JPH0352236B2 - - Google Patents
Info
- Publication number
- JPH0352236B2 JPH0352236B2 JP14397478A JP14397478A JPH0352236B2 JP H0352236 B2 JPH0352236 B2 JP H0352236B2 JP 14397478 A JP14397478 A JP 14397478A JP 14397478 A JP14397478 A JP 14397478A JP H0352236 B2 JPH0352236 B2 JP H0352236B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- patterns
- lead
- plating
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は選択的にオーバーレイめつきされた印
刷配線板に関し、とくに高密度配線された雰囲気
に影響されず安定した電気特性を有する印刷配線
板及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board with selective overlay plating, and more particularly to a printed wiring board having stable electrical characteristics unaffected by the atmosphere of high-density wiring, and a method for manufacturing the same.
印刷配線板には外部との接続搭載部品との接続
等を目的として座、端子、スルーホールが設けら
れている。これらの接続機能を満足する為に銅層
の上に異種金属をオーバーレイめつきする方法が
採られ、このオーバーレイめつきとして貴金属を
用いる事が極めて多く、その経済性が必要最小限
の部分に貴金属のオーバーレイめつきをする方法
が採られている。 The printed wiring board is provided with seats, terminals, and through holes for the purpose of external connection and connection with mounted components. In order to satisfy these connection functions, a method of overlaying dissimilar metals on the copper layer is adopted, and precious metals are very often used for this overlay plating. A method of overlay plating is adopted.
第1図aに示すように従来の方法によれば絶縁
基板1上の所要部に所望の銅パターンすなわち独
立した端子パターンA1,A2,A3,A4、配
線パターンによつて接続された座パターンB1,
B2,B3、端子パターンCと、これらの接続パ
ターン及びリードパターンD1〜D2と独立して
端子パターンA1,A2,A3,A4の接続パタ
ーンをエツチングにより形成する。 As shown in FIG. 1a, according to the conventional method, desired copper patterns, that is, independent terminal patterns A1, A2, A3, A4, and a seat pattern B1 are connected to the desired portions on the insulating substrate 1 by wiring patterns. ,
Connection patterns of terminal patterns A1, A2, A3, and A4 are formed by etching B2, B3, terminal patterns C, and terminal patterns A1, A2, A3, and A4 independently of these connection patterns and lead patterns D1 to D2.
このエツチング後の状態で端子パターンA1,
A2,A3,A4、座パターンB1,B2,B
3、端子パターンC上にのみオーバーレイめつき
を施す必要があり座パターンB1,B2,B3、
端子パターンCをそれぞれ結ぶ配線パターンとリ
ードパターンD1〜D2上は通常の耐めつき性を
有する有機絶縁皮膜を付着させるとか接着剤が塗
布された保護粘着テープを密着させて第1図b斜
線部分のように保護される。 In this state after etching, the terminal pattern A1,
A2, A3, A4, seat pattern B1, B2, B
3. It is necessary to apply overlay plating only on terminal pattern C, and seat patterns B1, B2, B3,
On the wiring patterns connecting the terminal pattern C and the lead patterns D1 to D2, a conventional organic insulating film having anti-sticking properties or a protective adhesive tape coated with adhesive is adhered to the hatched areas in Fig. 1B. be protected as such.
次に上記所要部分にニツケル、金のような二重
層、又は半田とか金のような単独のオーバーレイ
めつきが施される(第1図c)。このときめつき
電流の供給はB1〜C,B2〜B3を接続するパ
ターンに各々延長して設けたリードパターンを製
品外の余白部に設けためつき接点のための接点パ
ターンEに接続されて行なわれる。 The required areas are then plated with a double layer of nickel, gold, or a single overlay such as solder or gold (FIG. 1c). At this time, the pinning current is supplied by connecting lead patterns extending from the patterns connecting B1 to C and B2 to B3 to contact pattern E for the pinning contacts provided in the margin outside the product. It will be done.
この後保護粘着テープを用いた場合は上記テー
プ除去後有機絶縁皮膜はこのまゝで(第1図は有
機絶縁皮膜の場合について記す)端子パターンA
1,A2,A3,A4をリードパターンD1〜D
2から切り離す為、機械的な切削加工などによつ
てリードパターンを除去している。例えばドリル
加工、プレス加工等の手段によれば第1図dのよ
うにリードパターンD1〜D2と端子パターンA
1,A2,A3,A4とリードパターンD1〜D
2と交じわる部分及びB1〜C、B2〜B3を延
長したリードパターンの外形輪郭線F付近にドリ
ル又はプレス加工で穴をあける。あるいは第1図
eのようにミーリング加工によりリードパターン
D1〜D2を含む余白部分を削りとることによつ
て目的を達している。 If a protective adhesive tape is used after this, the organic insulating film remains as it is after the tape is removed (Figure 1 describes the case of an organic insulating film).Terminal pattern A
1, A2, A3, A4 with lead patterns D1 to D
In order to separate it from 2, the lead pattern is removed by mechanical cutting. For example, by means of drilling, press working, etc., lead patterns D1 to D2 and terminal pattern A are formed as shown in FIG. 1d.
1, A2, A3, A4 and lead patterns D1 to D
Drill or press work to make a hole near the outer contour line F of the lead pattern where B1 to C and B2 to B3 are extended. Alternatively, as shown in FIG. 1e, the purpose is achieved by cutting off the blank area including the lead patterns D1 to D2 by milling.
穴あけ、ミーリング加工のいずれの場合も絶縁
基板1の外形輪郭線F上のリードパターンは、当
該加工によらず外形を切り離す工程においても目
的は達せられる。 In either case of drilling or milling, the purpose of forming a lead pattern on the outer contour line F of the insulating substrate 1 can be achieved even in the process of cutting out the outer shape, regardless of the processing.
かゝる従来の例えばドリル加工を施した場合は
第2図のように、ミーリング加工した場合には第
3図のような断面状態となる。こゝでドリルはリ
ードパターンに対して垂直に進行し、かつ水平の
一方向に回転するために第3図、第4図の断面で
示す如く金属の切削部2a,2bに金属の粘性に
より「ひげ」「バリ」が発生するので、かゝる場
合独立すべき端子パターンA1,A2,A3,A
4が隣同士で電気的に短絡したり又はパターンの
間隔が極めて狭くなる。 For example, when such conventional drilling is performed, the cross-sectional state is as shown in FIG. 2, and when milling is performed, the cross-sectional state is as shown in FIG. Here, since the drill advances perpendicularly to the lead pattern and rotates in one direction horizontally, " In such cases, the terminal patterns A1, A2, A3, A should be independent.
4 may be electrically short-circuited with each other, or the spacing between the patterns may become extremely narrow.
絶縁基板1にはガラス布と合成樹脂を積層接着
させた積層板が使われ、ドリル加工とかミーリン
グ加工された場合その破断面1aは凹凸が大きく
かつミクロ的には積層接着されたガラス布と合成
樹脂間では加工時の機械的衝撃により剥離が生じ
ている。 The insulating substrate 1 is made of a laminated board made by laminating and bonding glass cloth and synthetic resin, and when drilled or milled, the fractured surface 1a has large irregularities and is microscopically composed of the laminated and bonded glass cloth. Peeling occurs between resins due to mechanical impact during processing.
又、プレス加工時の様な打ち抜き加工の状態は
第4図の断面図のように銅パターン破断面2aは
絶縁基板の破断面1aに相当入り込み、絶縁基板
1の厚みが薄い場合、この打ち抜き穴を介して表
裏の銅パターン2が短絡するか、極めて接近しパ
ターン間隙が極めて小さくなる。 In addition, in the state of punching such as during press working, the copper pattern fracture surface 2a penetrates considerably into the fracture surface 1a of the insulating substrate, as shown in the cross-sectional view of FIG. The copper patterns 2 on the front and back sides are short-circuited or brought very close to each other, and the pattern gap becomes extremely small.
かゝる従来の方法で製造された印刷配線板が例
えば湿度の高い雰囲気等で使用されると絶縁基板
1の破断面1aは前述の様な粗面状態にあるため
極めて結露し易く銅パターン2の破断面2a,2
bがこれら絶縁基板の破断面1aに近接しており
独立した端子パターンA1,A2,A3,A4の
銅パターンの破断面2aと2b間の電気絶縁性が
損なわれる。 When a printed wiring board manufactured by such a conventional method is used, for example, in a humid atmosphere, the fractured surface 1a of the insulating substrate 1 is in a rough surface state as described above, and therefore dew condensation is extremely likely to form on the copper pattern 2. Fractured surface 2a, 2
b is close to the fracture surface 1a of these insulating substrates, and the electrical insulation between the fracture surfaces 2a and 2b of the copper patterns of the independent terminal patterns A1, A2, A3, and A4 is impaired.
更に第2図と第4図の様に表裏を透孔させるリ
ードパターンの切断は裏面での配線エリアを制限
する。一方機械的な加工による切断は、リードパ
ターンの除去する部分として、広い幅の面積を必
要とするため高密度配線の障害になる等の欠点が
あつた。 Furthermore, as shown in FIGS. 2 and 4, cutting the lead pattern so that the front and back sides are perforated limits the wiring area on the back side. On the other hand, mechanical cutting requires a wide area for the portion of the lead pattern to be removed, which has the disadvantage of interfering with high-density wiring.
本発明の目的はかかる従来の印刷配線板が有し
ている欠点を除去し、電気的特性が良く高密度配
線が可能な印刷配線板を提供することにある。 An object of the present invention is to eliminate the drawbacks of such conventional printed wiring boards and to provide a printed wiring board with good electrical characteristics and capable of high-density wiring.
本発明によれば絶縁基板上に貼られた表面銅層
をエツチングして得られた配線パターンを有する
配線基板上の所望部分を剥離可能な耐めつき性を
有する第1の被膜で被つた後所望する配線パター
ンに選択的にオーバーレイめつきを施した後、第
1の被膜を除去して、耐エツチング性を有する第
2の絶縁基板でリードパターンを除く銅回路を含
む所望部分を被つた後に、リードパターンのみを
選択的にエツチング除去する工程を含むことを特
徴とする印刷配線板が得られる。 According to the present invention, after a desired portion of a wiring board having a wiring pattern obtained by etching a surface copper layer pasted on an insulating board is covered with a peelable first film having anti-stick properties. After selectively applying overlay plating to the desired wiring pattern, the first film is removed and the desired portion including the copper circuit excluding the lead pattern is covered with a second insulating substrate having etching resistance. , a printed wiring board characterized by including a step of selectively etching away only the lead pattern is obtained.
以下本発明による印刷配線板の製造方法を実施
例図面を参照して工程順に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The method for manufacturing a printed wiring board according to the present invention will be explained below in order of steps with reference to the drawings.
第5図aは一般的なエツチング法によつて銅パ
ターンを形成した状態でA1,A2,A3,A4
は独立した端子パターン、又B1,B2,B3,
Cは接続された座及び端子パターンであり、これ
らはオーバーレイめつきを必要とする部分であ
る。こゝで端子パターンA1,A2,A3,A4
は座パターンB1から端子パターンCを接続して
いるB1〜C接続パターンに端子リードパターン
からの導出リードパターンで接続されている。更
にB1〜C接続パターン及びB2〜B3接続パタ
ーンを延長した外部延長リードパターンB1〜E
及びB2〜Eはめつき用接点パターンEに接続さ
れている。 Figure 5a shows A1, A2, A3, A4 with copper patterns formed by a general etching method.
are independent terminal patterns, and B1, B2, B3,
C is the connected seat and terminal pattern, which are the parts that require overlay plating. Here, terminal patterns A1, A2, A3, A4
The terminal pattern C is connected to the B1 to C connection patterns connecting the terminal pattern C from the dowel pattern B1 by a lead pattern derived from the terminal lead pattern. External extension lead patterns B1 to E that further extend the B1 to C connection patterns and B2 to B3 connection patterns
and B2 to E are connected to the plating contact pattern E.
第5図bではオーバーレイめつきを必要とする
端子パターンA1,A2,A3,A4、座パター
ンB1,B2,B3、端子パターンC以外の所望
部分に耐めつき性を有する第1の皮膜(以下第1
の皮膜と略称)例えば耐めつき性スクリーンイン
クとかドライフイルムを斜線の如く付着させる。 In Fig. 5b, a first coating having plating resistance (hereinafter referred to as 1st
(Abbreviated as ``film'')) For example, apply anti-stick screen ink or dry film as shown in the diagonal lines.
次にオーバーレイめつきを施す必要のある端子
パターンA1,A2,A3,A4、座パターンB
1,B2,B3、端子パターンCに例えばニツケ
ル、金めつきのような2重層めつき、又は半田と
かの一般に知られたオーバーレイめつき銅パター
ン2の上に施すことより第5図cの状態となる。
この際めつきに必要な電気はB1〜C接続パター
ン、B2〜B3接続パターンの先端に設けた外部
延長リードパターンを製品外の余白部分に設けめ
つき接点パターンEに接続し供給される。 Terminal patterns A1, A2, A3, A4 and seat pattern B that require overlay plating next
1, B2, B3, terminal pattern C is coated with double layer plating such as nickel or gold plating, or commonly known overlay plating such as solder on top of the copper pattern 2, resulting in the state shown in Figure 5 c. Become.
At this time, the electricity necessary for plating is supplied by connecting external extension lead patterns provided at the tips of the B1 to C connection patterns and B2 to B3 connection patterns to a plating contact pattern E provided in a margin outside the product.
オーバーレイめつきを施した後、金めつきを必
要としない部分に付着した第1の皮膜を例えばハ
ロゲン系炭化水素、アルコール系、エステル系等
の溶剤、苛性ソーダ、苛性カリを含んだアルカリ
性溶液の様に、第1の皮膜として使用されためつ
きレジストに適合した剥離液を用いて溶解除去す
る。この結果金めつきを必要としない銅層の配線
パターンとリードパターンが露出した状態となる
第5図d)。 After overlay plating, the first film attached to areas that do not require gold plating is treated with a solvent such as halogenated hydrocarbon, alcohol, or ester, caustic soda, or an alkaline solution containing caustic potash. , the resist is dissolved and removed using a stripping solution compatible with the fleck resist used as the first film. As a result, the wiring pattern and lead pattern of the copper layer, which do not require gold plating, are exposed (FIG. 5d).
次にリードパターンを除く銅層配線パターンを
含む所望部分に第2の耐エツチング性を有する絶
縁皮膜を付着させる。この結果オーバーレイめつ
きを施したパターンとリードパターンが露出した
第5図eの状態となる。 Next, a second etching-resistant insulating film is deposited on a desired portion including the copper layer wiring pattern excluding the lead pattern. As a result, the state shown in FIG. 5e is obtained in which the overlay plating pattern and the lead pattern are exposed.
こゝで露出させたリードパターンを例えばオー
バーレイめつきとしてニツケル、金を施した場合
には、過硫酸アンモニウムを含んだ溶液、アルカ
リエツチヤント等一般に良く知られたエツチング
液により溶解除去することにより端子パターンA
1,A2,A3,A4はB1とCを接続するパタ
ーンから切り離なされた所望の独立した端子パタ
ーンとなる。又B1〜C接続パターンとB2〜B
3接続パターンは製品外に設けられためつき接点
パターンEから切り離なされ、絶縁基板1上には
所望する部分のみにオーバーレイめつきを施した
所望パターンが形成され(第5図f)最終工程に
より外形輪郭線から切断され所望の印刷配線板を
得る。 If the exposed lead pattern is overlaid with nickel or gold, for example, the terminal pattern can be removed by dissolving and removing it with a well-known etching solution such as a solution containing ammonium persulfate or an alkaline etchant. A
1, A2, A3, and A4 become desired independent terminal patterns separated from the pattern connecting B1 and C. Also, B1-C connection pattern and B2-B
3 connection pattern is separated from the folding contact pattern E provided outside the product, and a desired pattern is formed on the insulating substrate 1 with overlay plating applied only to the desired portion (FIG. 5f). In the final process, A desired printed wiring board is obtained by cutting from the outer contour line.
この結果第6図の断面図の如く形成輪郭線Fよ
り切断された絶縁基板1の破断面1aに基板1上
に設けられたパターン21,22が直接接するこ
とが避けられる。又パターン23と41にはリー
ドパターンが有り第6図はリードパターンがエツ
チング除去された状態である。この結果裏面にパ
ターン42の配線ができる利点がある。 As a result, the patterns 21 and 22 provided on the substrate 1 are prevented from coming into direct contact with the fractured surface 1a of the insulating substrate 1 cut along the forming contour line F as shown in the cross-sectional view of FIG. Further, patterns 23 and 41 have lead patterns, and FIG. 6 shows the state in which the lead patterns have been removed by etching. As a result, there is an advantage that the pattern 42 can be wired on the back side.
以上述べたように本発明の製造方法において
は、銅パターンに部分的オーバーレイめつきを施
すため、余白部にリードパターンを設けオーバー
レイめつきした後、エツチング除去することによ
り従来機械加工された絶縁基板の破断面に導体パ
ターンが直接に接することが避けられるので電気
的特性が優れた高密度印刷配線板を提供できると
いう利点を持ち、特にLSIの如く高密度化された
部品を搭載する印刷配線板に利用し極めて有効で
ある。 As described above, in the manufacturing method of the present invention, in order to perform partial overlay plating on a copper pattern, a lead pattern is provided in the blank area, overlay plating is performed, and then removed by etching, thereby forming a conventionally machined insulating substrate. This has the advantage that it is possible to provide high-density printed wiring boards with excellent electrical properties because the conductor pattern does not come into direct contact with the fractured surface of It is extremely effective.
第1図a〜eは従来の印刷配線板の製造工程を
説明する平面図、第2図乃至第4図は従来方法で
得られた印刷配線板の同断面図。第5図a〜fは
本発明に係る印刷配線板の製造工程を説明する平
面図。第6図は本発明の方法で得られた印刷配線
板の断面図である。
1……絶縁基板、2……銅パターン、3……耐
めつき性を有する有機絶縁皮膜層、4……銅パタ
ーン上に施されたオーバーレイめつき、5……剥
離可能な耐めつき性レジスタ皮膜、6……耐エツ
チング性を有する有機絶縁皮膜、A1,A2,A
3,A4,C……端子パターン、B1,B2,B
3……座パターン、D1〜D2……リードパター
ン、E……めつき接点パターン、F……外形輪郭
線、1a……絶縁基板の破断面、2a,2b……
銅パターンの破断面。
1A to 1E are plan views illustrating the manufacturing process of a conventional printed wiring board, and FIGS. 2 to 4 are sectional views of the printed wiring board obtained by the conventional method. FIGS. 5a to 5f are plan views illustrating the manufacturing process of the printed wiring board according to the present invention. FIG. 6 is a sectional view of a printed wiring board obtained by the method of the present invention. 1... Insulating substrate, 2... Copper pattern, 3... Organic insulating film layer having anti-plating properties, 4... Overlay plating applied on the copper pattern, 5... Peelable anti-plating properties Resistor film, 6...Organic insulating film having etching resistance, A1, A2, A
3, A4, C...Terminal pattern, B1, B2, B
3... Seat pattern, D1-D2... Lead pattern, E... Plated contact pattern, F... External outline, 1a... Fractured surface of insulating substrate, 2a, 2b...
Fractured surface of copper pattern.
Claims (1)
ン同士を接続及び外部に電気的に導出接続するリ
ードパターンとを設ける工程と、前記配線パター
ン及びリードパターンを含む所望部分に選択的に
耐めつき性を有する剥離可能な皮膜を付着させる
工程と、前記所望配線パターンに選択的にオーバ
ーレイめつきを施す工程と、前記所望部分に付着
した耐めつき性を有する皮膜を除去する工程と、
前記のリードパターンを除く銅層配線パターンを
含む所望部分に耐エツチング性を有する絶縁被膜
を付着させる工程と、前記リードパターンを除去
する工程とを有することを特徴とする印刷配線板
の製造方法。1. A step of providing a wiring pattern and a lead pattern for connecting the wiring patterns to each other and electrically connecting them to the outside on an insulating substrate, and selectively imparting plating resistance to a desired portion including the wiring pattern and the lead pattern. a step of selectively applying overlay plating to the desired wiring pattern; and a step of removing the plating-resistant film adhering to the desired portion;
A method for manufacturing a printed wiring board, comprising the steps of: attaching an etching-resistant insulating film to a desired portion including a copper layer wiring pattern excluding the lead pattern; and removing the lead pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14397478A JPS5570090A (en) | 1978-11-21 | 1978-11-21 | Method of manufacturing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14397478A JPS5570090A (en) | 1978-11-21 | 1978-11-21 | Method of manufacturing printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5570090A JPS5570090A (en) | 1980-05-27 |
JPH0352236B2 true JPH0352236B2 (en) | 1991-08-09 |
Family
ID=15351374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14397478A Granted JPS5570090A (en) | 1978-11-21 | 1978-11-21 | Method of manufacturing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5570090A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58225697A (en) * | 1982-06-25 | 1983-12-27 | ソニー株式会社 | Method of producing metal base printed circuit board |
JPS59108580A (en) * | 1983-11-17 | 1984-06-23 | 株式会社ソフイア | Infarmation recording card of card type pinball machine |
-
1978
- 1978-11-21 JP JP14397478A patent/JPS5570090A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5570090A (en) | 1980-05-27 |
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