JPH0367451U - - Google Patents
Info
- Publication number
- JPH0367451U JPH0367451U JP1989130092U JP13009289U JPH0367451U JP H0367451 U JPH0367451 U JP H0367451U JP 1989130092 U JP1989130092 U JP 1989130092U JP 13009289 U JP13009289 U JP 13009289U JP H0367451 U JPH0367451 U JP H0367451U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- frame
- lead
- semiconductor device
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
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- H10W72/5449—
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- H10W72/932—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130092U JPH0367451U (enExample) | 1989-11-06 | 1989-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130092U JPH0367451U (enExample) | 1989-11-06 | 1989-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367451U true JPH0367451U (enExample) | 1991-07-01 |
Family
ID=31677687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989130092U Pending JPH0367451U (enExample) | 1989-11-06 | 1989-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367451U (enExample) |
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1989
- 1989-11-06 JP JP1989130092U patent/JPH0367451U/ja active Pending