JPH0351984Y2 - - Google Patents
Info
- Publication number
- JPH0351984Y2 JPH0351984Y2 JP19119884U JP19119884U JPH0351984Y2 JP H0351984 Y2 JPH0351984 Y2 JP H0351984Y2 JP 19119884 U JP19119884 U JP 19119884U JP 19119884 U JP19119884 U JP 19119884U JP H0351984 Y2 JPH0351984 Y2 JP H0351984Y2
- Authority
- JP
- Japan
- Prior art keywords
- land
- hole
- circuit board
- wiring pattern
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 27
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19119884U JPH0351984Y2 (da) | 1984-12-17 | 1984-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19119884U JPH0351984Y2 (da) | 1984-12-17 | 1984-12-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61106063U JPS61106063U (da) | 1986-07-05 |
| JPH0351984Y2 true JPH0351984Y2 (da) | 1991-11-08 |
Family
ID=30748638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19119884U Expired JPH0351984Y2 (da) | 1984-12-17 | 1984-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351984Y2 (da) |
-
1984
- 1984-12-17 JP JP19119884U patent/JPH0351984Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61106063U (da) | 1986-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10135596A (ja) | フレキシブルプリント基板 | |
| JPH0351984Y2 (da) | ||
| JPS6310582U (da) | ||
| JPH02214191A (ja) | フレキシブルプリント配線板の接続構造 | |
| JPH0343724Y2 (da) | ||
| JPH0132392Y2 (da) | ||
| JPH02129762U (da) | ||
| JPS6246296Y2 (da) | ||
| JPS59180470U (ja) | プリント基板の接続構造 | |
| JPS62116580U (da) | ||
| JPH045280B2 (da) | ||
| JPS5926620Y2 (ja) | 印刷配線板 | |
| JPS5932151Y2 (ja) | フレキシブル印刷配線板の多層接続構造 | |
| JPS6120080U (ja) | 多層プリント配線板 | |
| JPH0288268U (da) | ||
| JPH0448676A (ja) | フレキシブル印刷配線板 | |
| JPS6016577U (ja) | プリント板 | |
| JPS60101774U (ja) | プリント基板 | |
| JPS60167365U (ja) | プリント配線板 | |
| JPS59109178U (ja) | 電子回路装置 | |
| JPS5974760U (ja) | 両面プリント配線体 | |
| JPH03113865U (da) | ||
| JPS63195777U (da) | ||
| JPS62214688A (ja) | 両面印刷配線板用セラミツク基板 | |
| JPS6048271U (ja) | 電気回路基板 |