JPH0364387A - Adhesive tape for electronic component and liquid adhesive - Google Patents
Adhesive tape for electronic component and liquid adhesiveInfo
- Publication number
- JPH0364387A JPH0364387A JP1200253A JP20025389A JPH0364387A JP H0364387 A JPH0364387 A JP H0364387A JP 1200253 A JP1200253 A JP 1200253A JP 20025389 A JP20025389 A JP 20025389A JP H0364387 A JPH0364387 A JP H0364387A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- epoxy resin
- resin
- type
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 54
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 42
- 239000007788 liquid Substances 0.000 title claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 239000005011 phenolic resin Substances 0.000 claims abstract description 20
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229920001577 copolymer Polymers 0.000 claims abstract description 15
- 229930003836 cresol Natural products 0.000 claims abstract description 15
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 14
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920003987 resole Polymers 0.000 claims abstract description 12
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 13
- 239000004843 novolac epoxy resin Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 4
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 claims 2
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical group CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 claims 1
- 229920003986 novolac Polymers 0.000 abstract description 3
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 102100026459 POU domain, class 3, transcription factor 2 Human genes 0.000 description 1
- 101710133394 POU domain, class 3, transcription factor 2 Proteins 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、主に樹脂封止型半導体装置内において使用さ
れる電子部品用接着テープ及び液状接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an adhesive tape and a liquid adhesive for electronic components used mainly in resin-sealed semiconductor devices.
従来の技術
従来、樹脂封止型半導体装置内において使用されてきた
接着テープには、リードフレーム固定用接着テープ、Ｔ
ＡＢテープ等があり、例えば、リードフレーム固定用接
着テープの場合は、リードフレームのリードビンを固定
し、リードフレーム自体及び半導体アセンブリ工程全体
の生産歩留まり及び生産性の向上を目的として使用され
ており、一般にリードフレームメーカーでリードフレー
ム上にテーピングされ、半導体メーカーに持ち込まれて
ＩＣ搭載後、樹脂封止される。そのためリードフレーム
固定用接着テープには、半導体レベルでの一般的な信頼
性及びテーピング時の作業性等は勿論のこと、テーピン
グ直後の十分な室温接着力、ＩＣ組立て工程での加熱に
耐える十分な耐熱性等が要求される。Prior Art Adhesive tapes conventionally used in resin-sealed semiconductor devices include adhesive tape for fixing lead frames, T
There are AB tapes, etc. For example, in the case of lead frame fixing adhesive tape, it is used for the purpose of fixing the lead bin of the lead frame and improving the production yield and productivity of the lead frame itself and the entire semiconductor assembly process. Generally, it is taped onto a lead frame by a lead frame manufacturer, and then taken to a semiconductor manufacturer where an IC is mounted and then sealed with resin. Therefore, the adhesive tape for fixing lead frames must not only have general reliability at the semiconductor level and workability during taping, but also sufficient room temperature adhesive strength immediately after taping, and sufficient strength to withstand the heating during the IC assembly process. Heat resistance etc. are required.
従来、このような用途に使用される接着テープとしては
、例えば、ポリイミドフィルム等の支持体フィルム上に
、ポリアクリロニトリル、ポリアクリル酸エステル或い
はアクリロニトリル−ブタジエン共重合体等の合成ゴム
系樹脂等を単独又は他の樹脂で変性したもの、或いは他
の樹脂と混合した接着剤を塗工し、Ｂステージ状態とし
たものが使用されてきた。Conventionally, adhesive tapes used for such purposes include, for example, a synthetic rubber resin such as polyacrylonitrile, polyacrylic acid ester, or acrylonitrile-butadiene copolymer on a support film such as a polyimide film. Alternatively, materials modified with other resins, or materials coated with an adhesive mixed with other resins and brought into a B-stage state have been used.
発明が解決しようとする課題
ところが、最近になって、第１図〜第３図に示されるよ
うな構造のプラスチックパッケージが開発または製造さ
れるようになってきている。第１図においては、リード
ビン３とブレーン２とが、接着層６によって接続され、
半導体チップｌがプレーン２上に搭載されており、半導
体チップ１とリードビン３との間のボンディングワイヤ
ー４と共に、樹脂５によって封止された構造を有してい
る。第２図においては、リードフレームのリードビン３
が半導体チップ１と接着層Ｂによって固定されており、
ボンディングワイヤー４と共に、樹脂５によって封止さ
れた構造を有している。また第３図においては、ダイパ
ッド７の上に半導体チップ１が搭載され、また電極８が
接着層６によって固定されており、そして、半導体チッ
プ１と電極８との間及び電極８とリードビン３との間が
、それぞれボンディングワイヤー４．４によって連結さ
れ、それ等が樹脂５によって封止された構造を有してい
る。Problems to be Solved by the Invention Recently, however, plastic packages having structures as shown in FIGS. 1 to 3 have been developed or manufactured. In FIG. 1, the lead bin 3 and the brain 2 are connected by an adhesive layer 6,
A semiconductor chip 1 is mounted on a plane 2, and has a structure in which it is sealed with a resin 5 together with a bonding wire 4 between the semiconductor chip 1 and a lead bin 3. In FIG. 2, lead bin 3 of the lead frame is shown.
is fixed by the semiconductor chip 1 and the adhesive layer B,
It has a structure in which the bonding wire 4 and the bonding wire 4 are sealed together with a resin 5. Further, in FIG. 3, the semiconductor chip 1 is mounted on the die pad 7, and the electrode 8 is fixed by the adhesive layer 6. They are connected by bonding wires 4.4, and are sealed with resin 5.
これ等第１図ないし第３図に示される構造のプラスチッ
クパッケージにおける接着層において、従来の接着剤を
塗布した接着テープを使用した場合には、耐熱性、高温
時の接着力等が十分でない等の問題があった。また、ポ
リイミド樹脂などを適用した場合には、その貼り合わせ
温度や圧力、ポリイミド樹脂の硬化条件等が厳しく、他
の金属材料を損傷する恐れがあった。したがって、比較
的低温で接着、硬化でき、十分な耐熱性、信頼性等を有
する接着剤の開発が望まれていた。If conventional adhesive tape coated with adhesive is used in the adhesive layer of a plastic package with the structure shown in Figures 1 to 3, heat resistance and adhesive strength at high temperatures may not be sufficient. There was a problem. Furthermore, when polyimide resin or the like is used, the bonding temperature and pressure, curing conditions for the polyimide resin, etc. are severe, and there is a risk of damaging other metal materials. Therefore, it has been desired to develop an adhesive that can be bonded and cured at a relatively low temperature and has sufficient heat resistance, reliability, etc.
本発明は、従来の上記のような問題点に鑑みてなされた
ものである。The present invention has been made in view of the above-mentioned conventional problems.
したがって、本発明の目的は、比較的低温で接着、硬化
でき、十分な耐熱性、信頼性等を有する電子部品用接着
剤及び及びそれを用いた電子部品用接着テープを提供す
ることにある。Therefore, an object of the present invention is to provide an adhesive for electronic components that can be bonded and cured at a relatively low temperature and has sufficient heat resistance, reliability, etc., and an adhesive tape for electronic components using the same.
課題を解決するための手段
本発明者等は、上記のような問題点を解決するために検
討した結果、接着剤として、アクリロニトリル−ブタジ
エン共重合体とレゾール型フェノール樹脂及びエポキシ
樹脂を共用する系を使用した場合に、■接着温度を比較
的低温にできる、■接着剤の硬化温度を低温化できる、
■高温時の接着力が高い、等の利点があり、上記第１図
ないし第３図に示される半導体プラスチックパッケージ
に用いた場合、上記の目的が達成されることを見出し、
本発明を完成するに至った。Means for Solving the Problems As a result of studies to solve the above-mentioned problems, the present inventors have developed a system that uses acrylonitrile-butadiene copolymer, resol type phenol resin, and epoxy resin as an adhesive. When using, ■ the bonding temperature can be made relatively low, ■ the curing temperature of the adhesive can be made low,
■It has been discovered that it has advantages such as high adhesive strength at high temperatures, and that the above objectives can be achieved when used in semiconductor plastic packages shown in Figures 1 to 3 above.
The present invention has now been completed.
本発明の第１及び第２のものは、電子部品用接着テープ
に関するものであり、第３のものは電子部品用液状接着
剤に関するものである。The first and second aspects of the present invention relate to an adhesive tape for electronic components, and the third aspect of the present invention relates to a liquid adhesive for electronic components.
即ち、第１の発明の電子部品用接着テープは、耐熱性フ
ィルムの少なくとも一面に、アクリロニトリル−ブタジ
エン共重合体１００重量部に対して、レゾール型フェノ
ール樹脂１０〜６００重量部及びエポキシ樹脂１０〜６
００重量部を配合してなる接着層を積層してなり、該レ
ゾール型フェノール樹脂が、フェノール成分として、ク
レゾール、ビスフェノールＡ及びｐ−ｔ−ブチルフェノ
ールよりなる群から選択された１種又はそれ以上よりな
るクレゾール型、ビスフェノールＡ型、ｐ−ｔ−ブチル
フェノール型又はそれ等の共縮合型のフェノール樹脂で
あり、該エポキシ樹脂がフェノールノボラックエポキシ
樹脂及びオルトクレゾールノボラックエポキシ樹脂より
なる群から選択された少なくとも１種よりなることを特
徴とする。That is, in the adhesive tape for electronic components of the first invention, 10 to 600 parts by weight of a resol type phenolic resin and 10 to 6 parts by weight of an epoxy resin are added to at least one surface of a heat-resistant film based on 100 parts by weight of an acrylonitrile-butadiene copolymer.
00 parts by weight, and the resol type phenolic resin contains one or more selected from the group consisting of cresol, bisphenol A, and pt-butylphenol as a phenolic component. The epoxy resin is a cresol type, bisphenol A type, pt-butylphenol type or co-condensed type phenol resin, and the epoxy resin is at least one selected from the group consisting of a phenol novolac epoxy resin and an ortho-cresol novolac epoxy resin. It is characterized by consisting of seeds.
また、第２の発明の電子部品用接着テープは、剥離性フ
ィルムの一面に、上記第１発明に関して記載したと同一
の接着層を積層してなることを特徴とする。Furthermore, the adhesive tape for electronic components according to the second invention is characterized in that the same adhesive layer as described in connection with the first invention is laminated on one surface of a releasable film.
また、第３の発明の電子部品用液状接着剤は、アクリロ
ニトリル−ブタジエン共重合体１００重量部に対して、
レゾール型フェノール樹脂１０〜６００重量部及びエポ
キシ樹脂１０〜６００重量部を配合してなり、該レゾー
ル型フェノール樹脂が、フェノール成分として、クレゾ
ール、ビスフェノールＡ及びｐ−ｔ−ブチルフェノール
よりなる群から選択された１種又はそれ以上よりなるク
レゾール型、ビスフェノールＡ型、ｐ−ｔ−ブチルフェ
ノール型又はそれ等の共縮合型のフェノール樹脂であり
、該エポキシ樹脂がフェノールノボラックエポキシ樹脂
及びオルトクレゾールノボラックエポキシ樹脂よりなる
群から選択された少なくともＩＮよりなることを特徴と
する。Further, the liquid adhesive for electronic components of the third invention has the following properties based on 100 parts by weight of acrylonitrile-butadiene copolymer:
10 to 600 parts by weight of a resol type phenolic resin and 10 to 600 parts by weight of an epoxy resin are blended, and the resol type phenol resin has a phenol component selected from the group consisting of cresol, bisphenol A, and pt-butylphenol. Cresol type, bisphenol A type, pt-butylphenol type, or co-condensed type phenol resins consisting of one or more of at least IN selected from the group.
以下、本発明の詳細な説明する。まず、第１及び第２の
発明の電子部品用接着テープを作成するために使用する
第３の発明の液状接着剤について説明する。The present invention will be explained in detail below. First, the liquid adhesive of the third invention used to create the adhesive tapes for electronic components of the first and second inventions will be described.
（液状接着剤）
液状接着剤は、アクリロニトリル−ブタジエン共重合体
、レゾール型フェノール樹脂及びエポキシ樹脂の混合系
から構成される。(Liquid Adhesive) The liquid adhesive is composed of a mixed system of an acrylonitrile-butadiene copolymer, a resol type phenol resin, and an epoxy resin.
アクリロニトリル−ブタジエン共重合体としては、ニト
リル含有量が１０〜４５％、好ましくは２０〜４５％の
比較的高ニトリル含量であって、分子量５〜１００万、
好ましくは１０〜５０万のニトリルゴムが使用される。The acrylonitrile-butadiene copolymer has a relatively high nitrile content of 10 to 45%, preferably 20 to 45%, and has a molecular weight of 5 to 1 million,
Preferably, 100,000 to 500,000 nitrile rubber is used.
場合により、加熱時自己架橋性がでるように、例えばキ
ノン系、ジアルキルパーオキサイド類及びパーオキシケ
タール類等の加硫剤を含有させることができる。In some cases, vulcanizing agents such as quinones, dialkyl peroxides, and peroxyketals may be included so as to exhibit self-crosslinking properties upon heating.
レゾール型フェノール樹脂としては、フェノール成分が
、クレゾール、ビスフェノールＡＳｐ−ｔ−ブチルフェ
ノールよりなる群から選択された１種又はそれ以上より
なるクレゾール型、ビスフェノールＡ型、ｐ−ｔ−ブチ
ルフェノール型又はそれ等の共縮合型のフェノール樹脂
が使用される。The resol type phenol resin includes a cresol type, bisphenol A type, p-t-butylphenol type, or the like, in which the phenol component is one or more selected from the group consisting of cresol, bisphenol A Sp-t-butylphenol. A cocondensation type phenolic resin is used.
ビスフェノールＡ型のレゾール型フェノール樹脂は、ビ
スフェノールＡを出発物質として合成された下記の基本
骨格を有するものであって、環球法による軟化点が７０
〜９０℃のものが好適に使用される。Bisphenol A resol type phenol resin is synthesized using bisphenol A as a starting material and has the following basic skeleton, and has a softening point of 70 by the ring and ball method.
~90°C is preferably used.
ｐ−ｔ−ブチルフェノール型のレゾール型フェノール樹
脂は、ｐ−ｔ−ブチルフェノールを出発物質として合成
されたもので、下記の基本骨格を有するもので、環球法
による軟化点が８０−１．ｏｏ’ｃのものが好適に使用
される。The pt-butylphenol resol type phenol resin is synthesized using pt-butylphenol as a starting material, has the following basic skeleton, and has a softening point of 80-1. oo'c is preferably used.
また、クレゾール型のレゾール型フェノール樹脂は、ク
レゾールと、ホルムアルデヒドを出発物質として合成さ
れるものである。Further, a cresol type phenolic resin is synthesized using cresol and formaldehyde as starting materials.
本発明の接着層においては、上記レゾール型フェノール
樹脂において、フェノール成分として、上記以外の他の
フェノール成分が含まれていてもよい。例えば、ｐ−フ
ェニルフェノール型、ビフェニル型等との共縮合型のフ
ェノール樹脂が含まれていてもよい。In the adhesive layer of the present invention, the resol type phenolic resin may contain other phenol components other than those mentioned above as a phenol component. For example, a co-condensation type phenol resin with p-phenylphenol type, biphenyl type, etc. may be included.
エポキシ樹脂としては、フェノールノボラックエポキシ
樹脂及びオルトクレゾールノボラックエポキシ樹脂が使
用される。As the epoxy resin, phenol novolac epoxy resin and orthocresol novolac epoxy resin are used.
接着剤及び接＠層おけるアクリロニトリル−ブタジエン
共重合体、レゾール型フェノール樹脂及びエポキシ樹脂
の配合比率は、かなり選択許容範囲があるが、アクリロ
ニトリル−ブタジエン共重合体の添加率が多すぎると、
耐熱性が低下し、逆に少なすぎると、接着剤層をＢステ
ージまで硬化した際に、接着剤自体が脆くなり、作業性
が悪くなったり、支持体である耐熱性フィルムとの密着
性が悪くなったりする。The blending ratio of acrylonitrile-butadiene copolymer, resol type phenol resin, and epoxy resin in the adhesive and contact layer has a fairly acceptable range, but if the addition ratio of acrylonitrile-butadiene copolymer is too large,
Heat resistance decreases, and conversely, if the amount is too low, the adhesive itself becomes brittle when the adhesive layer is cured to the B stage, resulting in poor workability and poor adhesion to the heat-resistant film that is the support. It might get worse.
一方、レゾール型フェノール樹脂の添加率については、
レゾール型フェノール樹脂の添加率が多すぎると、耐熱
性フィルムとの密着性が悪くなったり、接着剤硬化後に
受ける熱履歴による接着強度の低下が著しくなったりす
る。また、添加率が少なすぎると、硬化後、接着剤の耐
熱性、特に、１ｇ１ヤング率の低下が著しくなり、目的
の用途に適さなくなる。また、エポキシ樹脂の配合比率
についても、レゾール型フェノール樹脂の場合と同様な
ことがいえる。On the other hand, regarding the addition rate of resol type phenolic resin,
If the addition rate of the resol type phenolic resin is too high, the adhesion with the heat-resistant film may deteriorate, or the adhesive strength may significantly decrease due to the heat history received after the adhesive is cured. On the other hand, if the addition rate is too low, the heat resistance of the adhesive after curing, especially the Young's modulus per gram, will drop significantly, making it unsuitable for the intended use. Furthermore, the same can be said about the blending ratio of the epoxy resin as in the case of the resol type phenolic resin.
また、エポキシ樹脂とレゾール型フェノール樹脂の配合
比率は、エポキシ樹脂中のエポキシ当量とレゾール型フ
ェノール樹脂中のフェノール性水酸基当量を充分に考慮
して決定することが重要である。つまり、エポキシ基と
フェノール性水酸基とは化学反応して耐熱性の高い結合
を作ることが予想されるが、これ等の比率が大きくずれ
ると、充分に耐熱性の高い接着剤を得ることができなく
なるからである。Further, it is important to determine the blending ratio of the epoxy resin and the resol type phenolic resin by fully considering the epoxy equivalent in the epoxy resin and the phenolic hydroxyl equivalent in the resol type phenolic resin. In other words, it is expected that the epoxy group and the phenolic hydroxyl group will chemically react to form a bond with high heat resistance, but if the ratio of these groups deviates significantly, it will not be possible to obtain an adhesive with sufficiently high heat resistance. Because it will disappear.
したがって、本発明においては、固形分換算でアクリロ
ニトリル−ブタジエン共重合体１００重量部に対して、
レゾール型フェノール樹脂１０〜６００重量部、エポキ
シ樹脂１０〜６００重量部の範囲にあることが必要であ
る。Therefore, in the present invention, based on 100 parts by weight of acrylonitrile-butadiene copolymer in terms of solid content,
It is necessary that the resol type phenolic resin be in the range of 10 to 600 parts by weight and the epoxy resin be in the range of 10 to 600 parts by weight.
本発明において、エポキシ樹脂とレゾール型フエ５ノー
ル樹脂は、硬化の過程で化学結合し、より耐熱性の高い
硬化物になることが望まれるが、ジシアンジアミドを含
有する硬化促進剤を使用することによって、接着剤の加
熱硬化条件をより穏和なものとすることができる。In the present invention, it is desired that the epoxy resin and the resol-type phenol resin chemically bond during the curing process to become a cured product with higher heat resistance, but by using a curing accelerator containing dicyandiamide. , the heat curing conditions for the adhesive can be made more gentle.
また、接着剤の高温時におけるヤング率を向上させたり
、接着テープのテーピング特性を安定化させるために、
接着剤中にフィラーを添加することができる。In addition, in order to improve the Young's modulus of adhesives at high temperatures and stabilize the taping characteristics of adhesive tapes,
Fillers can be added to the adhesive.
また、第１図ないし第３図に示すプラスチックパッケー
ジを製造する製造工程においては、接着剤の光反射率の
状態によっては、ワイヤーボンディング時にワイヤーボ
ンダーによるリードビン等の視認性が悪い場合が生じる
が、その様な場合には、接着剤中にカーボンブラックを
フィラーとして添加することが有用である。その際のカ
ーボンブラックの添加率としては、接着剤に対し、０．
０１〜１０重量％の範囲にあるのが好ましい。何故なら
ば、添加率が上記の範囲よりも少ない場合には、カーボ
ンブラック添加の効果が充分でなく、また、上記の範囲
よりも多い場合には、電気絶縁性が不十分になるなどの
問題が生じるからである。In addition, in the manufacturing process of manufacturing the plastic packages shown in FIGS. 1 to 3, depending on the state of the light reflectance of the adhesive, visibility of lead bins, etc. by the wire bonder during wire bonding may be poor. In such cases, it is useful to add carbon black as a filler to the adhesive. At that time, the addition rate of carbon black to the adhesive was 0.
It is preferably in the range of 0.01 to 10% by weight. This is because if the addition rate is less than the above range, the effect of carbon black addition will not be sufficient, and if it is more than the above range, problems such as insufficient electrical insulation may occur. This is because
上記の構成成分よりなる液状接着剤を使用して接着テー
プを作成する際には、その液状接着剤を耐熱性フィルム
の片面又は両面に、或いは剥離性フィルムの片面に塗布
し、乾燥し、Ｂステージまで硬化させればよい。その際
、塗布厚が５〜５０節、好ましくは１０〜３０應の範囲
に設定する。When making an adhesive tape using a liquid adhesive consisting of the above components, the liquid adhesive is applied to one or both sides of a heat-resistant film, or to one side of a releasable film, dried, and then All you have to do is harden it to the stage. At that time, the coating thickness is set in the range of 5 to 50 thick, preferably 10 to 30 thick.
耐熱性フィルム及び剥離性フィルムとしては、次のもの
が使用される。The following are used as the heat-resistant film and releasable film.
（耐熱性フィルム）
厚さ７．５〜１３０虜、好ましくは、１２，５〜７５如
の、例えば、ポリイミド、ポリエーテル・イミド、ポリ
フェニレンサルファイド、ポリエーテルエーテルケトン
、ポリパラバン酸及び場合によりポリエチレンテレフタ
レート等の耐熱性フィルムや、エポキシ樹脂−ガラスク
ロス、エポキシ樹脂−ポリイミド−ガラスクロス等の複
合耐熱性フィルムが使用される。(Heat-resistant film) Thickness 7.5 to 130 mm, preferably 12.5 to 75 mm, such as polyimide, polyether imide, polyphenylene sulfide, polyether ether ketone, polyparabanic acid, and optionally polyethylene terephthalate. Composite heat-resistant films such as heat-resistant films, epoxy resin-glass cloth, epoxy resin-polyimide-glass cloth, etc. are used.
耐熱性フィルムの厚さが薄すぎる場合には、接着テープ
の腰が不十分になり、接着作業などが難しくなり、また
厚さが厚ずぎる場合には、接着テープの打ち抜き性が問
題になるので上記の範囲が好ましい。If the thickness of the heat-resistant film is too thin, the adhesive tape will not have enough stiffness, making gluing work difficult, and if it is too thick, the punching performance of the adhesive tape will become a problem. Therefore, the above range is preferable.
（剥離性フィルム）
剥離性フィルムとしては、厚さ１〜２００ ｔｍ、好ま
しくはｌＯ〜１００ ｔｍのもので、第２発明において
、剥離性フィルムは仮の支持体として作用する。使用可
能な剥離性フィルムとしては、ポリプロピレンフィルム
、フッ素樹脂系フィルム、ポリエチレンフィルム、ポリ
エチレンテレフタレートフィルム、紙及び場合によって
これ等にシリコーン樹脂等で剥離性を付与したもの等が
あげられる。(Peelable Film) The peelable film has a thickness of 1 to 200 tm, preferably 10 to 100 tm, and in the second invention, the peelable film acts as a temporary support. Examples of removable films that can be used include polypropylene films, fluororesin films, polyethylene films, polyethylene terephthalate films, paper, and, in some cases, films to which removability is imparted using silicone resin or the like.
これ等剥離性フィルムは、９０″ ビール剥離強度が０
．０１〜７．０ ｇの範囲にあることが望ましい。何故
ならば、剥離強度が上記の範囲よりも低い場合には、接
着テープ搬送時に剥離性フィルムが簡単にｉｌｌ離する
などの問題があり、また、上記の範囲よりも高い場合に
は、剥離性フィルムが接着剤層から奇麗に取れず、作業
性が悪いなどの問題を起こすからである。These peelable films have a 90″ beer peel strength of 0.
．． It is desirable that the amount is in the range of 0.01 to 7.0 g. This is because if the peel strength is lower than the above range, there will be problems such as the peelable film easily peeling off during conveyance of the adhesive tape, and if it is higher than the above range, the peel strength will be poor. This is because the film cannot be removed cleanly from the adhesive layer, causing problems such as poor workability.
なお、第１発明において、耐熱性フィルムの片面又は両
面に上記液状接着剤を塗布して接着層を形成した場合に
は、接着層の上には、更に剥離性の保護フィルムを設け
てもよい。剥離性の保護フィルムとしては、上記剥離性
フィルムと同様のものが使用できる。In addition, in the first invention, when the above-mentioned liquid adhesive is applied to one or both sides of the heat-resistant film to form an adhesive layer, a removable protective film may be further provided on the adhesive layer. . As the removable protective film, the same removable film as described above can be used.
実施例
以下、本発明を実施例によって詳記する。なお、配合部
数は全て重量部である。EXAMPLES The present invention will now be described in detail by way of examples. In addition, all the blended parts are parts by weight.
１、（液状接着剤の調製）
（１）接着剤Ａ（本発明）
アクリロニトリル−ブタジエン共重合体（ＮＩＰＯｌ、
１００１、日本ゼオン調製）（ムーニー粘度＝７８、結
合アクリロニトリルｆｆ１＝４１％、数平均分子量；約
６２，０００、重量平均分子ｊｌ／数平均分子量−１２
，１）１００部、クレゾール型しゾールフエ、ノール樹
脂（ＢＫＭ−２６２０、昭和高分子仲製）（室温で固体
状樹脂、軟化点＝８２〜９９℃、５０℃でゲル化時間＝
８５〜１２５秒） ８部部、０−クレゾールノボラック
型エポキシ樹脂（ＹＤＣＮ−７０２、東部化成■製）（
エポキシ当量：２００〜３００ ｇ／ｅＱ、軟化点＝７
０〜８０℃）１００部、及びジシアンジアミド１部を、
メチルエチルケトン中に添加、混合し、充分に溶解して
固形分率３５％の液状接着剤を調製した。1. (Preparation of liquid adhesive) (1) Adhesive A (present invention) Acrylonitrile-butadiene copolymer (NIPOl,
1001, prepared by Nippon Zeon) (Mooney viscosity = 78, bonded acrylonitrile ff1 = 41%, number average molecular weight; approximately 62,000, weight average molecule jl/number average molecular weight -12
, 1) 100 parts, cresol-type Shisolphe, nor resin (BKM-2620, Showa Kobunshi Naka Co., Ltd.) (solid resin at room temperature, softening point = 82-99°C, gelling time at 50°C =
85 to 125 seconds) 8 parts, 0-cresol novolak type epoxy resin (YDCN-702, manufactured by Tobu Kasei ■) (
Epoxy equivalent: 200-300 g/eQ, softening point = 7
0 to 80°C), and 1 part of dicyandiamide,
It was added to methyl ethyl ketone, mixed, and sufficiently dissolved to prepare a liquid adhesive with a solid content of 35%.
ｂ）接着剤Ｂ（比較対照用）
ナイロンエポキシ系接着剤（トレジンＰＳ−４ｉ０、帝
国化学産業■製）（固形分率２０％、溶剤：イソプロピ
ルアルコール；メチルエチルケトン−２＝■）を用意し
た。b) Adhesive B (for comparison) A nylon epoxy adhesive (Torezin PS-4i0, manufactured by Teikoku Kagaku Sangyo ■) (solid content 20%, solvent: isopropyl alcohol; methyl ethyl ketone-2 = ■) was prepared.
Ｃ）接着剤Ｃ（比較対照用）
ポリイミド系ワニスラークＴＰＩ （三井東圧化学■
製）のＮ−メチルピロリドン２０％溶液を用意した。C) Adhesive C (for comparison) Polyimide varnish Lark TPI (Mitsui Toatsu Chemical)
A 20% N-methylpyrrolidone solution was prepared.
２、 （試験用接着テープの作成）
耐熱性フィルムとして、膜厚５０溝のポリイミドフィル
ム（アビカル５０Ａ１１、鐘淵化学■製）の上に、以下
の条件で上記した接着剤を塗布し乾燥して試験用接着テ
ープを作成した。2. (Preparation of adhesive tape for testing) As a heat-resistant film, the above adhesive was applied on a 50-groove polyimide film (Avical 50A11, manufactured by Kanebuchi Chemical) under the following conditions and dried. An adhesive tape for testing was created.
（１）接着テープ１（本発明）
上記接着剤Ａを、乾燥後の接着剤層の厚さが２０虜にな
るようにポリイミドフィルムの両面に塗布し、熱風循環
型乾燥機中にて１５０℃で１０分間乾燥して、接着テー
プ１を作成した。(1) Adhesive Tape 1 (Invention) The above adhesive A was applied to both sides of a polyimide film so that the thickness of the adhesive layer after drying was 20 mm, and the adhesive tape was heated at 150°C in a hot air circulation dryer. The adhesive tape 1 was prepared by drying for 10 minutes.
ｂ）接着テープ２（比較対照用）
上記接着剤Ｂを、乾燥後の接着剤層の厚さが２０庫にな
るようにポリイミドフィルムの両面に塗布し、熱風循環
型乾燥機中にて１５０℃で１５分間乾燥して、接着テー
プ２を作成した。b) Adhesive tape 2 (for comparison) The above adhesive B was applied to both sides of a polyimide film so that the thickness of the adhesive layer after drying was 20°C, and the adhesive tape was heated at 150°C in a hot air circulation dryer. After drying for 15 minutes, adhesive tape 2 was prepared.
Ｃ）接着テープ３（比較対照用）
上記接着剤Ｃを、乾燥後の接着剤５層の厚さが２０頭に
なるようにポリイミドフィルムの両面に塗布し、熱風循
環型乾燥機中にて１５０℃で１２０分間、次いで２５０
℃で６０分間乾燥して、接着テープ３を作成した。C) Adhesive tape 3 (for comparison) The above adhesive C was applied to both sides of a polyimide film so that the thickness of 5 layers of adhesive after drying was 20 mm, and the adhesive tape was dried for 150 mm in a hot air circulation dryer. °C for 120 min then 250 °C
Adhesive tape 3 was prepared by drying at ℃ for 60 minutes.
３、パッケージの組立て
第１図に示すパッケージに用いられるリードフレームを
、第１表に示した手順で組み立てた。3. Assembly of package The lead frame used in the package shown in FIG. 1 was assembled according to the procedure shown in Table 1.
以下余白
その後、ここで作成したリードフレームを使用し、以下
の手順でパッケージを組み立てた。リードフレーム組立
て時に、接着条件及び硬化条件が異なるのは、各接着テ
ープの特性が異なるためである。ここでは、各接着テー
プに最適の接着条件を選定し、それに基づいて接着硬化
させた。Margin below After that, using the lead frame created here, the package was assembled according to the following steps. The reason why adhesion conditions and curing conditions are different when assembling a lead frame is because the characteristics of each adhesive tape are different. Here, the optimal adhesion conditions were selected for each adhesive tape, and the adhesive was cured based on those conditions.
（１）ダイボンディング
半導体チップをダイボンディング用銀ペーストを用いて
リードフレームダイパッド部へ接着し、１５０℃で２時
間硬化させる。(1) Die bonding A semiconductor chip is bonded to a lead frame die pad using a silver paste for die bonding, and cured at 150° C. for 2 hours.
ｂ）ワイヤーボンディング
ワイヤーボンダーにより金線で半導体チップ上のワイヤ
ーパッドとリードフレームのインナーリード先端部の銀
メツキ部分とを配線する。b) Wire bonding Wire the wire pads on the semiconductor chip and the silver-plated portions of the inner lead tips of the lead frame with gold wire using a wire bonder.
Ｃ）モールディング エポキシ系モールド材でトランスファーモールドする。C) Molding Transfer mold with epoxy molding material.
ｄ）／ｉ：上げ工程
ホーミング、ダイカット、アウターリード部のメツキ等
の工程を含め、パッケージに仕上げる。d)/i: Finishing the package, including processes such as homing, die-cutting, and plating of the outer leads.
４、接着テープの評価 リードフレーム組立てに際して、次の評価を行った。4. Evaluation of adhesive tape When assembling the lead frame, the following evaluation was performed.
（１）テーピング可能温度：接着テープを容易かつ迅速
に被着体に接着できるか否かの評価を行った。(1) Temperature at which taping is possible: Evaluation was made to determine whether the adhesive tape could be easily and quickly adhered to an adherend.
テーピングマシンでテープをリードフレームに接着する
ことができる温度域を測定した。The temperature range at which the tape can be bonded to the lead frame using a taping machine was measured.
ｂ）リードフレームの酸化：接着剤硬化中にリードフレ
ーム表面の酸化が起こっているか否かの評価を行った。b) Oxidation of lead frame: It was evaluated whether or not the surface of the lead frame was oxidized during adhesive curing.
Ｃ）接着カニ十分な接着力があり、そのバラツキは小さ
いか否かについて評価を行った。１５０℃でせん断強度
を測定した。C) Adhesion Crab An evaluation was made to see whether there was sufficient adhesive force and whether the variation was small. Shear strength was measured at 150°C.
ｄ）ボイド：接着剤を硬化させる際に接着剤内に発生す
るボイドが実用上問題になるレベルにあるか否かを評価
した。d) Voids: It was evaluated whether the voids generated in the adhesive when curing the adhesive were at a level that would pose a practical problem.
ｅ）作業性：接着テープ使用時のハンドリング性及び接
着テープの接着剤表面のタックについて評髄を行った。e) Workability: Handling performance during use of the adhesive tape and tackiness of the adhesive surface of the adhesive tape were evaluated.
また、パッケージ組立てに際して、金線のワイヤーボン
ディング時のリードフレーム上へのワイヤーボンダビリ
ティ及び接着強度を確認した。Additionally, during package assembly, wire bondability and adhesive strength of the gold wire onto the lead frame during wire bonding were confirmed.
これらの評価結果を第２表に示す。These evaluation results are shown in Table 2.
第２表
第２表の結果から明らかなように、本発明の接着剤を使
用した接着テープの場合には、パッケージを良好に作成
することができる。これに対して、比較対照例の接着テ
ープの場合には、リードフレームの酸化が生じる、接着
条件がリードフレームの組み立てに適しない、金線のワ
イヤーボンディングを行うことができない、等の問題が
あり、電子部品作成の用途に適していない。As is clear from the results shown in Table 2, packages can be produced satisfactorily using the adhesive tape using the adhesive of the present invention. On the other hand, in the case of the comparative adhesive tape, there are problems such as oxidation of the lead frame, adhesion conditions not suitable for assembling the lead frame, and inability to perform wire bonding of gold wire. , not suitable for use in making electronic parts.
発明の効果
本発明の電子部品用接着剤及びそれを用いた電子部品用
接着テープは、比較的低温で接着、硬化でき、十分な耐
熱性を有するので、それを用いて作成された電子部品は
、良好な信頼性を有するものとなる。Effects of the Invention The adhesive for electronic components of the present invention and the adhesive tape for electronic components using the same can be bonded and cured at a relatively low temperature and have sufficient heat resistance, so electronic components made using the adhesive can be bonded and cured at a relatively low temperature. , it has good reliability.
第１図ないし第３図は、それぞれ電子部品用接着テープ
を使用してプラスチックパッケージを組立てた図の断面
図である。
■・・・半導体チップ２．・・・プレーン、３・・・リ
ードビン、４・・・ボンディングワイヤー、５・・・樹
脂、６・・・接着層、７・・・ダイパッド、８・・・電
極。1 to 3 are cross-sectional views of plastic packages assembled using adhesive tapes for electronic components. ■...Semiconductor chip 2. . . . Plain, 3. Lead bin, 4. Bonding wire, 5. Resin, 6. Adhesive layer, 7. Die pad, 8. Electrode.
Claims (3)
トリル−ブタジエン共重合体１００重量部に対して、レ
ゾール型フェノール樹脂１０〜６００重量部及びエポキ
シ樹脂１０〜６００重量部を配合してなる接着層を積層
してなり、該レゾール型フェノール樹脂が、フェノール
成分として、クレゾール、ビスフェノールＡ及びｐ−ｔ
−ブチルフェノールよりなる群から選択された１種又は
それ以上よりなるクレゾール型、ビスフェノールＡ型、
ｐ−ｔ−ブチルフェノール型又はそれ等の共縮合型のフ
ェノール樹脂であり、該エポキシ樹脂がフェノールノボ
ラックエポキシ樹脂及びオルトクレゾールノボラックエ
ポキシ樹脂よりなる群から選択された少なくとも１種よ
りなることを特徴とする電子部品用接着テープ。(1) At least one side of the heat-resistant film is laminated with an adhesive layer made by blending 10 to 600 parts by weight of a resol type phenol resin and 10 to 600 parts by weight of an epoxy resin to 100 parts by weight of an acrylonitrile-butadiene copolymer. The resol type phenolic resin contains cresol, bisphenol A and pt as phenolic components.
- Cresol type, bisphenol A type, consisting of one or more selected from the group consisting of butylphenol,
A pt-butylphenol type or cocondensation type phenol resin thereof, characterized in that the epoxy resin is made of at least one selected from the group consisting of a phenol novolac epoxy resin and an orthocresol novolac epoxy resin. Adhesive tape for electronic parts.
タジエン共重合体１００重量部に対して、レゾール型フ
ェノール樹脂１０〜６００重量部及びエポキシ樹脂１０
〜６００重量部を配合してなる接着層を積層してなり、
該レゾール型フェノール樹脂が、フェノール成分として
、クレゾール、ビスフェノールＡ及びｐ−ｔ−ブチルフ
ェノールよりなる群から選択された１種又はそれ以上よ
りなるクレゾール型、ビスフェノールＡ型、ｐ−ｔ−ブ
チルフェノール型又はそれ等の共縮合型のフェノール樹
脂であり、該エポキシ樹脂がフェノールノボラックエポ
キシ樹脂及びオルトクレゾールノボラックエポキシ樹脂
よりなる群から選択された少なくとも１種よりなること
を特徴とする電子部品用接着テープ。(2) On one side of the peelable film, apply 10 to 600 parts by weight of a resol type phenol resin and 10 parts by weight of an epoxy resin to 100 parts by weight of the acrylonitrile-butadiene copolymer.
〜600 parts by weight of adhesive layers are laminated,
The resol type phenol resin has, as a phenol component, a cresol type, bisphenol A type, pt-butylphenol type, or one or more of them selected from the group consisting of cresol, bisphenol A, and pt-butylphenol. An adhesive tape for electronic components, characterized in that the epoxy resin is at least one selected from the group consisting of phenol novolac epoxy resins and orthocresol novolac epoxy resins.
量部に対して、レゾール型フェノール樹脂１０〜６００
重量部及びエポキシ樹脂１０〜６００重量部を配合して
なり、該レゾール型フェノール樹脂が、フェノール成分
として、クレゾール、ビスフェノールＡ及びｐ−ｔ−ブ
チルフェノールよりなる群から選択された１種又はそれ
以上よりなるクレゾール型、ビスフェノールＡ型、ｐ−
ｔ−ブチルフェノール型又はそれ等の共縮合型のフェノ
ール樹脂であり、該エポキシ樹脂がフェノールノボラッ
クエポキシ樹脂及びオルトクレゾールノボラックエポキ
シ樹脂よりなる群から選択された少なくとも１種よりな
ることを特徴とする電子部品用液状接着剤。(3) 10 to 600 parts of resol type phenolic resin to 100 parts by weight of acrylonitrile-butadiene copolymer
parts by weight and 10 to 600 parts by weight of an epoxy resin, and the resol type phenolic resin contains one or more selected from the group consisting of cresol, bisphenol A, and pt-butylphenol as a phenol component. cresol type, bisphenol A type, p-
An electronic component characterized in that it is a t-butylphenol type or a cocondensation type phenol resin thereof, and the epoxy resin is made of at least one selected from the group consisting of a phenol novolac epoxy resin and an ortho-cresol novolac epoxy resin. liquid adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1200253A JP2612498B2 (en) | 1989-08-03 | 1989-08-03 | Adhesive tape for resin-sealed semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1200253A JP2612498B2 (en) | 1989-08-03 | 1989-08-03 | Adhesive tape for resin-sealed semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0364387A true JPH0364387A (en) | 1991-03-19 |
| JP2612498B2 JP2612498B2 (en) | 1997-05-21 |
Family
ID=16421306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1200253A Expired - Fee Related JP2612498B2 (en) | 1989-08-03 | 1989-08-03 | Adhesive tape for resin-sealed semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2612498B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5346957A (en) * | 1991-05-27 | 1994-09-13 | Nippon Zeon Co., Ltd. | Adhesive composition |
| US6901150B1 (en) | 1999-10-19 | 2005-05-31 | Sagem, Sa | Permanent magnet actuator with electric excitation coil, especially loudspeaker and mobile telephone |
| JP2007297428A (en) * | 2006-04-27 | 2007-11-15 | Tomoegawa Paper Co Ltd | Adhesive tape for electronic part |
| JP2008001810A (en) * | 2006-06-22 | 2008-01-10 | Tokai Rubber Ind Ltd | Rubber composition and rubber product using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2787842B2 (en) | 1992-09-03 | 1998-08-20 | 住友ベークライト株式会社 | Conductive resin paste for semiconductors |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933988A (en) * | 1972-07-28 | 1974-03-28 |
-
1989
- 1989-08-03 JP JP1200253A patent/JP2612498B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4933988A (en) * | 1972-07-28 | 1974-03-28 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5346957A (en) * | 1991-05-27 | 1994-09-13 | Nippon Zeon Co., Ltd. | Adhesive composition |
| US6901150B1 (en) | 1999-10-19 | 2005-05-31 | Sagem, Sa | Permanent magnet actuator with electric excitation coil, especially loudspeaker and mobile telephone |
| JP2007297428A (en) * | 2006-04-27 | 2007-11-15 | Tomoegawa Paper Co Ltd | Adhesive tape for electronic part |
| JP2008001810A (en) * | 2006-06-22 | 2008-01-10 | Tokai Rubber Ind Ltd | Rubber composition and rubber product using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2612498B2 (en) | 1997-05-21 |
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