JPH0364055A - Ic package - Google Patents

Abstract

PURPOSE:To strengthen the mounting strength of a pin to an external force by fixing the pin point of a PLCC package to the rear of a package mainframe. CONSTITUTION:A thin shallow groove 5 is provided in a part of the rear of a package mainframe 1 in such a way as to allow the point of a pin 2 to be buried slightly in the groove. Its point of the pin 2 is buried in the groove and the pin point is fixed by pouring a resin or bond into the groove. In an IC package that is made up in this way, the pin 2 becomes hard to bend by a force from a certain direction and the whole of the pin 2 is strengthened.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention is based on P L CC (Plastic Lead
ed ChipCarrier) package structure.

[Conventional technology]

FIG. 4 is a cross-sectional view of a conventional PLCC package.

In the figure, (1) is the package body, (2) is the input/output pin C and below that comes out from the package body (1]), and (3C) is the package body (3C) where the tip of pin (2) is the package body (3C).
This is the contact part that is in contact with the back side of 1).

Next, the operation will be explained.

In the PLCC package configured as described above, the tip of the pin (2) was not fixed to the back surface of the package body (1) only at the contact part (3C). ) In response to the force from below, a lateral force acts on the tip of the pin (2), and the pin (2) may easily bend.

[Problem to be solved by the invention]

Conventional PLCC packages have a structure in which the tips of the pins protruding from the package body are in contact with the back surface of the package body, as described above.The pins are weak and easily resist forces from all directions. There was a problem in that the pins were bent and could no longer perform the normal output between the package body and the outside.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain an IC package in which the pins are made strong against forces applied to the pins from all directions and are not easily bent.

1. [Means for Solving the Problems] The IC package according to the present invention has pin tips of a PLCC package fixed to the back surface of the package body.

[Effect]

In this invention, since the pin tip is fixed to the back of the package body, even if force is applied to the pin, no force is applied to the pin tip in the lateral direction, so the force is dispersed throughout the bottle and the pin does not bend easily. It disappears.

〔Example〕

An embodiment of an IC package according to the present invention will be described below with reference to the drawings.

Figure 1 is a cross-sectional view of the PLCC package, and Figure 2 is the cross-sectional view of the PLCC package.
An enlarged perspective view of section A shown in the figure, viewed from diagonally below.'? ! FIG. 43 is an enlarged perspective view of section A shown in FIG. 1 according to another embodiment of the present invention, viewed diagonally from below.

In the figure, (1) is the package body, (21 is the pin,
3a) and (3b) are fixed parts where the tips of pins (2) are fixed on the back surface of the package body (1), (4) are protrusions, and (5) are grooves.

Next, the operation will be explained.

In Figure 2, connect the tip of the pin (2) to the package body (1).
To explain how to fix it to the back side of the package body (1), in the conventional example shown in Figure 4, the tip of the pin (2) touches the back side part of the package body (1) at the contact part (3C). Make a thin and shallow groove (5) to fill in, and insert the pin (2) into it.
Fix the tip of pin (2) by embedding the tip of pin (1) and pouring resin or bond.

In the 1, C package configured in this way, the tip of the pin (2) is fixed against force from a certain direction, for example, from below the package body (1), so the pin (2)
Since the lateral force at the tip of the pin (2) is not applied and the force is dispersed over the entire pin (2), the pin (2) is difficult to bend and the pin (
2) The whole becomes stronger than the conventional one.

In Fig. 3, the method for fixing the pin (2) is to provide protrusions (4) on both sides of the contact portion (3C) that the tip of the pin (2) was in contact with in the conventional example shown in Fig. 4, and to fix the pin (2) therebetween. Insert the tip of the pin (2) into the part (3b) and fix it with resin.

In addition, in the above embodiment, the method of fixing the pin (2) with the fixing parts (3a) and (3b) was explained, but as a method of fixing the tip of the pin (2) with the back surface of the package body (1),
You can fix the tips of the pins (2) on the back side of the package body (1) one by one with bond, or you can use the conventional method of fixing the tips of the pins (2)
When attaching the tip of the pin (21), as long as the tip of the pin (2) is fixed by simply hooking the tip of the pin (21) on the protrusions provided on both sides of the contact part (3C) that the tip of the A similar effect can be obtained.

〔Effect of the invention〕

As described above, according to the present invention, since the pin tips of the PLCC package are fixed on the back surface of the package body, the pins as a whole become strong against forces applied to the pins from all directions, and are not easily bent.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a PLCC package according to an embodiment of the IC package according to the present invention, FIG. 2 is an enlarged perspective view of section A shown in FIG. 1 viewed diagonally from below, and FIG. FIG. 4 is an enlarged perspective view of section A shown in FIG. 1, viewed diagonally from below, according to another embodiment of the invention, and FIG. 4 is a sectional view of a conventional PLCC package. In the figure, (1) is the package body, (2) is the pin,
(3a) and (3b) are fixed parts, (4) is a protrusion, and (5) is a groove. show.

Claims (1)

[Claims] An IC package characterized in that, in a PLCC package, the tips of input/output pins protruding from the PLCC package are fixed to the back surface of the package.