JPH0353510Y2 - - Google Patents
Info
- Publication number
- JPH0353510Y2 JPH0353510Y2 JP1987021237U JP2123787U JPH0353510Y2 JP H0353510 Y2 JPH0353510 Y2 JP H0353510Y2 JP 1987021237 U JP1987021237 U JP 1987021237U JP 2123787 U JP2123787 U JP 2123787U JP H0353510 Y2 JPH0353510 Y2 JP H0353510Y2
- Authority
- JP
- Japan
- Prior art keywords
- cover
- power transistor
- heat
- electronic components
- generating electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insulating Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987021237U JPH0353510Y2 (enExample) | 1987-02-16 | 1987-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987021237U JPH0353510Y2 (enExample) | 1987-02-16 | 1987-02-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63128736U JPS63128736U (enExample) | 1988-08-23 |
| JPH0353510Y2 true JPH0353510Y2 (enExample) | 1991-11-22 |
Family
ID=30817495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987021237U Expired JPH0353510Y2 (enExample) | 1987-02-16 | 1987-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353510Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115816A (ja) * | 2005-10-19 | 2007-05-10 | Shin Etsu Chem Co Ltd | 発熱性電子部品用カバー及びカバーの装着方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| JP3398721B2 (ja) | 1999-05-20 | 2003-04-21 | アムコー テクノロジー コリア インコーポレーティド | 半導体パッケージ及びその製造方法 |
| JP2001077301A (ja) | 1999-08-24 | 2001-03-23 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
-
1987
- 1987-02-16 JP JP1987021237U patent/JPH0353510Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115816A (ja) * | 2005-10-19 | 2007-05-10 | Shin Etsu Chem Co Ltd | 発熱性電子部品用カバー及びカバーの装着方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63128736U (enExample) | 1988-08-23 |
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