JPH0359327U - - Google Patents
Info
- Publication number
- JPH0359327U JPH0359327U JP11797589U JP11797589U JPH0359327U JP H0359327 U JPH0359327 U JP H0359327U JP 11797589 U JP11797589 U JP 11797589U JP 11797589 U JP11797589 U JP 11797589U JP H0359327 U JPH0359327 U JP H0359327U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- release sheet
- wavy
- cut line
- lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000003814 drug Substances 0.000 claims 2
- 229940079593 drug Drugs 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Medicinal Preparation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989117975U JP2519222Y2 (ja) | 1989-10-09 | 1989-10-09 | 貼付剤 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989117975U JP2519222Y2 (ja) | 1989-10-09 | 1989-10-09 | 貼付剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0359327U true JPH0359327U (da) | 1991-06-11 |
JP2519222Y2 JP2519222Y2 (ja) | 1996-12-04 |
Family
ID=31666171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989117975U Expired - Fee Related JP2519222Y2 (ja) | 1989-10-09 | 1989-10-09 | 貼付剤 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2519222Y2 (da) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000069422A1 (fr) * | 1999-05-13 | 2000-11-23 | Hisamitsu Pharmaceutical Co., Inc. | Bande |
JP2002306530A (ja) * | 2001-04-13 | 2002-10-22 | Teikoku Seiyaku Co Ltd | 外用貼付剤 |
JP2003522601A (ja) * | 2000-02-18 | 2003-07-29 | ドッタ,アンジェロ | 傷口装着用粘着性テープ用の優先的高速開封シールド・パッケージおよびその製造手段 |
JP2008259716A (ja) * | 2007-04-13 | 2008-10-30 | Nichiban Co Ltd | 貼付剤 |
WO2010038647A1 (ja) * | 2008-09-30 | 2010-04-08 | ニチバン株式会社 | 貼付材及び貼付材キット |
JP2010163367A (ja) * | 2009-01-13 | 2010-07-29 | Nitto Denko Corp | 貼付剤および貼付製剤 |
JP2012063446A (ja) * | 2010-09-14 | 2012-03-29 | Hitachi Systems Ltd | 手荷物用タグ |
KR20180059473A (ko) * | 2015-09-24 | 2018-06-04 | 에티컨, 엘엘씨 | 상처 봉합 장치 |
JP2018140970A (ja) * | 2017-02-28 | 2018-09-13 | 久光製薬株式会社 | 貼付剤 |
JP2020127800A (ja) * | 2020-05-15 | 2020-08-27 | エシコン エルエルシーEthicon LLC | 創傷閉鎖用装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5720633A (en) * | 1980-05-27 | 1982-02-03 | Graco Inc | Fluid pressure sensor |
JPS58124123A (ja) * | 1982-01-19 | 1983-07-23 | Sanyo Electric Co Ltd | 電子レンジ |
JPS6410135A (en) * | 1987-07-02 | 1989-01-13 | Nippon Inter Electronics Corp | Heat flow sensor |
JPH02141435U (da) * | 1988-08-11 | 1990-11-28 |
-
1989
- 1989-10-09 JP JP1989117975U patent/JP2519222Y2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5720633A (en) * | 1980-05-27 | 1982-02-03 | Graco Inc | Fluid pressure sensor |
JPS58124123A (ja) * | 1982-01-19 | 1983-07-23 | Sanyo Electric Co Ltd | 電子レンジ |
JPS6410135A (en) * | 1987-07-02 | 1989-01-13 | Nippon Inter Electronics Corp | Heat flow sensor |
JPH02141435U (da) * | 1988-08-11 | 1990-11-28 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6841716B1 (en) | 1999-05-13 | 2005-01-11 | Hisamitsu Pharmaceutical Co., Inc. | Patch |
WO2000069422A1 (fr) * | 1999-05-13 | 2000-11-23 | Hisamitsu Pharmaceutical Co., Inc. | Bande |
JP2003522601A (ja) * | 2000-02-18 | 2003-07-29 | ドッタ,アンジェロ | 傷口装着用粘着性テープ用の優先的高速開封シールド・パッケージおよびその製造手段 |
JP2002306530A (ja) * | 2001-04-13 | 2002-10-22 | Teikoku Seiyaku Co Ltd | 外用貼付剤 |
JP2008259716A (ja) * | 2007-04-13 | 2008-10-30 | Nichiban Co Ltd | 貼付剤 |
JP5416705B2 (ja) * | 2008-09-30 | 2014-02-12 | ニチバン株式会社 | 貼付材及び貼付材キット |
WO2010038647A1 (ja) * | 2008-09-30 | 2010-04-08 | ニチバン株式会社 | 貼付材及び貼付材キット |
JP2010163367A (ja) * | 2009-01-13 | 2010-07-29 | Nitto Denko Corp | 貼付剤および貼付製剤 |
JP2012063446A (ja) * | 2010-09-14 | 2012-03-29 | Hitachi Systems Ltd | 手荷物用タグ |
KR20180059473A (ko) * | 2015-09-24 | 2018-06-04 | 에티컨, 엘엘씨 | 상처 봉합 장치 |
CN108348357A (zh) * | 2015-09-24 | 2018-07-31 | 伊西康有限责任公司 | 用于伤口闭合的装置 |
JP2018529433A (ja) * | 2015-09-24 | 2018-10-11 | エシコン エルエルシーEthicon LLC | 創傷閉鎖用装置 |
JP2018140970A (ja) * | 2017-02-28 | 2018-09-13 | 久光製薬株式会社 | 貼付剤 |
JP2020127800A (ja) * | 2020-05-15 | 2020-08-27 | エシコン エルエルシーEthicon LLC | 創傷閉鎖用装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2519222Y2 (ja) | 1996-12-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |