JP2827305B2 - Cleaning equipment - Google Patents

Cleaning equipment

Info

Publication number
JP2827305B2
JP2827305B2 JP20317689A JP20317689A JP2827305B2 JP 2827305 B2 JP2827305 B2 JP 2827305B2 JP 20317689 A JP20317689 A JP 20317689A JP 20317689 A JP20317689 A JP 20317689A JP 2827305 B2 JP2827305 B2 JP 2827305B2
Authority
JP
Japan
Prior art keywords
cleaning
cleaning liquid
port
cleaning tank
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP20317689A
Other languages
Japanese (ja)
Other versions
JPH0368138A (en
Inventor
武紀 大久保
幸二 蛭田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20317689A priority Critical patent/JP2827305B2/en
Publication of JPH0368138A publication Critical patent/JPH0368138A/en
Application granted granted Critical
Publication of JP2827305B2 publication Critical patent/JP2827305B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Description

【発明の詳細な説明】 〔概要〕 洗浄装置,とくに、半導体装置の製造プロセスにおい
て使用する洗浄装置に関し、 洗浄槽の洗浄液表面に浮遊する塵埃を絶えず流出除去
させて、被洗浄物への塵埃の付着を無くすることを目的
とし、 上面が開口し内部に洗浄液供給口とバブリング用ガス
供給口とを少なくとも備えた洗浄槽と、前記洗浄槽の一
方の上端縁に沿って平行に配置された吹き出し口を有す
るガス吹き出しユニットと、前記洗浄槽の一方の上端縁
に対向する他の上端縁に沿って前記吹き出し口に対面し
て配置された吸引口を有する真空吸引ユニットとを少な
くとも有し、前記吹き出し口から吹き出されたガスが前
記洗浄槽に満たされた洗浄液の表面上を流れて前記吸引
口から吸引されるように構成された洗浄装置とする。
DETAILED DESCRIPTION OF THE INVENTION [Summary] A cleaning device, particularly a cleaning device used in a semiconductor device manufacturing process, constantly removes dust floating on the surface of a cleaning liquid in a cleaning tank and removes the dust to an object to be cleaned. A cleaning tank having an opening at an upper surface and having at least a cleaning liquid supply port and a bubbling gas supply port therein for the purpose of eliminating adhesion, and a blowout arranged in parallel along one upper end edge of the cleaning tank. A gas blowing unit having a port, and at least a vacuum suction unit having a suction port arranged to face the blowing port along another upper edge facing one upper edge of the cleaning tank, The cleaning device is configured such that the gas blown out from the blowout port flows on the surface of the cleaning liquid filled in the cleaning tank and is sucked from the suction port.

〔産業上の利用分野〕[Industrial applications]

本発明は、半導体装置等の製造プロセスにおいて使用
する洗浄装置の改良に関する。
The present invention relates to an improvement of a cleaning apparatus used in a manufacturing process of a semiconductor device or the like.

近年、半導体集積回路(IC)はますます大規模化し、
集積度も高まる一方である。したがって、その製造プロ
セスもますますデリケート、かつ、困難になってきてい
る。
In recent years, semiconductor integrated circuits (ICs) have become larger and larger,
The degree of integration is also increasing. Therefore, its manufacturing process is also becoming increasingly delicate and difficult.

ICの製造プロセスには多くの装置が使用されている
が、基板ウエーハは勿論のこと露光用のマスクを洗浄す
るために洗浄装置が種々の製造プロセスにおいて使用さ
れている。
Many devices are used in an IC manufacturing process, and a cleaning device is used in various manufacturing processes to clean a mask for exposure as well as a substrate wafer.

ICを製造する上で、塵埃の混入防止は最も注意を必要
とされるものであり、洗浄装置の清浄度の向上がますま
す求められている。
In the manufacture of ICs, the prevention of dust is the most important issue, and there is an increasing demand for improved cleanliness of cleaning equipment.

〔従来の技術〕[Conventional technology]

第2図は従来の洗浄装置を説明する図で、同図(イ)
は上面図、同図(ロ)はA−A′断面図である。
FIG. 2 is a view for explaining a conventional cleaning apparatus.
1 is a top view, and FIG. 1B is a cross-sectional view along AA '.

図中、1は洗浄槽、11は洗浄液供給口で,図示してな
い洗浄液の供給装置に連結されている。
In the figure, reference numeral 1 denotes a cleaning tank, and 11 denotes a cleaning liquid supply port, which is connected to a cleaning liquid supply device (not shown).

12はバブリング用ガス供給口で,図示してないバブリ
ング用ガス供給装置に連結されている。6は孔あき中隔
板で洗浄槽1の底面からやゝ上方にほゞ水平に固定され
ており、その面内には多数の数mmφの貫通した孔61が穿
孔されている。4は洗浄液である。
A bubbling gas supply port 12 is connected to a bubbling gas supply device (not shown). Reference numeral 6 denotes a perforated septum, which is fixed substantially horizontally above the bottom of the washing tank 1 and has a large number of through-holes 61 having a diameter of several mm in the plane. Reference numeral 4 denotes a cleaning solution.

100は洗浄治具で、被洗浄物,たとえば、露光用の拡
大マスク(以後レチクルと言う)を収容するホルダーで
ある。
Reference numeral 100 denotes a cleaning jig, which is a holder for accommodating an object to be cleaned, for example, an enlarged mask for exposure (hereinafter referred to as a reticle).

第3図は洗浄治具とレチクルの載置状態を示す図で、
上記で説明した洗浄槽1から取り出した状態を示したも
のである。図中、100は洗浄治具、101は洗浄槽1への出
し入れのための把手、200は洗浄治具100に載置されたレ
チクルである。
FIG. 3 is a view showing a mounting state of a cleaning jig and a reticle.
It shows a state taken out of the cleaning tank 1 described above. In the figure, 100 is a cleaning jig, 101 is a handle for taking in and out of the cleaning tank 1, and 200 is a reticle mounted on the cleaning jig 100.

いま、レチクル200を載置した洗浄治具100を把手101
を用いて、第2図に示したように洗浄槽1内に静かに入
れ、洗浄液供給口11から洗浄液4,たとえば、純水を流す
と純水は洗浄槽1を満たしてやがて上端の縁からオーバ
ーフローして流れ落ち、一方、底面の洗浄液供給口11か
らは絶えず新鮮な純水が供給されレチクルの洗浄が行な
われる。このとき同時に、バブリング用ガス供給口12か
らバブリング用ガス,たとえば、清浄な窒素ガスを流し
て洗浄液4の中にバブリングさせることによって、一層
洗浄効果を高めるようにしている。
Now, the cleaning jig 100 on which the reticle 200 has been placed is
As shown in FIG. 2, the cleaning liquid is gently put into the cleaning tank 1 as shown in FIG. 2, and the cleaning liquid 4, for example, pure water is supplied from the cleaning liquid supply port 11, and the pure water fills the cleaning tank 1 and then flows from the upper edge. On the other hand, the pure water is continuously supplied from the cleaning liquid supply port 11 on the bottom surface to wash the reticle. At the same time, a bubbling gas, for example, a clean nitrogen gas is allowed to flow from the bubbling gas supply port 12 to bubble into the cleaning liquid 4 to further enhance the cleaning effect.

なお、孔あき中隔板6が適当な高さに設けられてお
り、そこには貫通した多数の孔61がランダムに明けられ
ているので、純水と窒素ガスは洗浄槽1の中に万遍なく
行き渡るようになっている。
A perforated septum plate 6 is provided at an appropriate height, and a number of holes 61 penetrating therethrough are formed at random. It has become evenly distributed.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

しかし、上記従来の洗浄装置において、たとえば、純
水をオーバーフローさせていても、洗浄槽1の上端の縁
やコーナーの淀みの部分に小さな塵埃が僅かに付着した
り、淀んでうまく流れ落ちないことがある。
However, in the above-described conventional cleaning apparatus, for example, even when pure water overflows, small dust may adhere slightly to the edge of the upper end of the cleaning tank 1 or the stagnation portion of the corner, or the stagnation does not flow down well. is there.

第2図(イ)にそのような状態の例を×点のゴミ300
として示した。
FIG. 2 (a) shows an example of such a state in a garbage 300 with a dot.
As shown.

このようなゴミ300があると、洗浄治具100を洗浄槽1
から引き上げたあと、第3図のレチクル面に示した×点
のゴミ300のごとく、洗浄後のレチクル200上に汚れとし
て残り、最終製品の歩留りと品質・信頼性の低下などを
招くという重大な問題があり、その解決が必要であっ
た。
If there is such dust 300, the cleaning jig 100 is moved to the cleaning tank 1
After being lifted from the reticle, it remains as dirt on the reticle 200 after cleaning, as shown by the x-point dust 300 shown on the reticle surface in FIG. 3, which seriously reduces the yield and quality / reliability of the final product. There was a problem that needed to be resolved.

〔課題を解決するための手段〕[Means for solving the problem]

上記の課題は、上面が開口し内部に洗浄液供給口とバ
ブリング用ガス供給口とを少なくとも備えた洗浄槽と、
前記洗浄槽の一方の上端縁に沿って平行に配置された吹
き出し口を有するガス吹き出しユニットと、前記洗浄槽
の一方の上端縁に対向する他の上端縁に沿って前記吹き
出し口に対面して配置された吸引口を有する真空吸引ユ
ニットとを少なくとも有し、前記吹き出し口から吹き出
されたガスが前記洗浄槽に満たされた洗浄液の表面上を
流れて前記吸引口から吸引されるように構成された洗浄
装置とすることによって解決することができる。
The above problem is to provide a cleaning tank provided with at least a cleaning liquid supply port and a gas supply port for bubbling inside the upper surface is opened,
A gas blowing unit having a blowing port arranged in parallel along one upper edge of the cleaning tank, and facing the blowing port along another upper edge facing one upper edge of the cleaning tank. A vacuum suction unit having a suction port disposed therein, wherein the gas blown from the blowout port flows on the surface of the cleaning liquid filled in the cleaning tank and is sucked from the suction port. The problem can be solved by using a cleaning device.

〔作用〕[Action]

本発明によれば、洗浄槽1の上端の縁やコーナーの淀
みの部分に、僅かに付着したり、あるいは淀んでうまく
流れ落ちない小さな塵埃を、オーバーフローしている洗
浄液の表面に沿ってガス層流5を必要な強さで流すの
で、前記の淀んだり縁に付着したりする塵埃を、洗浄液
の全表面上から強制的に吹き流して除去させることがで
きる。
According to the present invention, a small dust that adheres slightly or stagnates and does not flow down well to the stagnation portion of the upper end edge or corner of the cleaning tank 1 is subjected to gas laminar flow along the surface of the overflowing cleaning liquid. Since the liquid 5 flows at a required strength, the dust that has stagnated or adhered to the edge can be forcibly blown off from the entire surface of the cleaning liquid to be removed.

〔実施例〕〔Example〕

第1図は本発明の実施例を示す図で、同図(イ)は上
面図、同図(ロ)はA−A′断面図である。
FIG. 1 is a view showing an embodiment of the present invention. FIG. 1 (a) is a top view, and FIG. 1 (b) is a sectional view taken along the line AA '.

図中、1は洗浄槽で,たとえば、大きさ300×300×30
0mmのガラスまたはテフロン製の容器、11は洗浄液供給
口で,たとえば、内径10mmφのテフロン製のパイプを経
由して、こゝには図示してない洗浄液の供給装置に連結
されている。12はバブリング用ガス供給口で,たとえ
ば、同じく内径10mmφのテフロン製のパイプを経由し
て、こゝには図示してないバブリング用ガス供給装置に
連結されている。6は孔あき中隔板で洗浄槽1の底面か
らやゝ上方,たとえば、50mmの位置にほゞ水平に固定さ
れた,たとえば、厚さ10mmのテフロン製の板で、その面
内には多数の9mmφの貫通した孔61が穿孔されている。
4は洗浄液,たとえば、純水である。
In the figure, 1 is a washing tank, for example, 300 × 300 × 30
A 0 mm glass or Teflon container 11, which is a cleaning liquid supply port, is connected to a cleaning liquid supply device (not shown) through, for example, a Teflon pipe having an inner diameter of 10 mmφ. Reference numeral 12 denotes a bubbling gas supply port, which is connected to a bubbling gas supply device (not shown) through, for example, a Teflon pipe also having an inner diameter of 10 mmφ. Reference numeral 6 denotes a perforated septum plate, for example, a 10 mm-thick Teflon plate fixed approximately horizontally above the bottom surface of the washing tank 1, for example, at a position of 50 mm, for example, with a thickness of 10 mm. 9 mmφ penetrated hole 61 is drilled.
Reference numeral 4 denotes a cleaning liquid, for example, pure water.

2はガス吹き出しユニットで,たとえば、テフロンま
たは硬質塩ビ製であり、洗浄槽1の一方の上端縁13aに
沿って平行に配置されたガス層流5の吹き出し口21を有
し、ガス吹き出し口21の反対側は清浄ガス,たとえば、
清浄空気を送り込む、図には示していない送風機に連結
されている。
Reference numeral 2 denotes a gas blowing unit, which is made of, for example, Teflon or rigid PVC, and has a gas laminar flow 5 outlet 21 arranged in parallel along one upper edge 13a of the cleaning tank 1, and a gas outlet 21. On the other side is a clean gas, for example
It is connected to a blower (not shown) for feeding clean air.

3は真空吸引ユニットで,たとえば、テフロンまたは
硬質塩ビ製であり、洗浄槽1の一方の上端縁13aに対向
する他の上端縁13bに沿って、前記ガス層流5の吹き出
し口21に対面して配置された前記ガス層流5の吸引口31
を有し、ガス吸引口31の反対側はガス層流5,すなわち、
清浄空気を吸引する、図には示しいない,たとえば、真
空ポンプに連結されている。
Reference numeral 3 denotes a vacuum suction unit, which is made of, for example, Teflon or hard PVC, and faces the outlet 21 of the gas laminar flow 5 along another upper edge 13b opposite to one upper edge 13a of the cleaning tank 1. Suction port 31 of the gas laminar flow 5 arranged
And the other side of the gas suction port 31 is a gas laminar flow 5, that is,
It is connected to a vacuum pump, not shown, for sucking clean air.

なお、実施例図のガス吹き出し口21は孔を一列に穿っ
てあるが、これは孔とは限らず一様な巾のスリットであ
ってもよい。
In addition, although the gas blowing port 21 in the embodiment diagram has holes formed in a line, the holes are not limited to holes and may be slits having a uniform width.

また、吹き出し口21と吸引口31の寸法や配置について
は、洗浄液4の表面に沿って、できるだけ平行に一様な
清浄空気の流れができて、それによって洗浄液4の表面
に強制的な液の流れが生じるようになるものであれば、
それらの間隔,高さ,巾,清浄空気の流量や流速は適宜
最適に設定すればよいことは勿論である。
Regarding the dimensions and arrangement of the blow-out port 21 and the suction port 31, a uniform flow of clean air can be generated as parallel as possible along the surface of the cleaning liquid 4, thereby forcing the liquid on the surface of the cleaning liquid 4. If the flow is going to happen,
Needless to say, the interval, height, width, flow rate and flow rate of the clean air may be appropriately set as appropriate.

いま、被洗浄物,たとえば、厚さ2.3mmで大きさ150×
150mmの石英ガラス製のレチクル200を第3図に示したの
と同様に、洗浄治具100に載置し把手101を用いて、第2
図に示したのと同様に洗浄槽1内に静かに入れ、洗浄液
供給口11から洗浄液4,たとえば、純水を流すと純水は洗
浄槽1を満たしてやがて上端の縁からオーバーフローし
て流れ落ち、一方、底面の洗浄液供給口11からは絶えず
新鮮な純水が供給されレチクルの洗浄が行なわれる。
Now, the object to be cleaned, for example, having a thickness of 2.3 mm and a size of 150 ×
A reticle 200 made of quartz glass of 150 mm is placed on a cleaning jig 100 in the same manner as shown in FIG.
As shown in the figure, the cleaning liquid is gently introduced into the cleaning tank 1, and the cleaning liquid 4, for example, pure water is supplied from the cleaning liquid supply port 11. The pure water fills the cleaning tank 1 and eventually overflows from the upper edge to flow down. On the other hand, fresh pure water is constantly supplied from the cleaning liquid supply port 11 on the bottom surface, and the reticle is cleaned.

このとき同時に、バブリング用ガス供給口12からバブ
リング用ガス,たとえば、清浄な窒素ガスを流して洗浄
液4の中にバブリングさせる。
At the same time, a bubbling gas, for example, a clean nitrogen gas is allowed to flow from the bubbling gas supply port 12 to bubble into the cleaning liquid 4.

さらに、ガス噴き出しユニット2が連結されている,
こゝには図示してない送風機を動作させ、たとえば、清
浄空気を吹き出し口21から吹き出し、一方、それに対面
して配置された真空吸引ユニット31の吸引口31から前記
清浄空気を、こゝには図示されていない真空ポンプで吸
引して、洗浄槽1の洗浄液の表面に沿って出来るだけ一
様な清浄空気の層流5を形成させる。
Further, a gas blowing unit 2 is connected,
In this case, a blower (not shown) is operated, and for example, the clean air is blown out from a blowout port 21, while the clean air is blown out from a suction port 31 of a vacuum suction unit 31 arranged facing the blower. Is sucked by a vacuum pump (not shown) to form a laminar flow 5 of clean air as uniform as possible along the surface of the cleaning liquid in the cleaning tank 1.

なお、本実施例装置は通常行なわれるようにクリーン
ブース内において使用した。
The apparatus of this embodiment was used in a clean booth as usual.

以上の如く本実施例の洗浄装置を動作させることによ
って、液面の一部に淀んだり洗浄槽の上端の縁に付着し
たりする塵埃を、洗浄液の全表面上から強制的に吹き流
して除去させることができ、したがって、レチクル200
を洗浄槽1から引き上げたあと、レチクル200上の塵埃
による汚れは,たとえば、顕微鏡検査の結果,0.5〜2μ
mの大きさのゴミ付着量の検出で評価した場合、従来の
洗浄装置を用いた場合の1/5以下となり大巾な改善が見
られた。
As described above, by operating the cleaning apparatus of the present embodiment, dust that is stuck on a part of the liquid surface or adheres to the upper edge of the cleaning tank is forcibly blown off from the entire surface of the cleaning liquid to be removed. Can, therefore, reticle 200
After being lifted out of the cleaning tank 1, dirt on the reticle 200 may be, for example, 0.5 to 2 μm as a result of a microscopic inspection.
When the evaluation was performed by detecting the amount of attached dust having a size of m, it was 1/5 or less of the case where the conventional cleaning device was used, and a large improvement was observed.

なお、上記実施例装置において、材料,寸法,形状な
どは一例を示したものであり,他のもの或いはそれらの
組み合わせを適宜用いてもよいことは勿論である。
In the above-described embodiment, the materials, dimensions, shapes, and the like are merely examples, and other materials or combinations thereof may be used as appropriate.

〔発明の効果〕〔The invention's effect〕

以上述べたように、本発明によれば、洗浄槽1の上端
の縁やコーナーの淀みの部分に、僅かに付着したり、あ
るいは淀んでうまく流れ落ちない小さな塵埃を、オーバ
ーフローしている洗浄液の表面に沿ってガス層流5を必
要な強さで流すので、前記の淀んだり縁に付着したりす
る塵埃を、洗浄液の全表面上から強制的に吹き流して除
去させることができる。したがって、被洗浄物への汚れ
が残る恐れが極めて小さくなり、ICなど高性能製品の歩
留り、品質および信頼性の向上に寄与するところが極め
て大きい。
As described above, according to the present invention, small dust that is slightly adhered or stagnates and does not flow down well on the edge of the upper end or the stagnation of the corner of the cleaning tank 1 is removed from the surface of the overflowing cleaning liquid. The gas laminar flow 5 is flowed along with the required strength, so that the dust that is stagnant or adheres to the edge can be forcibly blown off from the entire surface of the cleaning liquid to be removed. Therefore, the possibility that stains remain on the object to be cleaned is extremely reduced, and this greatly contributes to improving the yield, quality, and reliability of high-performance products such as ICs.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の実施例を示す図、 第2図は従来の洗浄装置を説明する図、 第3図は洗浄治具とレチクルの載置状態を示す図であ
る。 図において、 1は洗浄槽、 2はガス吹き出しユニット、 3は真空吸引ユニット、 4は洗浄液、 5はガス層流、 6は孔あき中隔板、 11は洗浄液供給口、 12はバブリング用ガス供給口、 13(13a,13b)は上端縁、 21は吹き出し口、31は吸引口、 61は孔である。
FIG. 1 is a view showing an embodiment of the present invention, FIG. 2 is a view for explaining a conventional cleaning apparatus, and FIG. 3 is a view showing a mounted state of a cleaning jig and a reticle. In the figure, 1 is a cleaning tank, 2 is a gas blowing unit, 3 is a vacuum suction unit, 4 is a cleaning liquid, 5 is a gas laminar flow, 6 is a perforated septum, 11 is a cleaning liquid supply port, and 12 is a bubbling gas supply. The mouth 13 (13a, 13b) is the upper edge, 21 is the outlet, 31 is the suction port, and 61 is the hole.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】上面が開口し内部に洗浄液供給口とバブリ
ング用ガス供給口とを少なくとも備えた洗浄槽と、前記
洗浄槽の一方の上端縁に沿って平行に配置された吹き出
し口を有するガス吹き出しユニットと、前記洗浄槽の一
方の上端縁に対向する他の上端縁に沿って前記吹き出し
口に対面して配置された吸引口を有する真空吸引ユニッ
トとを少なくとも有し、前記吹き出し口から吹き出され
たガスが前記洗浄槽に満たされた洗浄液の表面上を流れ
て前記吸引口から吸引されるように構成されていること
を特徴とする洗浄装置。
1. A gas having a cleaning tank provided with at least an cleaning liquid supply port and a bubbling gas supply port therein, and a blow-out port arranged in parallel along one upper edge of the cleaning tank. A blow-off unit, and at least a vacuum suction unit having a suction port arranged to face the blow-out port along another upper end edge opposite to one upper-end edge of the cleaning tank, and blows out from the blow-out port. The cleaning apparatus is characterized in that the discharged gas flows on the surface of the cleaning liquid filled in the cleaning tank and is sucked from the suction port.
JP20317689A 1989-08-05 1989-08-05 Cleaning equipment Expired - Lifetime JP2827305B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20317689A JP2827305B2 (en) 1989-08-05 1989-08-05 Cleaning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20317689A JP2827305B2 (en) 1989-08-05 1989-08-05 Cleaning equipment

Publications (2)

Publication Number Publication Date
JPH0368138A JPH0368138A (en) 1991-03-25
JP2827305B2 true JP2827305B2 (en) 1998-11-25

Family

ID=16469719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20317689A Expired - Lifetime JP2827305B2 (en) 1989-08-05 1989-08-05 Cleaning equipment

Country Status (1)

Country Link
JP (1) JP2827305B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4535296A (en) * 1995-01-10 1996-07-31 Klaus Gorke Installation and method for washing contaminated soil or similar materials and for cleaning equipment parts or similar components which come into contact with fluids
CN105127139B (en) * 2015-07-27 2018-03-06 句容骏成电子有限公司 LCD product surface cleaning devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58132934A (en) * 1982-02-03 1983-08-08 Nec Corp Method of washing semiconductor wafer
JPS59188924A (en) * 1983-04-11 1984-10-26 Hitachi Ltd Cleaning tank
JPS6310529A (en) * 1986-07-01 1988-01-18 Mitsubishi Electric Corp Cleaning equipment
JPS647622A (en) * 1987-06-30 1989-01-11 Nec Corp Device for treatment of semiconductor substrate

Also Published As

Publication number Publication date
JPH0368138A (en) 1991-03-25

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