JPH0351773B2 - - Google Patents

Info

Publication number
JPH0351773B2
JPH0351773B2 JP12048789A JP12048789A JPH0351773B2 JP H0351773 B2 JPH0351773 B2 JP H0351773B2 JP 12048789 A JP12048789 A JP 12048789A JP 12048789 A JP12048789 A JP 12048789A JP H0351773 B2 JPH0351773 B2 JP H0351773B2
Authority
JP
Japan
Prior art keywords
rhodium
plating solution
plating
added
white
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12048789A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02301590A (ja
Inventor
Hideaki Mori
Yukio Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishifuku Metal Industry Co Ltd
Original Assignee
Ishifuku Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishifuku Metal Industry Co Ltd filed Critical Ishifuku Metal Industry Co Ltd
Priority to JP12048789A priority Critical patent/JPH02301590A/ja
Publication of JPH02301590A publication Critical patent/JPH02301590A/ja
Publication of JPH0351773B2 publication Critical patent/JPH0351773B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP12048789A 1989-05-16 1989-05-16 光沢ロジウムめっき液 Granted JPH02301590A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12048789A JPH02301590A (ja) 1989-05-16 1989-05-16 光沢ロジウムめっき液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12048789A JPH02301590A (ja) 1989-05-16 1989-05-16 光沢ロジウムめっき液

Publications (2)

Publication Number Publication Date
JPH02301590A JPH02301590A (ja) 1990-12-13
JPH0351773B2 true JPH0351773B2 (pt) 1991-08-07

Family

ID=14787403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12048789A Granted JPH02301590A (ja) 1989-05-16 1989-05-16 光沢ロジウムめっき液

Country Status (1)

Country Link
JP (1) JPH02301590A (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111850631B (zh) * 2020-07-30 2021-10-08 金川集团股份有限公司 高光泽装饰性镀铑层电镀液

Also Published As

Publication number Publication date
JPH02301590A (ja) 1990-12-13

Similar Documents

Publication Publication Date Title
JP3354767B2 (ja) アルカリ亜鉛および亜鉛合金電気めっき浴およびプロセス
EP2635723B1 (en) Dark colored chromium based electrodeposits
JPH0310714B2 (pt)
US3458409A (en) Method and electrolyte for thick,brilliant plating of palladium
CA1255247A (en) Process for preparing zn-fe base alloy electroplated steel strips
JP2002317294A (ja) 電気メッキパラジウム合金組成物及びその組成物を用いる電気メッキ法
JPH0338351B2 (pt)
JP3302949B2 (ja) 黒色ルテニウムめっき液
JP5336762B2 (ja) 銅‐亜鉛合金電気めっき浴およびこれを用いためっき方法
US3380898A (en) Electrolyte and method for electrodepositing a pink gold alloy
JPS6220279B2 (pt)
IT8047741A1 (it) Bagno acido e procedimento di elettroplaccatura allo zinco
US4699697A (en) High-purity palladium-nickel alloy plating solution and process
US8211286B2 (en) Electrolyte and method for depositing decorative and technical layers of black ruthenium
JPH0351773B2 (pt)
JP3101061B2 (ja) 白金無電解めっき浴及びそれを用いた白金めっき品の製造方法
WO2009093499A1 (ja) 3価クロムめっき浴
US4436595A (en) Electroplating bath and method
US3528895A (en) Plating low stress bright rhodium
JP3462338B2 (ja) 半光沢銀めっき用の光沢度調整剤
JP2717406B2 (ja) 亜鉛合金メッキの黒色化方法
SE545031C2 (en) Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof
EP4370732A1 (en) Electroplating compositions and methods for preparing the same
JP2560021B2 (ja) 光沢ロジウムめつき液
JPS647159B2 (pt)