JPH0353481Y2 - - Google Patents
Info
- Publication number
- JPH0353481Y2 JPH0353481Y2 JP6873086U JP6873086U JPH0353481Y2 JP H0353481 Y2 JPH0353481 Y2 JP H0353481Y2 JP 6873086 U JP6873086 U JP 6873086U JP 6873086 U JP6873086 U JP 6873086U JP H0353481 Y2 JPH0353481 Y2 JP H0353481Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- protector sheet
- conductive
- protector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001012 protector Effects 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6873086U JPH0353481Y2 (US20100223739A1-20100909-C00005.png) | 1986-05-09 | 1986-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6873086U JPH0353481Y2 (US20100223739A1-20100909-C00005.png) | 1986-05-09 | 1986-05-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62180926U JPS62180926U (US20100223739A1-20100909-C00005.png) | 1987-11-17 |
| JPH0353481Y2 true JPH0353481Y2 (US20100223739A1-20100909-C00005.png) | 1991-11-22 |
Family
ID=30908814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6873086U Expired JPH0353481Y2 (US20100223739A1-20100909-C00005.png) | 1986-05-09 | 1986-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353481Y2 (US20100223739A1-20100909-C00005.png) |
-
1986
- 1986-05-09 JP JP6873086U patent/JPH0353481Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62180926U (US20100223739A1-20100909-C00005.png) | 1987-11-17 |
