JPH0366U - - Google Patents
Info
- Publication number
- JPH0366U JPH0366U JP5748389U JP5748389U JPH0366U JP H0366 U JPH0366 U JP H0366U JP 5748389 U JP5748389 U JP 5748389U JP 5748389 U JP5748389 U JP 5748389U JP H0366 U JPH0366 U JP H0366U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- terminal
- frequency component
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989057483U JPH0720943Y2 (ja) | 1989-05-18 | 1989-05-18 | 多層プリント配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989057483U JPH0720943Y2 (ja) | 1989-05-18 | 1989-05-18 | 多層プリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0366U true JPH0366U (pt-PT) | 1991-01-07 |
JPH0720943Y2 JPH0720943Y2 (ja) | 1995-05-15 |
Family
ID=31582230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989057483U Expired - Lifetime JPH0720943Y2 (ja) | 1989-05-18 | 1989-05-18 | 多層プリント配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0720943Y2 (pt-PT) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003283093A (ja) * | 2002-03-22 | 2003-10-03 | Mitsubishi Electric Corp | 多層プリント配線板 |
JP2006337159A (ja) * | 2005-06-01 | 2006-12-14 | Nippon Eng Kk | プリント配線基板、及び、半導体試験装置 |
KR101270268B1 (ko) * | 2011-06-07 | 2013-06-04 | 대한민국 | 발 받침대 |
JP2018085244A (ja) * | 2016-11-24 | 2018-05-31 | 日本航空電子工業株式会社 | 同軸コネクタおよびコネクタ組立体 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59191764U (ja) * | 1983-06-06 | 1984-12-19 | 株式会社日立製作所 | 湿式多層セラミツク基板 |
JPS59191765U (ja) * | 1983-06-06 | 1984-12-19 | 株式会社日立製作所 | 湿式多層セラミツク基板 |
JPS6073270U (ja) * | 1983-10-25 | 1985-05-23 | デイエツクスアンテナ株式会社 | 高周波用icのプリント基板への取付構造 |
JPS6265868U (pt-PT) * | 1985-10-15 | 1987-04-23 |
-
1989
- 1989-05-18 JP JP1989057483U patent/JPH0720943Y2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59191764U (ja) * | 1983-06-06 | 1984-12-19 | 株式会社日立製作所 | 湿式多層セラミツク基板 |
JPS59191765U (ja) * | 1983-06-06 | 1984-12-19 | 株式会社日立製作所 | 湿式多層セラミツク基板 |
JPS6073270U (ja) * | 1983-10-25 | 1985-05-23 | デイエツクスアンテナ株式会社 | 高周波用icのプリント基板への取付構造 |
JPS6265868U (pt-PT) * | 1985-10-15 | 1987-04-23 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003283093A (ja) * | 2002-03-22 | 2003-10-03 | Mitsubishi Electric Corp | 多層プリント配線板 |
JP2006337159A (ja) * | 2005-06-01 | 2006-12-14 | Nippon Eng Kk | プリント配線基板、及び、半導体試験装置 |
KR101270268B1 (ko) * | 2011-06-07 | 2013-06-04 | 대한민국 | 발 받침대 |
JP2018085244A (ja) * | 2016-11-24 | 2018-05-31 | 日本航空電子工業株式会社 | 同軸コネクタおよびコネクタ組立体 |
Also Published As
Publication number | Publication date |
---|---|
JPH0720943Y2 (ja) | 1995-05-15 |