JPH0358156B2 - - Google Patents
Info
- Publication number
- JPH0358156B2 JPH0358156B2 JP2064084A JP2064084A JPH0358156B2 JP H0358156 B2 JPH0358156 B2 JP H0358156B2 JP 2064084 A JP2064084 A JP 2064084A JP 2064084 A JP2064084 A JP 2064084A JP H0358156 B2 JPH0358156 B2 JP H0358156B2
- Authority
- JP
- Japan
- Prior art keywords
- support shaft
- mold
- slip ring
- plating
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 10
- 238000000576 coating method Methods 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2064084A JPS60165078A (ja) | 1984-02-07 | 1984-02-07 | スリツプリングアセンブリの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2064084A JPS60165078A (ja) | 1984-02-07 | 1984-02-07 | スリツプリングアセンブリの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60165078A JPS60165078A (ja) | 1985-08-28 |
| JPH0358156B2 true JPH0358156B2 (enrdf_load_html_response) | 1991-09-04 |
Family
ID=12032821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2064084A Granted JPS60165078A (ja) | 1984-02-07 | 1984-02-07 | スリツプリングアセンブリの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60165078A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0658816B2 (ja) * | 1986-09-01 | 1994-08-03 | 株式会社日立製作所 | 回転電機の集電装置 |
| CN102790336B (zh) * | 2011-05-17 | 2016-08-24 | 科德数控股份有限公司 | 一种导电滑环 |
| DE102015224798A1 (de) | 2015-12-10 | 2017-06-14 | Continental Reifen Deutschland Gmbh | Vorrichtung und Verfahren zur Herstellung einer zumindest einen reaktiven Zusatzstoff enthaltenden Kautschukfertigmischung |
-
1984
- 1984-02-07 JP JP2064084A patent/JPS60165078A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60165078A (ja) | 1985-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2696570A (en) | Element of mechanism for conducting electricity between relatively movable structures | |
| US4475935A (en) | Joining method to obtain elongated coated optical fiber | |
| US2961385A (en) | Method of forming slip-rings in annular grooves | |
| JPH06509453A (ja) | 超音波トランスジューサ装置及びカテーテル | |
| US3623220A (en) | Method of making a tubular printed circuit armature using plating techniques | |
| JPS60210548A (ja) | 光フアイバーの製造方法 | |
| JPH0358156B2 (enrdf_load_html_response) | ||
| US3243866A (en) | Method of making a miniature slip-ring assembly | |
| US2967283A (en) | Slip ring assembly and method of making the same | |
| JPH0360158B2 (enrdf_load_html_response) | ||
| JPS61173482A (ja) | スリツプリングアセンブリの製造方法 | |
| JP2549534B2 (ja) | 読取り/書込み磁気ヘツドのコイル付き平坦磁性支持体の製造方法 | |
| US20030113574A1 (en) | Process for manufacturing a conductive wire suitable for use in semiconductor packages | |
| US3318785A (en) | Method of forming contact assemblies | |
| JPH04341598A (ja) | 電気めっき用陽極構体 | |
| JPS61238104A (ja) | 銀メツキ導波管とその製造方法 | |
| JPS646905B2 (enrdf_load_html_response) | ||
| JPH0729621Y2 (ja) | 段付き貫通コンデンサ | |
| JP2004020890A (ja) | フェルールの製造方法 | |
| JPH01162791A (ja) | 多孔金属体の製造方法 | |
| SU479158A1 (ru) | Способ изготовлени резисторов из микропровода в стекл нной изол ции | |
| KR900007715B1 (ko) | 자개절단용 띠톱의 제조방법 | |
| JPH03226975A (ja) | ジャンパー部品及びその製造方法 | |
| JP2844338B2 (ja) | ステータの製造方法 | |
| JPH0697239B2 (ja) | プロ−ブ用同軸針の製造方法 |