JPH0368138A - Cleaning device - Google Patents
Cleaning deviceInfo
- Publication number
- JPH0368138A JPH0368138A JP1203176A JP20317689A JPH0368138A JP H0368138 A JPH0368138 A JP H0368138A JP 1203176 A JP1203176 A JP 1203176A JP 20317689 A JP20317689 A JP 20317689A JP H0368138 A JPH0368138 A JP H0368138A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- tank
- gas
- pure water
- cleaned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 94
- 230000005587 bubbling Effects 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims description 31
- 239000000428 dust Substances 0.000 claims description 14
- 238000007664 blowing Methods 0.000 claims description 8
- 238000007667 floating Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 abstract description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 4
- 239000012530 fluid Substances 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 1
- 239000004809 Teflon Substances 0.000 description 6
- 229920006362 Teflon® Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概要〕
洗浄装置、とくに、半導体装置の製造プロセスにおいて
使用する洗浄装置に関し、
洗浄槽の洗浄液表面に浮遊する塵埃を絶えず流出除去さ
せて、被洗浄物への塵埃の付着を無くすることを目的と
し、
洗浄液供給口とバブリング用ガス供給口を少なくとも設
けた洗浄槽と、前記洗浄槽の一方の上端縁に沿って平行
に配置されたガス層流の吹き出し口を有するガス吹き出
しユニットと、前記洗浄槽の一方の上端縁に対向する他
の上端縁に沿って、前記ガス層流の吹き出し口に対面し
て配置された前記ガス層流の吸引口を有する真空吸引ユ
ニットとを少なくとも備え、前記洗浄槽の上端縁をオー
バーフローする洗浄液の表面に浮遊する塵埃を、前記ガ
ス層流により流出除去させるように洗浄装置を横取する
。[Detailed Description of the Invention] [Summary] Regarding a cleaning device, especially a cleaning device used in the manufacturing process of semiconductor devices, dust floating on the surface of a cleaning liquid in a cleaning tank is constantly drained and removed, thereby preventing the dust from falling onto the object to be cleaned. A cleaning tank having at least a cleaning liquid supply port and a bubbling gas supply port for the purpose of eliminating adhesion, and a gas laminar flow outlet arranged in parallel along one upper edge of the cleaning tank. a vacuum suction unit having a gas blowing unit and a suction port for the gas laminar flow disposed along the other top edge opposite to one top edge of the cleaning tank, facing the gas laminar flow blowout port; and a cleaning device is intercepted so that dust floating on the surface of the cleaning liquid overflowing the upper end edge of the cleaning tank is removed by flowing out by the gas laminar flow.
本発明は、半導体装置等の製造プロセスにおいて使用す
る洗浄装置の改良に関する。The present invention relates to improvements in cleaning equipment used in manufacturing processes for semiconductor devices and the like.
近年、半導体集積回路(IC)はますます大規模化し、
集積度も高まる一方である。したがって、その製造プロ
セスもますますデリケート、かつ、困難になってきてい
る。In recent years, semiconductor integrated circuits (ICs) have become increasingly large-scale.
The degree of integration is also increasing. Therefore, the manufacturing process is also becoming increasingly delicate and difficult.
ICの製造プロセスには多くの装置が使用されているが
、基板ウェーハは勿論のこと露光用のマスクを洗浄する
ための洗浄装置が種々の製造プロセスにおいて使用され
ている。Many devices are used in the IC manufacturing process, and cleaning devices for cleaning not only substrate wafers but also exposure masks are used in various manufacturing processes.
ICを製造する上で、塵埃の混入防止は最も注意を必要
とされるものであり、洗浄装置の清浄度の向上がますま
す求められている。In manufacturing ICs, prevention of dust contamination is the most important issue, and there is an increasing need to improve the cleanliness of cleaning equipment.
第2図は従来の洗浄装置を説明する図で、同図(イ)は
上面図、同図(ロ)はA−A’断面図である。FIG. 2 is a diagram illustrating a conventional cleaning device, in which FIG. 2A is a top view and FIG. 2B is a cross-sectional view taken along line A-A'.
図中、1は洗浄槽、11は洗浄液供給口で1図示してな
い洗浄液の供給装置に連結されている。In the figure, 1 is a cleaning tank, and 11 is a cleaning liquid supply port, which is connected to a cleaning liquid supply device (not shown).
12はバブリング用ガス供給口で1図示してないバブリ
ング用ガス供給装置に連結されている。6は孔あき中隔
板で洗浄槽1の底面からや一上方にはり水平に固定され
ており、その面内には多数の数mmφの貫通した孔61
が穿孔されている。4は洗浄液である。A bubbling gas supply port 12 is connected to a bubbling gas supply device (not shown). Reference numeral 6 denotes a perforated septum plate, which is fixed horizontally from the bottom of the cleaning tank 1, and has a large number of through holes 61 several mm in diameter in its surface.
is perforated. 4 is a cleaning liquid.
100は洗浄治具で、被洗浄物、たとえば、露光用の拡
大マスク(以後レチクルと言う)を収容するホルダーで
ある。A cleaning jig 100 is a holder that accommodates an object to be cleaned, for example, an enlarged mask for exposure (hereinafter referred to as a reticle).
第3図は洗浄治具とレチクルの載置状態を示す図で、上
記で説明した洗浄槽1から取り出した状態を示したもの
である。図中、100は洗浄治具、101は洗浄槽lへ
の出し入れのための把手、200は洗浄治具100に載
置されたレチクルである。FIG. 3 is a diagram showing the state in which the cleaning jig and reticle are placed, and shows the state in which they are taken out from the cleaning tank 1 described above. In the figure, 100 is a cleaning jig, 101 is a handle for taking it in and out of the cleaning tank l, and 200 is a reticle placed on the cleaning jig 100.
いま、レチクル200をia置した洗浄治具100を把
手101を用いて、第2図に示したように洗浄槽l内に
静かに入れ、洗浄液供給口11から洗浄液4゜たとえば
、純水を流すと純水は洗浄槽1を満たしてやがて上端の
縁からオーバーフローして流れ落ち、一方、底面の洗浄
液供給口11からは絶えず新鮮な純水が供給されレチク
ルの洗浄が行なわれる。このとき同時に、バブリング用
ガス供給口12からバブリング用ガス、たとえば、清浄
な窒素ガスを流して洗浄:tL4の中にバブリングさせ
ることによって、−m洗浄効果を高めるようにしている
。Now, using the handle 101, gently place the cleaning jig 100 with the reticle 200 placed in the cleaning tank l as shown in FIG. The pure water fills the cleaning tank 1 and eventually overflows from the upper edge and flows down, while fresh pure water is constantly supplied from the cleaning liquid supply port 11 at the bottom to clean the reticle. At the same time, a bubbling gas, for example, clean nitrogen gas, is flowed from the bubbling gas supply port 12 and bubbled into the cleaning: tL4, thereby enhancing the -m cleaning effect.
なお、孔あき中隔板6が適当な高さに設けられており、
そこには貫通した多数の孔61がランダムに明けられて
いるので、純水と窒素ガスは洗浄槽lの中に万遍なく行
き渡るようになっ、でいる。In addition, the perforated septum plate 6 is provided at an appropriate height,
Since a large number of penetrating holes 61 are randomly formed therein, the pure water and nitrogen gas are evenly distributed in the cleaning tank l.
〔発明が解決しようとする課題]
しかし、上記従来の洗浄装置において、たとえば、純水
をオーバーフローさせていても、洗浄槽1の上端の縁や
コーナーの淀みの部分に小さな塵埃が僅かに付着したり
、淀んでうまく流れ落ちないことがある。[Problems to be Solved by the Invention] However, in the above-mentioned conventional cleaning device, even if pure water is overflowing, a small amount of dust may adhere to the stagnation part of the upper edge or corner of the cleaning tank 1. It may become stagnant and may not flow down properly.
第2図(イ)にそのような状態の例を0点のゴミ300
として示した。Figure 2 (a) shows an example of such a situation with 0 points of garbage 300
It was shown as
このようなゴミ300があると、洗浄治具100を洗浄
槽lから引き上げたあと、第3図のレチクル面に示した
0点のゴミ300のごとく、洗浄後のレチクル200上
に汚れとして残り、最終製品の歩留りと品質・信頼性の
低下などを招くという重大な問題があり、その解決が必
要であった。If such dirt 300 exists, after the cleaning jig 100 is lifted from the cleaning tank l, it remains as dirt on the cleaned reticle 200, like the zero-point dirt 300 shown on the reticle surface in FIG. There was a serious problem that led to a decline in the yield, quality, and reliability of the final product, and it was necessary to resolve it.
上記の課題は、洗浄液供給口11とバブリング用ガス供
給口12を少なくとも設けた洗浄槽1と、前記洗浄槽1
の一方の上端縁13aに沿って平行に配置されたガス層
流5の吹き出し口21を有するガス吹き出しユニット2
と、前記洗浄槽lの一方の上端縁13aに対向する他の
上端縁13bに沿って、前記ガス層流5の吹き出し口2
1に対面して配置された前記ガス層流5の吸引口31を
有する真空吸引ユニット3とを少なくとも備え、
前記洗浄槽lの上端縁13をオーバーフローする洗浄液
4の表面に浮遊する塵埃を、前記ガス層流5により流出
除去させるように洗浄装置を構成することによって解決
することができる。The above problem is solved by the cleaning tank 1 provided with at least the cleaning liquid supply port 11 and the bubbling gas supply port 12, and the cleaning tank 1.
A gas blowing unit 2 having a blowing port 21 for a laminar gas flow 5 arranged in parallel along one upper edge 13a of the gas blowing unit 2.
and an outlet 2 for the gas laminar flow 5 along the other upper edge 13b opposite to one upper edge 13a of the cleaning tank l.
a vacuum suction unit 3 having a suction port 31 for the gas laminar flow 5 disposed facing the cleaning tank l, the vacuum suction unit 3 has a suction port 31 for the gas laminar flow 5, and removes dust floating on the surface of the cleaning liquid 4 overflowing the upper edge 13 of the cleaning tank l This can be solved by configuring the cleaning device in such a way that the laminar gas flow 5 causes the outflow removal.
本発明によれば、洗浄槽1の上端の縁やコーナーの淀み
の部分に、僅かに付着したり、あるいは淀んでうまく流
れ落ちない小さな塵埃を、オーバーフローしている洗浄
液の表面に沿ってガス層流5を必要な強さで流すので、
前記の淀んだり縁に付着したりする塵埃を、洗浄液の全
表面上から強制的に吹き流して除去させることができる
。According to the present invention, small dust particles that are slightly attached to the stagnation parts of the upper edge and corners of the cleaning tank 1, or are stagnant and cannot be washed off properly, are removed by gas laminar flow along the surface of the overflowing cleaning liquid. 5 with the necessary strength,
The dust that stagnates or adheres to the edges can be removed by forcefully blowing it away from the entire surface of the cleaning liquid.
第1図は本発明の実施例を示す図で、同図(イ)は上面
図、同図(ロ)はA−A’断面図である。FIG. 1 is a diagram showing an embodiment of the present invention, in which FIG. 1A is a top view and FIG. 1B is a sectional view taken along line AA'.
図中、1は洗浄槽で、たとえば、大きさ300×300
X300 mmのガラスまたはテフロン製の容器、1
1は洗浄液供給口で、たとえば、内径IQmmφのテフ
ロン製のパイプを経由して、こ\には図示してない洗浄
液の供給装置に連結されている。12はバブリング用ガ
ス供給口で、たとえば、同じく内径IQmmφのテフロ
ン製のパイプを経由して、こ\には図示してないバブリ
ング用ガス供給装置に連結されている。6は孔あき中隔
板で洗浄槽1の底面からや一上方、たとえば、50mm
の位置にはX′水平に固定された。たとえば、厚さ10
mmのテフロン製の板で、その面内には多数の9mmφ
の貫通した孔61が穿孔されている。4は洗浄液。In the figure, 1 is a cleaning tank, for example, the size is 300 x 300.
x300 mm glass or Teflon container, 1
Reference numeral 1 denotes a cleaning liquid supply port, which is connected to a cleaning liquid supply device (not shown) via a Teflon pipe having an inner diameter of IQ mmφ, for example. Reference numeral 12 denotes a bubbling gas supply port, which is connected to a bubbling gas supply device (not shown) via a Teflon pipe having an inner diameter of IQ mmφ, for example. Reference numeral 6 indicates a perforated septum plate located at a distance from the bottom of the cleaning tank 1 or above, for example, 50 mm.
It was fixed at the position X' horizontally. For example, thickness 10
mm Teflon plate with many 9mmφ
A hole 61 is drilled therethrough. 4 is cleaning liquid.
たとえば、純水である。For example, pure water.
2はガス吹き出しユニットで、たとえば、テフロンまた
は硬質塩ビ製であり、洗浄槽1の一方の上端縁13aに
沿って平行に配置されたガス層−fL5の吹き出し口2
1を有し、ガス吹き出し口21の反対側は清浄ガス、た
とえば、清浄空気を送り込む、図には示していない送風
機に連結されている。Reference numeral 2 denotes a gas blow-off unit, which is made of Teflon or hard PVC, for example, and has blow-off ports 2 of the gas layer-fL5 arranged in parallel along one upper edge 13a of the cleaning tank 1.
1, and the opposite side of the gas outlet 21 is connected to a blower (not shown) for feeding clean gas, for example clean air.
3は真空吸引ユニットで、たとえば、テフロンまたは硬
質塩ビ製であり、洗浄槽lの一方の上端縁13aに対向
する他の上端縁13bに沿って、前記ガス層流5の吹き
出し口21に対面して配置された前記ガス層流5の吸引
口31を有し、ガス吸引口31の反対側はガス層流5.
すなわち、清浄空気を吸引する、図には示していない、
たとえば、真空ポンプに連結されている。3 is a vacuum suction unit made of, for example, Teflon or hard PVC, which faces the outlet 21 of the gas laminar flow 5 along the other upper edge 13b opposite to one upper edge 13a of the cleaning tank l. A suction port 31 for the laminar gas flow 5 is arranged, and the opposite side of the gas suction port 31 is for the laminar gas flow 5.
i.e. suction of clean air, not shown in the figure.
For example, it is connected to a vacuum pump.
なお、実施例図のガス吹き出し口21は孔を一列に穿っ
であるが、これは孔とは限らず−様な巾のスリットであ
ってもよい。Although the gas outlet 21 in the embodiment diagram has holes arranged in a row, the holes are not limited to holes, and may be slits of various widths.
また、吹き出し口21と吸引口31の寸法や配置につい
ては、洗浄液4の表面に沿って、できるだけ平行に−様
な清浄空気の流れができて、それによって洗浄液4の表
面に強制的な液の流れが生じるようになるものであれば
、それらの間隔、高さ。In addition, the dimensions and arrangement of the blowout port 21 and the suction port 31 are such that a flow of clean air is created as parallel to the surface of the cleaning liquid 4 as possible, thereby forcing liquid onto the surface of the cleaning liquid 4. The spacing and height of anything that allows flow to occur.
巾、清浄空気の流量や流速は適宜最適に設定すればよい
ことは勿論である。Of course, the width, flow rate and velocity of clean air may be optimally set as appropriate.
いま、被洗浄物、たとえば、厚さ2.3mmで大きさ1
50 X150 mmの石英ガラス製のレチクル200
を第3図に示したのと同様に、洗浄治具100に載置し
把手101を用いて、第2図に示したのと同様に洗浄I
!■内に静かに入れ、洗浄液供給口11から洗浄液4.
たとえば、純水を流すと純水は洗浄槽1を満たしてやが
て上端の縁からオーバーフローして流れ落ち、一方、底
面の洗浄液供給口11からは絶えず新鮮な純水が供給さ
れレチクルの洗浄が行なわれる。Now, the object to be cleaned, for example, has a thickness of 2.3 mm and a size of 1.
50 x 150 mm quartz glass reticle 200
3, place it on the cleaning jig 100 and use the handle 101 to clean it in the same way as shown in FIG.
! ■ Gently pour the cleaning liquid into the cleaning liquid supply port 11.
For example, when pure water is run, the pure water fills the cleaning tank 1 and eventually overflows from the upper edge and flows down, while fresh pure water is constantly supplied from the cleaning liquid supply port 11 at the bottom to clean the reticle. .
このとき同時に、バブリング用ガス供給口12からバブ
リング用ガス、たとえば、清浄な窒素ガスを流して洗浄
液4の中にバブリングさせる。At the same time, a bubbling gas, for example, clean nitrogen gas, is caused to flow into the cleaning liquid 4 from the bubbling gas supply port 12 .
さらに、ガス吹き出しユニット2が連結されている。こ
\には図示してない送風機を動作させ、たとえば、清浄
空気を吹き出し口21から吹き出し、一方、それに対面
して配置された真空吸引ユニット3工の吸引口31から
前記清浄空気を、こ−には図示されていない真空ポンプ
で吸引して、洗浄槽lの洗浄液の表面に沿って出来るだ
け−様な清浄空気の層流5を形成させる。Furthermore, a gas blowing unit 2 is connected. A blower (not shown) is operated, for example, to blow out clean air from the blowout port 21, and on the other hand, the clean air is drawn from the suction port 31 of the vacuum suction unit 3 placed facing it. A vacuum pump (not shown) is used to create a laminar flow 5 of clean air along the surface of the cleaning liquid in the cleaning tank 1 as closely as possible.
なお、本実施例装置は通常行なわれるようにクリーンブ
ース内において使用した。The apparatus of this example was used in a clean booth as is normally done.
以上の如く本実施例の洗浄装置を動作させることによっ
て、液面の一部に淀んだり洗浄槽の上端の縁に付着した
りする塵埃を、洗浄液の全表面上から強制的に吹き流し
て除去させることができ、したがって、レチクル200
を洗浄槽lから引き上げたあと、レチクル200上の塵
埃による汚れは。By operating the cleaning device of this embodiment as described above, the dust that stagnates on a part of the liquid surface or adheres to the upper edge of the cleaning tank is forcibly blown away from the entire surface of the cleaning liquid. Therefore, reticle 200
After the reticle 200 is removed from the cleaning tank 1, there is no dust on the reticle 200.
たとえば、顕微鏡検査の結果、0.5〜2μmの大きさ
のゴミ付着量の検出で評価した場合、従来の洗浄装置を
用いた場合の175以下となり大巾な改善が見られた。For example, as a result of microscopic examination, when evaluated by detecting the amount of attached dust with a size of 0.5 to 2 μm, it was 175 or less compared to when using a conventional cleaning device, which was a significant improvement.
なお、上記実施例装置において、材料1寸法。In addition, in the above embodiment apparatus, one dimension of the material.
形状などは一例を示したものであり、他のもの或いはそ
れらの組み合わせを適宜用いてもよいことは勿論である
。The shapes and the like are merely examples, and it goes without saying that other shapes or combinations thereof may be used as appropriate.
以上述べたように、本発明によれば、洗浄槽1の上端の
縁やコーナーの淀みの部分に、僅かに付着したり、ある
いは淀んでうまく流れ落ちない小さな塵埃を、オーバー
フローしている洗浄液の表面に沿ってガス層流5を必要
な強さで流すので、前記の淀んだり縁に付着したりする
塵埃を、洗浄液の全表面上から強制的に吹き流して除去
させることができる。したがって、被洗浄物への汚れが
残る恐れが極めて小さくなり、ICなど高性能製品の歩
留り、品質および信頼性の向上に寄与するところが極め
て大きい。As described above, according to the present invention, the surface of the overflowing cleaning liquid removes small dust that slightly adheres to the stagnation part of the upper edge or corner of the cleaning tank 1 or stagnates and does not flow off properly. Since the gas laminar flow 5 is caused to flow with the necessary strength along the cleaning liquid, the dust that stagnates or adheres to the edges can be forcibly blown away from the entire surface of the cleaning liquid. Therefore, the risk of stains remaining on the object to be cleaned is extremely reduced, which greatly contributes to improving the yield, quality, and reliability of high-performance products such as ICs.
第1図は本発明の実施例を示す図、
第2図は従来の洗浄装置を説明する図、第3図は洗浄治
具とレチクルの載置状態を示す図である。
図において、
1は洗浄槽、
2はガス吹き出しユニット、
3は真空吸引ユニット、
4は洗浄液、
5はガス層流、
6は孔あき中隔板、
11は洗浄液供給口、
12はバブリング用ガス供給口、
13 (13a、 13b)は上端縁、2Iは吹き出し
口、31は吸引口、
61は孔である。
(イ)上5わ蓬]
(ロン4−A’ff乍め口
本発日月の寝杷伊11示ず起
第 1 の
1シ岬す$IA巳し手りル/)載1才尺費1乙革ず口’
!j3EJFIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram illustrating a conventional cleaning device, and FIG. 3 is a diagram showing a cleaning jig and a reticle placed thereon. In the figure, 1 is a cleaning tank, 2 is a gas blowing unit, 3 is a vacuum suction unit, 4 is a cleaning liquid, 5 is a gas laminar flow, 6 is a perforated septum plate, 11 is a cleaning liquid supply port, 12 is a bubbling gas supply 13 (13a, 13b) is an upper edge, 2I is an air outlet, 31 is a suction port, and 61 is a hole. (A) Upper 5th month] (Ron 4-A'ff from the original date and time of the month of April 11th, 1st 1st year, 1st year, 1st year) Expense 1
! j3EJ
Claims (1)
を少なくとも設けた洗浄槽(1)と、 前記洗浄槽(1)の一方の上端縁(13a)に沿って平
行に配置されたガス層流(5)の吹き出し口(21)を
有するガス吹き出しユニット(2)と、 前記洗浄槽(1)の一方の上端縁(13a)に対向する
他の上端縁(13b)に沿って、前記ガス層流(5)の
吹き出し口(21)に対面して配置された前記ガス層流
(5)の吸引口(31)を有する真空吸引ユニット(3
)とを少なくとも備え、 前記洗浄槽(1)の上端縁(13)をオーバーフローす
る洗浄液(4)の表面に浮遊する塵埃を、前記ガス層流
(5)により流出除去させることを特徴とした洗浄装置
。[Claims] Cleaning liquid supply port (11) and bubbling gas supply port (12)
a cleaning tank (1) provided with at least the following: a gas blowing unit having a gas laminar flow (5) blowout port (21) arranged in parallel along one upper edge (13a) of the cleaning tank (1); (2), and along the other upper edge (13b) opposite to one upper edge (13a) of the cleaning tank (1), facing the outlet (21) of the gas laminar flow (5). a vacuum suction unit (3) having a suction port (31) for said gas laminar flow (5) arranged;
), wherein dust floating on the surface of the cleaning liquid (4) overflowing the upper edge (13) of the cleaning tank (1) is removed by flowing out by the gas laminar flow (5). Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20317689A JP2827305B2 (en) | 1989-08-05 | 1989-08-05 | Cleaning equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20317689A JP2827305B2 (en) | 1989-08-05 | 1989-08-05 | Cleaning equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0368138A true JPH0368138A (en) | 1991-03-25 |
JP2827305B2 JP2827305B2 (en) | 1998-11-25 |
Family
ID=16469719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20317689A Expired - Lifetime JP2827305B2 (en) | 1989-08-05 | 1989-08-05 | Cleaning equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2827305B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996021525A3 (en) * | 1995-01-10 | 1996-09-19 | Roland Wuebbe | Installation and method for washing contaminated soil or similar materials and for cleaning equipment parts or similar components which come into contact with fluids |
CN105127139A (en) * | 2015-07-27 | 2015-12-09 | 句容骏成电子有限公司 | Device for cleaning surfaces of LCD products |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58132934A (en) * | 1982-02-03 | 1983-08-08 | Nec Corp | Method of washing semiconductor wafer |
JPS59188924A (en) * | 1983-04-11 | 1984-10-26 | Hitachi Ltd | Cleaning tank |
JPS6310529A (en) * | 1986-07-01 | 1988-01-18 | Mitsubishi Electric Corp | Cleaning equipment |
JPS647622A (en) * | 1987-06-30 | 1989-01-11 | Nec Corp | Device for treatment of semiconductor substrate |
-
1989
- 1989-08-05 JP JP20317689A patent/JP2827305B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58132934A (en) * | 1982-02-03 | 1983-08-08 | Nec Corp | Method of washing semiconductor wafer |
JPS59188924A (en) * | 1983-04-11 | 1984-10-26 | Hitachi Ltd | Cleaning tank |
JPS6310529A (en) * | 1986-07-01 | 1988-01-18 | Mitsubishi Electric Corp | Cleaning equipment |
JPS647622A (en) * | 1987-06-30 | 1989-01-11 | Nec Corp | Device for treatment of semiconductor substrate |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996021525A3 (en) * | 1995-01-10 | 1996-09-19 | Roland Wuebbe | Installation and method for washing contaminated soil or similar materials and for cleaning equipment parts or similar components which come into contact with fluids |
CN105127139A (en) * | 2015-07-27 | 2015-12-09 | 句容骏成电子有限公司 | Device for cleaning surfaces of LCD products |
Also Published As
Publication number | Publication date |
---|---|
JP2827305B2 (en) | 1998-11-25 |
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