JPH0356144U - - Google Patents
Info
- Publication number
- JPH0356144U JPH0356144U JP1989116274U JP11627489U JPH0356144U JP H0356144 U JPH0356144 U JP H0356144U JP 1989116274 U JP1989116274 U JP 1989116274U JP 11627489 U JP11627489 U JP 11627489U JP H0356144 U JPH0356144 U JP H0356144U
- Authority
- JP
- Japan
- Prior art keywords
- signal wiring
- ceramic
- semiconductor chip
- gold
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989116274U JPH0356144U (enExample) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989116274U JPH0356144U (enExample) | 1989-10-02 | 1989-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356144U true JPH0356144U (enExample) | 1991-05-30 |
Family
ID=31664557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989116274U Pending JPH0356144U (enExample) | 1989-10-02 | 1989-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356144U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009166901A (ja) * | 2009-03-16 | 2009-07-30 | Mochida Pharmaceut Co Ltd | スティック型包装体 |
-
1989
- 1989-10-02 JP JP1989116274U patent/JPH0356144U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009166901A (ja) * | 2009-03-16 | 2009-07-30 | Mochida Pharmaceut Co Ltd | スティック型包装体 |