JPH0351302B2 - - Google Patents
Info
- Publication number
- JPH0351302B2 JPH0351302B2 JP16491585A JP16491585A JPH0351302B2 JP H0351302 B2 JPH0351302 B2 JP H0351302B2 JP 16491585 A JP16491585 A JP 16491585A JP 16491585 A JP16491585 A JP 16491585A JP H0351302 B2 JPH0351302 B2 JP H0351302B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sheet
- silicone rubber
- transistor
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002379 silicone rubber Polymers 0.000 claims description 13
- 239000004945 silicone rubber Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000004519 grease Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16491585A JPS6225440A (ja) | 1985-07-25 | 1985-07-25 | 電気部品用熱伝導性シ−ト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16491585A JPS6225440A (ja) | 1985-07-25 | 1985-07-25 | 電気部品用熱伝導性シ−ト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6225440A JPS6225440A (ja) | 1987-02-03 |
| JPH0351302B2 true JPH0351302B2 (enrdf_load_stackoverflow) | 1991-08-06 |
Family
ID=15802273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16491585A Granted JPS6225440A (ja) | 1985-07-25 | 1985-07-25 | 電気部品用熱伝導性シ−ト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225440A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4085342B2 (ja) * | 1997-10-14 | 2008-05-14 | 松下電器産業株式会社 | 熱伝導部品およびそれを用いた熱接続構造体 |
| WO2014196347A1 (ja) * | 2013-06-07 | 2014-12-11 | 信越化学工業株式会社 | 熱伝導性複合シート及び放熱構造体 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
-
1985
- 1985-07-25 JP JP16491585A patent/JPS6225440A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4085342B2 (ja) * | 1997-10-14 | 2008-05-14 | 松下電器産業株式会社 | 熱伝導部品およびそれを用いた熱接続構造体 |
| WO2014196347A1 (ja) * | 2013-06-07 | 2014-12-11 | 信越化学工業株式会社 | 熱伝導性複合シート及び放熱構造体 |
| JPWO2014196347A1 (ja) * | 2013-06-07 | 2017-02-23 | 信越化学工業株式会社 | 熱伝導性複合シート及び放熱構造体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6225440A (ja) | 1987-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |