JPH0361343U - - Google Patents

Info

Publication number
JPH0361343U
JPH0361343U JP1989122462U JP12246289U JPH0361343U JP H0361343 U JPH0361343 U JP H0361343U JP 1989122462 U JP1989122462 U JP 1989122462U JP 12246289 U JP12246289 U JP 12246289U JP H0361343 U JPH0361343 U JP H0361343U
Authority
JP
Japan
Prior art keywords
insulating substrate
sealing ring
integrated circuit
package
notch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989122462U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989122462U priority Critical patent/JPH0361343U/ja
Publication of JPH0361343U publication Critical patent/JPH0361343U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は第１実施例を示す集積回路用パツケー
ジの要部断面図、第２図は第２実施例を示す集積
回路用パツケージの要部断面図、第３図は第３実
施例を示す集積回路用パツケージの要部断面図で
ある。第４図は第４実施例を示す集積回路用パツ
ケージの要部断面図である。また、第５図は従来
の集積回路パツケージの要部断面図である。 図中、１……集積回路用パツケージ、２……絶
縁基板、４……封止用リング、５……切欠部、６
……隙間。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 絶縁基板と、この絶縁基板にろう付けによつ
    て接合される封止用リングとを備え、 前記絶縁基板と前記封止用リングとの外形寸法
    が同一の集積回路用パツケージにおいて、 前記封止用リングは、外周の前記絶縁基板の配
    される側に、前記絶縁基板と前記封止用リングと
    の間に隙間を形成する切欠部を備える ことを特徴とする集積回路用パツケージ。 ２ 絶縁基板と、この絶縁基板にろう付けによつ
    て接合される封止用リングとを備え、 前記絶縁基板と前記封止用リングとの外形寸法
    が同一の集積回路用パツケージにおいて、 前記絶縁基板は、外周の前記封止用リングの配
    される側に、前記絶縁基板と前記封止用リングと
    の間に隙間を形成する切欠部を備える ことを特徴とする集積回路用パツケージ。
JP1989122462U 1989-10-19 1989-10-19 Pending JPH0361343U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989122462U JPH0361343U (ja) 1989-10-19 1989-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989122462U JPH0361343U (ja) 1989-10-19 1989-10-19

Publications (1)

Publication Number Publication Date
JPH0361343U true JPH0361343U (ja) 1991-06-17

Family

ID=31670460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989122462U Pending JPH0361343U (ja) 1989-10-19 1989-10-19

Country Status (1)

Country Link
JP (1) JPH0361343U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208250A (ja) * 1987-02-25 1988-08-29 Nec Corp 集積回路のパツケ−ジ構造
JPS6427248A (en) * 1987-03-09 1989-01-30 Mitsubishi Electric Corp Package for semiconductor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208250A (ja) * 1987-02-25 1988-08-29 Nec Corp 集積回路のパツケ−ジ構造
JPS6427248A (en) * 1987-03-09 1989-01-30 Mitsubishi Electric Corp Package for semiconductor

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