JPS63164241U - - Google Patents
Info
- Publication number
- JPS63164241U JPS63164241U JP5705087U JP5705087U JPS63164241U JP S63164241 U JPS63164241 U JP S63164241U JP 5705087 U JP5705087 U JP 5705087U JP 5705087 U JP5705087 U JP 5705087U JP S63164241 U JPS63164241 U JP S63164241U
- Authority
- JP
- Japan
- Prior art keywords
- package
- metal layer
- external lead
- semiconductor element
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5705087U JPS63164241U (pl) | 1987-04-15 | 1987-04-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5705087U JPS63164241U (pl) | 1987-04-15 | 1987-04-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63164241U true JPS63164241U (pl) | 1988-10-26 |
Family
ID=30886401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5705087U Pending JPS63164241U (pl) | 1987-04-15 | 1987-04-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63164241U (pl) |
-
1987
- 1987-04-15 JP JP5705087U patent/JPS63164241U/ja active Pending