JPH0276866U - - Google Patents
Info
- Publication number
- JPH0276866U JPH0276866U JP15756688U JP15756688U JPH0276866U JP H0276866 U JPH0276866 U JP H0276866U JP 15756688 U JP15756688 U JP 15756688U JP 15756688 U JP15756688 U JP 15756688U JP H0276866 U JPH0276866 U JP H0276866U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- outer periphery
- notch
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15756688U JPH0276866U (pt-PT) | 1988-12-01 | 1988-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15756688U JPH0276866U (pt-PT) | 1988-12-01 | 1988-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276866U true JPH0276866U (pt-PT) | 1990-06-13 |
Family
ID=31437120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15756688U Pending JPH0276866U (pt-PT) | 1988-12-01 | 1988-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276866U (pt-PT) |
-
1988
- 1988-12-01 JP JP15756688U patent/JPH0276866U/ja active Pending