JPH0351840U - - Google Patents
Info
- Publication number
- JPH0351840U JPH0351840U JP11307989U JP11307989U JPH0351840U JP H0351840 U JPH0351840 U JP H0351840U JP 11307989 U JP11307989 U JP 11307989U JP 11307989 U JP11307989 U JP 11307989U JP H0351840 U JPH0351840 U JP H0351840U
- Authority
- JP
- Japan
- Prior art keywords
- back side
- chip
- semiconductor device
- conductive material
- penetrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は従来の半導体チツプの断面図である。
１……半導体チツプ、２……パツド部、３……
導電性材料、４……バンプ、５……絶縁層、更に
第３図は、本考案の半導体装置を封止した実施例
の上面図、第４図は本考案の半導体装置を封止し
た実施例の部分斜視図である。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional semiconductor chip. 1... Semiconductor chip, 2... Pad portion, 3...
Conductive material, 4... Bump, 5... Insulating layer, and FIG. 3 is a top view of an embodiment in which the semiconductor device of the present invention is sealed, and FIG. 4 is a top view of an embodiment in which the semiconductor device of the present invention is sealed. FIG. 3 is a partial perspective view of an example.
Claims (1)
導体チツプの裏面を取付面とし、表面のパツドか
ら垂直方向に導電性材料を貫通させる事によりチ
ツプ裏面に接続バンプを有する事を特徴とする半
導体装置。 A semiconductor device characterized in that, in resin encapsulation using a lead frame, the back side of a semiconductor chip is used as a mounting surface, and connection bumps are provided on the back side of the chip by penetrating a conductive material in a vertical direction from a pad on the front side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11307989U JPH0351840U (en) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11307989U JPH0351840U (en) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351840U true JPH0351840U (en) | 1991-05-20 |
Family
ID=31661505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11307989U Pending JPH0351840U (en) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351840U (en) |
-
1989
- 1989-09-26 JP JP11307989U patent/JPH0351840U/ja active Pending