JPH0351992Y2 - - Google Patents

Info

Publication number
JPH0351992Y2
JPH0351992Y2 JP1983039187U JP3918783U JPH0351992Y2 JP H0351992 Y2 JPH0351992 Y2 JP H0351992Y2 JP 1983039187 U JP1983039187 U JP 1983039187U JP 3918783 U JP3918783 U JP 3918783U JP H0351992 Y2 JPH0351992 Y2 JP H0351992Y2
Authority
JP
Japan
Prior art keywords
heat sink
nickel
integrated circuit
hybrid integrated
electrode pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983039187U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59145083U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983039187U priority Critical patent/JPS59145083U/ja
Publication of JPS59145083U publication Critical patent/JPS59145083U/ja
Application granted granted Critical
Publication of JPH0351992Y2 publication Critical patent/JPH0351992Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1983039187U 1983-03-17 1983-03-17 混成集積回路 Granted JPS59145083U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983039187U JPS59145083U (ja) 1983-03-17 1983-03-17 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983039187U JPS59145083U (ja) 1983-03-17 1983-03-17 混成集積回路

Publications (2)

Publication Number Publication Date
JPS59145083U JPS59145083U (ja) 1984-09-28
JPH0351992Y2 true JPH0351992Y2 (cs) 1991-11-08

Family

ID=30169839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983039187U Granted JPS59145083U (ja) 1983-03-17 1983-03-17 混成集積回路

Country Status (1)

Country Link
JP (1) JPS59145083U (cs)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140754B2 (cs) * 1972-12-25 1976-11-05
JPS56157086A (en) * 1980-05-09 1981-12-04 Tokyo Shibaura Electric Co Hybrid integrated circuit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140754U (cs) * 1974-09-20 1976-03-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140754B2 (cs) * 1972-12-25 1976-11-05
JPS56157086A (en) * 1980-05-09 1981-12-04 Tokyo Shibaura Electric Co Hybrid integrated circuit

Also Published As

Publication number Publication date
JPS59145083U (ja) 1984-09-28

Similar Documents

Publication Publication Date Title
JPH0476212B2 (cs)
JP2002151633A (ja) 樹脂封止型半導体装置
JPH05218233A (ja) 半導体装置およびその製造方法
JPH0351992Y2 (cs)
JPS6050354B2 (ja) 樹脂封止型半導体装置
JPH06283639A (ja) 混成集積回路
JPH03195053A (ja) インバータ装置
JPH06132441A (ja) 樹脂封止型半導体装置及びその製造方法
JP2735920B2 (ja) インバータ装置
JPH0142832B2 (cs)
JPH0442937Y2 (cs)
JP2571814Y2 (ja) 面実装型半導体装置
JP2771575B2 (ja) 混成集積回路
JPH0636592Y2 (ja) 混成集積回路装置
JP2619155B2 (ja) 混成集積回路装置
JPH0436121Y2 (cs)
JPS5858785A (ja) 半導体レ−ザ−装置
JP2744097B2 (ja) 混成集積回路
JPH04171848A (ja) 半導体装置
JPS5918685Y2 (ja) 混成厚膜集積回路装置
JPS60174244U (ja) 混成集積回路
JP2536626Y2 (ja) 混成集積回路
JPH04303953A (ja) 半導体装置
JPH0693482B2 (ja) 樹脂封止型半導体装置
JPS6236391B2 (cs)