JPH0356341Y2 - - Google Patents
Info
- Publication number
- JPH0356341Y2 JPH0356341Y2 JP5148287U JP5148287U JPH0356341Y2 JP H0356341 Y2 JPH0356341 Y2 JP H0356341Y2 JP 5148287 U JP5148287 U JP 5148287U JP 5148287 U JP5148287 U JP 5148287U JP H0356341 Y2 JPH0356341 Y2 JP H0356341Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- ejector pin
- molds
- mold release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003825 pressing Methods 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 9
- 230000003578 releasing effect Effects 0.000 claims description 4
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 28
- 229920005989 resin Polymers 0.000 description 28
- 238000007789 sealing Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 9
- 230000009471 action Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000012809 cooling fluid Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5148287U JPH0356341Y2 (US07541385-20090602-C00001.png) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5148287U JPH0356341Y2 (US07541385-20090602-C00001.png) | 1987-04-03 | 1987-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63161711U JPS63161711U (US07541385-20090602-C00001.png) | 1988-10-21 |
| JPH0356341Y2 true JPH0356341Y2 (US07541385-20090602-C00001.png) | 1991-12-18 |
Family
ID=30875785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5148287U Expired JPH0356341Y2 (US07541385-20090602-C00001.png) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356341Y2 (US07541385-20090602-C00001.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0620568Y2 (ja) * | 1988-06-13 | 1994-06-01 | 富士ゼロックス株式会社 | 合成樹脂製品用成形型の突出し装置 |
| JP5987190B2 (ja) * | 2012-09-25 | 2016-09-07 | 三菱電機株式会社 | 半導体装置封止用金型及び半導体装置 |
-
1987
- 1987-04-03 JP JP5148287U patent/JPH0356341Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63161711U (US07541385-20090602-C00001.png) | 1988-10-21 |
