JPH0361338U - - Google Patents
Info
- Publication number
- JPH0361338U JPH0361338U JP12186189U JP12186189U JPH0361338U JP H0361338 U JPH0361338 U JP H0361338U JP 12186189 U JP12186189 U JP 12186189U JP 12186189 U JP12186189 U JP 12186189U JP H0361338 U JPH0361338 U JP H0361338U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit
- bonding pad
- signal
- test circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12186189U JPH0361338U (ru) | 1989-10-17 | 1989-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12186189U JPH0361338U (ru) | 1989-10-17 | 1989-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361338U true JPH0361338U (ru) | 1991-06-17 |
Family
ID=31669883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12186189U Pending JPH0361338U (ru) | 1989-10-17 | 1989-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361338U (ru) |
-
1989
- 1989-10-17 JP JP12186189U patent/JPH0361338U/ja active Pending