JPH0359660U - - Google Patents

Info

Publication number
JPH0359660U
JPH0359660U JP12004489U JP12004489U JPH0359660U JP H0359660 U JPH0359660 U JP H0359660U JP 12004489 U JP12004489 U JP 12004489U JP 12004489 U JP12004489 U JP 12004489U JP H0359660 U JPH0359660 U JP H0359660U
Authority
JP
Japan
Prior art keywords
dividing
depth
grooves
ceramic
deeper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12004489U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12004489U priority Critical patent/JPH0359660U/ja
Publication of JPH0359660U publication Critical patent/JPH0359660U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP12004489U 1989-10-12 1989-10-12 Pending JPH0359660U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12004489U JPH0359660U (zh) 1989-10-12 1989-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12004489U JPH0359660U (zh) 1989-10-12 1989-10-12

Publications (1)

Publication Number Publication Date
JPH0359660U true JPH0359660U (zh) 1991-06-12

Family

ID=31668135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12004489U Pending JPH0359660U (zh) 1989-10-12 1989-10-12

Country Status (1)

Country Link
JP (1) JPH0359660U (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031731A (ja) * 2001-07-16 2003-01-31 Toshiba Corp セラミックス基板、その製造方法およびセラミックス回路基板
JP2006013318A (ja) * 2004-06-29 2006-01-12 Hitachi Metals Ltd 多層基板及び高周波電子部品、並びにその製造方法
JP2006269725A (ja) * 2005-03-24 2006-10-05 Matsushita Electric Ind Co Ltd セラミックデバイスおよびその製造方法
JP2009212319A (ja) * 2008-03-05 2009-09-17 Ngk Spark Plug Co Ltd 多数個取り配線基板の製造方法
JP2012084642A (ja) * 2010-10-08 2012-04-26 Stanley Electric Co Ltd セラミック多層配線基板の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031731A (ja) * 2001-07-16 2003-01-31 Toshiba Corp セラミックス基板、その製造方法およびセラミックス回路基板
JP2006013318A (ja) * 2004-06-29 2006-01-12 Hitachi Metals Ltd 多層基板及び高周波電子部品、並びにその製造方法
JP4505803B2 (ja) * 2004-06-29 2010-07-21 日立金属株式会社 高周波電子部品の製造方法
JP2006269725A (ja) * 2005-03-24 2006-10-05 Matsushita Electric Ind Co Ltd セラミックデバイスおよびその製造方法
JP2009212319A (ja) * 2008-03-05 2009-09-17 Ngk Spark Plug Co Ltd 多数個取り配線基板の製造方法
JP2012084642A (ja) * 2010-10-08 2012-04-26 Stanley Electric Co Ltd セラミック多層配線基板の製造方法

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