JPH01238995A - Ic card - Google Patents

Abstract

PURPOSE:To enhance durability by a construction wherein an IC chip is embedded in a first sheet member, the thickness of the first sheet member is reduced gradually from the area in which the IC chip is embedded toward peripheral parts of an IC card, whereas the thickness of a second sheet member is increased gradually from the area toward the peripheral parts. CONSTITUTION:A high-stiffness sheet member 6 possesses the thickest part in an embedding area 2 including the outer periphery of an IC chip 3. In this area the sheet member 6 is not laminated with a low-stiffness sheet member 5 but is present in an insular form. The thickness of the sheet member 6 is reduced gradually toward the outer periphery thereof, with a surface thereof slanted. The thinner of the member 6 is lower in stiffness and easier to bend, according to the reduction in thickness. The low-stiffness sheet member 5 is similar to the high-stiffness sheet member 6 in outer shape, but is provided with a hole in the embedding area 2 surrounding the IC chip 3, and the thickness of the member 5 is increased gradually toward the peripheral parts so as to compensate for the gradual reduction in the thickness of the member 6 form the area surrounding the IC chip 3. As a result, the peripheral parts of the IC card 1 are easier to bend than the other parts.

Description

[Detailed Description of the Invention] [Industry - Field of Application] The present invention relates to an IC card, and more specifically, the present invention relates to an IC card, and more specifically, the structure of the IC card prevents destruction of the joint between a rigid part that is difficult to bend and a flexible part that is easily exposed to IA. The present invention relates to the structure of an IC card that can be used for multiple purposes.

[Prior Art] For example, as shown in Japanese Unexamined Patent Application Publication No. 62-25096, in a conventional IC card, +4, which is easier to see, l-1■ (each Place the parts in a T-shape, and place the IA in the surrounding area.
- The structure is such that the stress applied to the IC card is concentrated in the cross-shaped part by arranging the +A material to protect the built-in IC chip and to make the IC card difficult to break.

[Problem to be solved] However, in a card in which flexible members are arranged in the shape of a cross, when the stress applied to the card becomes large, two members with different flexibility may be joined at the joint. The disadvantage is that the IC chip is not protected.

This invention solves the problems of the prior art, and prevents the joint between the soft body part and the rigid body part from breaking.
Our objective is to provide a highly durable and flexible IC card.

[L stage to solve the problem] The structure of the IC card of the present invention to achieve the above 11 objectives is to laminate a first sheet member that is more flexible and a second sheet member that is more flexible. An IC chip is embedded in the first sheet member, and the thickness of the first sheet member gradually becomes thinner from the area where the IC chip is embedded toward the card periphery, and the thickness of the second sheet member is The thickness increases gradually from the area where the IC chip is embedded toward the periphery of the card.

[Function] In this way, the thickness of the IA-unsightly sheet member is reduced from the IC chip mounting area toward the IC card periphery by making the IA-unsightly sheet member smaller than the +4-unsightly sheet member.
By converting a flexible sheet member that has a thickness that compensates for the thickness of the thinner (unsightly) sheet member to an (unsightly) sheet member, the stress direction applied to the card can be changed in the direction of the mating surfaces of the sheet members. When an external stress is applied to the IC card, the stress is evenly distributed, so that the joint surface or its contact surface is unlikely to be destroyed.

Furthermore, since the peripheral portion is easily bent, the entire IC card can be made flexible, and the built-in IC chip can be protected without stress being applied to the IC chip itself.

[Example Code] An example of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is an external view of the IC card of the present invention, and FIG.
The figure is a sectional view taken along line AA.

1 is an IC card, and an IC chip 3 is embedded inside a embedding area 2 in the left shoulder portion of the IC card.

As shown in FIG. 2, the IC card 1 consists of a high-rigidity sheet member 6, which has almost the same external shape as the IC card 1, or is slightly smaller, has high rigidity, and is relatively hard to see.
, and a low-rigidity sheet member 5 which is approximately the same size as the high-rigidity sheet member 6 and is easier to see in IA than this sheet member, and the entire surrounding area of these is coated with a synthetic resin decorative board 4. It has a similar structure.

The embedding area 2 is allocated to a highly rigid sheet member 6, and the IC chip 3 is embedded in the highly rigid sheet member 6.

In such a laminated structure, it is not necessary to bond the high-rigidity sheet member 6 and the low-rigidity sheet member 5 as long as the decorative board 4 is coated thickly (in the case of bonding these, It is possible to bond the entire surface at the interface of the IC.
It is sufficient to glue it in the center of card 1.

By the way, although FIG. 2 only shows the A-A cross section in FIG. 1, the relationship between the low-rigidity sheet member 5 and the high-rigidity sheet member 6 is as described above with respect to the embedding area 2 in which the IC chip 3 is buried. The structure is similar in the vertical direction, which is the perpendicular direction.

That is, the high-rigidity sheet material 6 has the maximum thickness in the buried area 2 including the outer periphery of the IC chip 3, and the low-rigidity sheet material 5 is not laminated in this area, and this is island-shaped. It becomes. The thickness gradually becomes thinner and slopes toward the outer periphery. Therefore, the stiffness of the thinner portion decreases by the thickness, making it easier to bend. - On the other hand, the outer shape of the low-rigidity sheet member 5 is almost the same as that of the high-rigidity sheet member 6, but a hole is made in the surrounding embedding area 2 where the IC chip 3 is embedded;
In order to compensate for the thickness that gradually decreases around the area around the IC chip 3, it becomes thicker toward the periphery.

As a result, the peripheral portion of the IC card 1 is more likely to bend than other portions.

Therefore, by bonding both the low-rigidity sheet member 5 and the high-rigidity sheet member 6, for example, at their centers and covering the outside with a decorative board 4 having a large elastic modulus, it is possible to bond both the short and long sides of the IC card 1. When a bending force is applied to both, its jA
The stress occurs around the card periphery, making it difficult for stress to be applied to the IC chip 3 itself.

Moreover, unlike in the past, the sheet member that is easy to see and the sheet member that is difficult to see are not placed on the same +2 side, so the stress will be distributed evenly and the joint will not break. The buried area 2 can have a strength equal to l- in resistance to external stress.

As explained above, once the high-rigidity sheet member 6 and the low-rigidity sheet member 5 in the embodiment are completely bonded, it is not necessarily necessary to coat them with the decorative board 4.

In the example, the thickness of the IC card is sloped on both the short and long sides, but since the IC card is most easily bent on the long side, the sheet member with high rigidity and the sheet member with low rigidity are used only on the long side. If the thickness of the sorting member is sloped, but the short side does not need to be sloped. Note that the thickness gradient may not be continuous, but may be discontinuous, for example, step-like.

In addition, in the embodiment, regarding the sorting member with low rigidity, I
Although a hole is provided around the C chip, this portion may not be a hole but may be a region with a reduced thickness. Note that burying an IC chip in a burying area corresponds to the meaning of burying even if a portion of the IC chip is not buried.

[Effects of the Invention] As explained below, in this invention, the thickness of the sheet member that is easy to read and the sheet member that is difficult to bend are determined from the IC chip mounting part to the IC card. By using a sheet member that is easy to see in IA and a sheet member that is thinner toward the periphery and has a thickness that compensates for the thinner sheet member that is difficult to bend, as a sheet member that is difficult to see in IA, the direction of stress applied to the card can be reduced. This can be done in a substantially vertical direction, which is the direction of the mating surfaces of the members, and when external stress is applied to the IC card, the stress is evenly distributed, so that the joint surfaces or their contact surfaces are unlikely to be destroyed.

In addition, since the peripheral portion is easy to bend, the entire IC card can have flexibility, and the built-in IC chip can be protected since stress is not applied to the IC chip itself.

[Brief explanation of the drawing]

FIG. 1 is an external view of the IC card of the present invention, and FIG.
The figure is a sectional view taken along line AA. 1... IC card, 2... IC chip embedding area, 3... IC chip, 4... Decorative board, 5... Low rigidity sheet member, 6... High rigidity sheet member. Patent Applicant 11-1 Maxell Co., Ltd. Agent Patent Attorney L Nobu Kajiyama Attorney To Tomio Yamamoto Figure 1 Figure 2 No'7'/]

Claims (2)

[Claims] (1) Laminate a first sheet member that is difficult to bend and a second sheet member that is easier to see IA than this, and place an IC on the first sheet member.
The thickness of the first sheet member gradually decreases from the area where the IC chip is embedded toward the card periphery, and the thickness of the second sheet member gradually decreases from the area where the IC chip is embedded to the card periphery. An IC card that is characterized by being gradually thicker toward the periphery. (2) The IC card according to claim 1, wherein the second sheet member has a hole provided in a portion corresponding to the area in which the IC chip is embedded.