: 300-32°C).
At 0°C), seal molding was performed using a pellet obtained in Reference Example 2.
A 6-pin DIP type IC sealed molded product was obtained.
得られた封止品の赤インク試験を下記の方法で行い、リ
ードフレームと樹脂の間への赤インク浸入状態を調べて
結果を第1表に示した。The obtained sealed product was subjected to a red ink test using the method described below, and the state of infiltration of the red ink between the lead frame and the resin was examined, and the results are shown in Table 1.
赤インク浸入試験
16ピンDIP型IC封止成形品を赤インク液に浸漬し
、圧カニ5kgf/aaG、温度:80°C1時間=1
6h処理後、リードフレームと樹脂の界面の赤インク侵
入度合を(%)で表示して評価した。Red ink penetration test A 16-pin DIP type IC sealed molded product was immersed in red ink liquid, pressure crab 5 kgf/aaG, temperature: 80°C 1 hour = 1
After 6 hours of treatment, the degree of red ink penetration at the interface between the lead frame and the resin was expressed in (%) and evaluated.
第1表の結果から明らかなように、本実施例の方法で得
た封止成形品は、密着性が大幅に改善されて、赤インク
侵入度合いは5%以下であった。As is clear from the results in Table 1, the sealing molded product obtained by the method of this example had significantly improved adhesion, and the degree of red ink penetration was 5% or less.
比較例1
接着剤を塗布していないリードフレームを使用して、実
施例1と同様に射出成形/赤インク試験を行った。結果
を第■表に併記した。Comparative Example 1 An injection molding/red ink test was conducted in the same manner as in Example 1 using a lead frame to which no adhesive was applied. The results are also listed in Table ■.
比較例2
エポキシ系接着剤″エピコート” 191 P(油化シ
ェルエポキシ社)をリードフレームに塗布したのち、実
施例1と同様に射出成形/赤インク試験を行った。結果
を第1表に併記した。Comparative Example 2 After applying an epoxy adhesive "Epicoat" 191 P (Yuka Shell Epoxy Co., Ltd.) to a lead frame, an injection molding/red ink test was conducted in the same manner as in Example 1. The results are also listed in Table 1.
第 1
表
〈発明の効果〉
本発明の方法によって得られる電子部品は、PPS樹脂
とリード線との高温、高温条件下で密着性が優れおり、
IC、トランジスター、コンデンサーおよびコネクター
などの封止用部品としてきわめて有用である。Table 1 <Effects of the Invention> The electronic component obtained by the method of the present invention has excellent adhesion between the PPS resin and the lead wire under high temperature conditions.
It is extremely useful as a sealing component for ICs, transistors, capacitors, connectors, etc.
特許出願大東し株式会社Patent application Daitoshi Co., Ltd.
Claims (1)
際し、リード線に対し芳香族ポリイミド、芳香族ポリア
ミドイミド、芳香族ポリエーテルイミドおよびビスマレ
イミド樹脂のうちから選ばれた少なくとも1種の耐熱性
接着剤を塗布し、次いでこれを無機充填材を含有するポ
リフェニレンスルフィド樹脂で封止することを特徴とす
る電子部品の封止方法。When sealing electronic components with polyphenylene sulfide resin, at least one heat-resistant adhesive selected from aromatic polyimide, aromatic polyamideimide, aromatic polyetherimide, and bismaleimide resin is applied to the lead wire. and then sealing this with a polyphenylene sulfide resin containing an inorganic filler.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20625489A JPH0369128A (en) | 1989-08-08 | 1989-08-08 | Sealing of electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20625489A JPH0369128A (en) | 1989-08-08 | 1989-08-08 | Sealing of electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0369128A true JPH0369128A (en) | 1991-03-25 |
Family
ID=16520288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20625489A Pending JPH0369128A (en) | 1989-08-08 | 1989-08-08 | Sealing of electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0369128A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998007188A1 (en) * | 1996-08-08 | 1998-02-19 | Siemens Aktiengesellschaft | Wafer frame |
CN102677177A (en) * | 2012-04-13 | 2012-09-19 | 昆明理工大学 | Preparation method of calcium sulfate hemihydrate crystal whiskers high in length diameter ratio |
-
1989
- 1989-08-08 JP JP20625489A patent/JPH0369128A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998007188A1 (en) * | 1996-08-08 | 1998-02-19 | Siemens Aktiengesellschaft | Wafer frame |
CN102677177A (en) * | 2012-04-13 | 2012-09-19 | 昆明理工大学 | Preparation method of calcium sulfate hemihydrate crystal whiskers high in length diameter ratio |
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