JPH0363939U - - Google Patents
Info
- Publication number
- JPH0363939U JPH0363939U JP1989125453U JP12545389U JPH0363939U JP H0363939 U JPH0363939 U JP H0363939U JP 1989125453 U JP1989125453 U JP 1989125453U JP 12545389 U JP12545389 U JP 12545389U JP H0363939 U JPH0363939 U JP H0363939U
- Authority
- JP
- Japan
- Prior art keywords
- brazed
- metal layer
- metal base
- hole
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125453U JPH083009Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989125453U JPH083009Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363939U true JPH0363939U (pl) | 1991-06-21 |
| JPH083009Y2 JPH083009Y2 (ja) | 1996-01-29 |
Family
ID=31673323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989125453U Expired - Lifetime JPH083009Y2 (ja) | 1989-10-26 | 1989-10-26 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083009Y2 (pl) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002131164A (ja) * | 2000-10-27 | 2002-05-09 | Kyocera Corp | 圧力検出装置用パッケージ |
| JP2003007885A (ja) * | 2001-06-26 | 2003-01-10 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2009144295A (ja) * | 2007-12-17 | 2009-07-02 | Gunze Ltd | 立体編み部付き衣類 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5576463B2 (ja) * | 2012-12-13 | 2014-08-20 | 第一ゴム株式会社 | 履物、ブーツ及び長靴 |
-
1989
- 1989-10-26 JP JP1989125453U patent/JPH083009Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002131164A (ja) * | 2000-10-27 | 2002-05-09 | Kyocera Corp | 圧力検出装置用パッケージ |
| JP4557406B2 (ja) * | 2000-10-27 | 2010-10-06 | 京セラ株式会社 | 圧力検出装置用パッケージ |
| JP2003007885A (ja) * | 2001-06-26 | 2003-01-10 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2009144295A (ja) * | 2007-12-17 | 2009-07-02 | Gunze Ltd | 立体編み部付き衣類 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH083009Y2 (ja) | 1996-01-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |