JPH0351080B2 - - Google Patents

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Publication number
JPH0351080B2
JPH0351080B2 JP58222766A JP22276683A JPH0351080B2 JP H0351080 B2 JPH0351080 B2 JP H0351080B2 JP 58222766 A JP58222766 A JP 58222766A JP 22276683 A JP22276683 A JP 22276683A JP H0351080 B2 JPH0351080 B2 JP H0351080B2
Authority
JP
Japan
Prior art keywords
fluid
injection
thin film
thin
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58222766A
Other languages
Japanese (ja)
Other versions
JPS60115192A (en
Inventor
Hiroshi Washimi
Yasuo Konishi
Shiro Kabashima
Tsutomu Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP58222766A priority Critical patent/JPS60115192A/en
Publication of JPS60115192A publication Critical patent/JPS60115192A/en
Publication of JPH0351080B2 publication Critical patent/JPH0351080B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 イ 産業上の利用分野 本発明は交流電界の印加によつてEL(Electro
Luminescence)発光を呈する薄膜EL素子を使用
したEL表示パネルに対して有効な技術となる薄
膜EL素子保護用流体の注入孔封止構造に関する
ものである。
[Detailed Description of the Invention] A. Field of Industrial Application The present invention provides EL (Electro
This invention relates to a structure for sealing the injection hole of a fluid for protecting thin-film EL elements, which is an effective technique for EL display panels using thin-film EL elements that emit light (luminescence).

ロ 従来技術 従来、交流動作の薄膜EL素子に関して、発光
層に規則的に高い電界(106V/cm程度)を印加
し、絶縁耐圧、発光効率及び動作の安定性等を高
めるために、0.1〜2.0Wt%のMn(あるいはCn、
Al、Br等)をドープしたZnS、ZnSe等の半導体
発光層をY2O3、TiO2等の誘電体薄膜でサンドイ
ツチした三層構造ZnS:Mn(又はZnSe:Mn)
EL素子が開発され、発光諸特性の向上が確かめ
られている。この薄膜EL素子は数KHzの交流電
界印加によつて高輝度発光し、しかも長寿命であ
るという特徴を有している。
B. Prior Art Conventionally, for AC-operated thin-film EL devices, a high electric field (about 10 6 V/cm) was regularly applied to the light-emitting layer to improve dielectric strength, luminous efficiency, operational stability, etc. ~2.0Wt% Mn (or Cn,
A three-layer structure ZnS:Mn (or ZnSe:Mn) in which a semiconductor light-emitting layer such as ZnS, ZnSe, etc. doped with Al, Br , etc. is sandwiched with a dielectric thin film such as Y 2 O 3 , TiO 2, etc.
EL devices have been developed, and improvements in various light-emitting characteristics have been confirmed. This thin film EL element emits high-intensity light when an alternating current electric field of several KHz is applied, and has a long lifespan.

薄膜EL素子の1例としてZnS:Mn薄膜EL素
子の基本的構造を第1図に示す。
As an example of a thin film EL device, the basic structure of a ZnS:Mn thin film EL device is shown in FIG.

第1図に基いて薄膜EL素子の構造を具体的に
説明すると、ガラス基板1上にIn2O3、SnO2等の
透明電極2、更にその上に積層してY2O3
TiO2、Al2O3、Si3N4、SiO2等からなる第1の誘
電体層3がスパツタあるいは電子ビーム蒸着法等
により重畳形成されている。第1の誘電体層3上
にはZnS:Mn焼結ペレツトを電子ビーム蒸着す
ることにより得られるZnS発光層4が形成されて
いる。この時蒸着用のZnS:Mn焼結ペレツトに
は活性物質となるMnが目的に応じた濃度に設定
されたペレツトが使用される。ZnS発光層4上に
は第1の誘電体層3と同様の材質から成る第2の
誘電体層5が積層され、更にその上にA1等から
成る背面電極6が蒸着形成されている。透明電極
2と背面電極6は第2図に示すように帯状に成形
され、互いに直交する如く複数本配列されたマト
リツクス電極構造が採用されており、透明電極2
と背面電極6が平面図的に見て交叉した位置がパ
ネルの1画素に相当する。透明電極2と背面電極
6は交流電源7に接続され、薄膜EL素子が駆動
される。
The structure of the thin film EL element will be explained in detail based on FIG. 1. A transparent electrode 2 made of In 2 O 3 , SnO 2 , etc. is placed on a glass substrate 1, and Y 2 O 3 , etc.
A first dielectric layer 3 made of TiO 2 , Al 2 O 3 , Si 3 N 4 , SiO 2 or the like is formed in an overlapping manner by sputtering or electron beam evaporation. A ZnS light emitting layer 4 is formed on the first dielectric layer 3 by electron beam evaporation of ZnS:Mn sintered pellets. At this time, the ZnS:Mn sintered pellets used for deposition are pellets in which the concentration of Mn, which is an active substance, is set to suit the purpose. A second dielectric layer 5 made of the same material as the first dielectric layer 3 is laminated on the ZnS light emitting layer 4, and a back electrode 6 made of A1 or the like is further deposited thereon. As shown in FIG. 2, the transparent electrode 2 and the back electrode 6 are formed into a strip shape, and a matrix electrode structure is adopted in which a plurality of electrodes are arranged perpendicularly to each other.
The position where and the back electrode 6 intersect in plan view corresponds to one pixel of the panel. The transparent electrode 2 and the back electrode 6 are connected to an AC power source 7, and the thin film EL element is driven.

電極2,6間にAC電圧を印加すると、ZnS発
光層4の両側の誘電体層3,5間に上記AC電圧
が誘起されることになり、従つてZnS発光層4内
に発生した電界によつて伝導体に励起され、かつ
加速されて充分なエネルギーを得た電子が、直接
Mn発光センターを励起し、励起されたMn発光
センターが基底状態に戻る際に黄色の発光を行な
う。即ち高電界で加速された電子がZnS発光層4
中の発光センターであるZnサイトに入つたMn原
子の電子を励起し、基底状態に落ちる時、略々
5850Åをピークに幅広い波長領域で強い発光を呈
する。
When an AC voltage is applied between the electrodes 2 and 6, the above AC voltage is induced between the dielectric layers 3 and 5 on both sides of the ZnS luminescent layer 4, and therefore the electric field generated within the ZnS luminescent layer 4 Therefore, electrons that are excited and accelerated by the conductor and have obtained sufficient energy can directly
The Mn luminescent center is excited, and when the excited Mn luminescent center returns to the ground state, it emits yellow light. In other words, electrons accelerated by a high electric field reach the ZnS light emitting layer 4.
When the electron of the Mn atom that enters the Zn site, which is the luminescent center of the inside, is excited and falls to the ground state, approximately
It emits strong light in a wide wavelength range with a peak of 5850 Å.

上記の如き構造を有する薄膜EL素子はスペー
スフアクタの利点を生かした平面薄型デイスプレ
イ・デバイスとして、文字及び図形を含むコンピ
ユーターの出力表示端末機器その他種々の表示装
置に文字、記号、静止画像、動画像等の表示手段
とし利用することができ非常に有効なものであ
る。
The thin film EL element having the structure described above can be used as a flat thin display device that takes advantage of the space factor to display characters, symbols, still images, moving images, etc. It can be used as a means of displaying images, etc., and is very effective.

しかしながら薄膜EL素子の誘電体層は製造工
程途中で発生した多数のピンホールやマイクロク
ラツク等を含み、これらの欠陥を通してZnS発光
層4に湿気等が侵入するため、EL発光損失によ
る発熱、層間剥離、素子特性の劣化等を招来す
る。
However, the dielectric layer of a thin-film EL element contains many pinholes and microcracks generated during the manufacturing process, and moisture, etc. enters the ZnS light-emitting layer 4 through these defects, causing heat generation due to EL emission loss and interlayer This may lead to peeling, deterioration of device characteristics, etc.

上記問題を解決することを目的として、第3図
に示すように、薄膜EL素子特有の不完全さ、即
ちピンホール等によつて通電時に生じるブレーク
ダウンのため起る微小な熱損傷領域の拡大を防
止、固定化し、大気環境下での湿気保護、放熱効
果、さらに振動、たわみに対しても有効となる薄
膜ELパネル8が知られている。
In order to solve the above problem, as shown in Figure 3, we have investigated the expansion of the microscopic thermal damage area that occurs due to the breakdown caused by imperfections peculiar to thin film EL elements, such as pinholes, during energization. A thin-film EL panel 8 is known that prevents and fixes moisture in an atmospheric environment, has a heat dissipation effect, and is also effective against vibration and deflection.

この薄膜ELパネル8を第3図に基いて説明す
ると、1は第1図に示すガラス基板であり、ガラ
ス基板1上に透明電極2が帯状に一定ピツチ間隔
をもつて平行配列され、薄膜EL素子9が構成さ
れている。この薄膜EL素子9を収納する如く皿
状の背面ガラス板10がガラス基板1上に重畳さ
れ、その内部間隙に薄膜EL素子9が内蔵される。
ガラス基板1と背面ガラス板10の接合部は光硬
化性樹脂(フオトボンド)等の接着剤で密封され
ている。即ち、ガラス基板1と背面ガラス板10
は薄膜EL素子9に対する外囲器11を構成する。
そして外囲器11内には薄膜EL素子9が内蔵さ
れると共にシリコンオイル、真空グリース等の薄
膜EL素子9保護用の絶縁性保護流体12が充填
封入されている。絶縁性保護流体12に要求され
る条件としてはピンホールへの浸透性があり、絶
縁耐圧が高く、耐熱性、耐湿性に優れ、薄膜EL
素子構成膜と反応せず、蒸気圧、熱膨張係数の小
さい流動性物質であることが望ましいが特にピン
ホールへの浸透性があり絶縁耐圧がある程度高い
こと及び薄膜EL素子構成膜と反応しないことを
要する。
This thin film EL panel 8 will be explained based on FIG. 3. Reference numeral 1 is the glass substrate shown in FIG. Element 9 is configured. A dish-shaped rear glass plate 10 is superimposed on the glass substrate 1 so as to house the thin film EL element 9, and the thin film EL element 9 is built into the internal gap thereof.
The joint between the glass substrate 1 and the rear glass plate 10 is sealed with an adhesive such as photocurable resin (Photobond). That is, the glass substrate 1 and the back glass plate 10
constitutes an envelope 11 for the thin film EL element 9.
A thin film EL element 9 is housed in the envelope 11, and an insulating protective fluid 12 for protecting the thin film EL element 9, such as silicone oil or vacuum grease, is filled and sealed. The requirements for the insulating protective fluid 12 include permeability into pinholes, high dielectric strength, excellent heat resistance and moisture resistance, and thin film EL.
It is desirable that it is a fluid substance that does not react with the element constituent films and has a low vapor pressure and coefficient of thermal expansion, but in particular it must be able to penetrate pinholes, have a somewhat high dielectric strength voltage, and not react with the thin film EL element constituent films. It takes.

又、薄膜EL素子9の透明電極2及び背面電極
6のリード端子部はガラス基板1と背面ガラス板
10の接合部を介して外囲器11外部のガラス基
板1上へその一端が延設され、駆動制御用回路
(図示せず)と電気的に接続されている。
Further, one end of the lead terminal portions of the transparent electrode 2 and the back electrode 6 of the thin film EL element 9 is extended onto the glass substrate 1 outside the envelope 11 via the joint between the glass substrate 1 and the back glass plate 10. , and are electrically connected to a drive control circuit (not shown).

上記構成から成る薄膜ELパネル8において絶
縁性保護流体12は背面ガラス板10に設けられ
ている注入孔13から注入されて封止されるので
あるが、その工程手順を以下に示す。(特公昭57
−47559、特開昭57−191991)まず第4図に示す
ように背面ガラス板10としては厚さ3mmのソー
ダガラスが使用され、EL素子構造部の収納部分
がサンドエツチングにより深さ1mm程度に凹陥成
形されている。凹陥成形領域の隅部1箇所には流
体注入用の注入孔13が形成され、中空の注入用
パイプ14が挿入固定されている。注入用パイプ
14は金属製で、注入孔13に接着固定されてい
る。
In the thin film EL panel 8 having the above structure, the insulating protective fluid 12 is injected and sealed through the injection hole 13 provided in the rear glass plate 10, and the process procedure is shown below. (Tokuko Showa 57
-47559, JP-A-57-191991) First, as shown in Fig. 4, soda glass with a thickness of 3 mm is used as the back glass plate 10, and the housing part of the EL element structure is sand etched to a depth of about 1 mm. Concave molded. An injection hole 13 for fluid injection is formed at one corner of the concave molding area, and a hollow injection pipe 14 is inserted and fixed therein. The injection pipe 14 is made of metal and is fixed to the injection hole 13 with adhesive.

流体注入及び封止は第5図a,b、及び第6図
a,b,cに示す操作を介して行なわれる。
Fluid injection and sealing are performed via the operations shown in Figures 5a, b and 6a, b, c.

ガラス基板1と背面ガラス板10で構成される
外囲器11と流体収納槽15を第5図aに示す如
く真空槽16内に設置する。この時外囲器11の
注入パイプ14の先端は流体収納槽15内の注入
流体と離反している。この状態で真空槽16内を
減圧し、注入流体及び薄膜EL素子9のガス出し
を行なう。次に真空保持のまま流体収納槽15を
上昇させ、第5図bに示す如く、注入パイプ14
の先端を注入流体内へ挿入させる。この後、真空
槽16を大気圧下に戻し、これによつて外囲器1
1内へ流体収納槽15内の注入流体が注入パイプ
14を介して流入される。
An envelope 11 composed of a glass substrate 1 and a rear glass plate 10 and a fluid storage tank 15 are placed in a vacuum chamber 16 as shown in FIG. 5a. At this time, the tip of the injection pipe 14 of the envelope 11 is separated from the injection fluid in the fluid storage tank 15. In this state, the pressure inside the vacuum chamber 16 is reduced, and the injected fluid and the gas from the thin film EL element 9 are vented. Next, the fluid storage tank 15 is raised while maintaining the vacuum, and the injection pipe 14 is moved up as shown in FIG. 5b.
Insert the tip into the injection fluid. After this, the vacuum chamber 16 is returned to atmospheric pressure, thereby causing the envelope 1
The injection fluid in the fluid storage tank 15 flows into the injection pipe 1 through the injection pipe 14.

この時真空槽16内を必要に応じて昇温させ、
注入流体の流動性を高めることもできる。
At this time, the temperature inside the vacuum chamber 16 is raised as necessary,
It is also possible to increase the fluidity of the injection fluid.

注入流体の注入操作が完了すると、第5図bに
示す状態で第6図aに示す如く注入パイプ14の
外囲器11接合部近傍部分を圧着し、仮封止を行
なう。その後仮封止部の注入パイプ14を第6図
bに示す如く切断し、切断部をエポキシ系樹脂1
7により第6図cに示す如く封止補強する。
When the injection operation of the injection fluid is completed, in the state shown in FIG. 5b, the portion of the injection pipe 14 near the junction of the envelope 11 is crimped as shown in FIG. 6a to perform temporary sealing. After that, the injection pipe 14 of the temporary sealing part is cut as shown in FIG. 6b, and the cut part is filled with epoxy resin 1.
7 to strengthen the seal as shown in FIG. 6c.

次にこの注入パイプ14封止部を内設可能な凹
陥部を有するガラスキヤツプ18を注入パイプ1
4封止部の背面ガラス板10上に接着剤を介して
被冠し、第7図に示す如く注入流体に対する二重
封止構造を構成する。ガラスキヤツプ18を背面
ガラス板10に接着する接着剤としては光硬化性
接着剤(フオトボンド)等が用いられる。以上に
より封入操作工程が完了する。
Next, a glass cap 18 having a concave portion in which a sealing portion of the injection pipe 14 can be placed is attached to the injection pipe 1.
4 is covered with adhesive on the rear glass plate 10 of the sealing portion, forming a double sealing structure against the injection fluid as shown in FIG. As the adhesive for bonding the glass cap 18 to the rear glass plate 10, a photocurable adhesive (Photobond) or the like is used. With the above steps, the enclosing operation process is completed.

ところが、薄膜ELパネル8における絶縁性保
護流体12の上記従来の注入封止構造によれば、
流体注入用パイプ14は注入孔13に接着固定さ
れるため上記封入操作工程を繰り返す度に新たな
注入用パイプ14の接着固定が必要であり工程が
煩雑となる。
However, according to the conventional injection sealing structure for the insulating protective fluid 12 in the thin film EL panel 8,
Since the fluid injection pipe 14 is adhesively fixed to the injection hole 13, it is necessary to adhesively fix a new injection pipe 14 each time the above-mentioned sealing operation process is repeated, which makes the process complicated.

又、外囲器11内に封入された保護流体12は
密閉状態にあるため、熱サイクルテスト時、動作
時のようにパネル温度上昇の際、保護流体12の
熱膨張が生じ注入パイプ14の前記仮封止部から
保護流体12が漏洩することがある。この漏洩保
護流体はガラスキヤツプ18の凹陥部に貯溜され
るのであるが、注入用パイプ14の仮封止部から
の保護流体12の漏洩は耐湿上好ましくないし、
逆に熱膨張した保護流体12の収縮時、漏れた保
護流体12が元へ戻りにくく、ガラスキヤツプ1
8内の気体を吸い込む不利もある。
Further, since the protective fluid 12 sealed in the envelope 11 is in a sealed state, when the panel temperature rises during a thermal cycle test or during operation, the protective fluid 12 thermally expands and the injection pipe 14 is The protective fluid 12 may leak from the temporary seal. This leakage protection fluid is stored in the recessed part of the glass cap 18, but leakage of the protection fluid 12 from the temporary sealing part of the injection pipe 14 is not desirable in terms of moisture resistance.
Conversely, when the thermally expanded protective fluid 12 contracts, the leaked protective fluid 12 is difficult to return to its original state, and the glass cap 1
There is also the disadvantage of inhaling gas within 8.

ハ 発明の目的 本発明の目的は透光性前面基板と背面板とから
成る外囲器内に薄膜EL素子とその絶縁性保護流
体を収納した薄膜ELパネルにおいて保護流体の
封入操作に用いられる注入用パイプの反復使用を
可能にし、かつ注入孔の封止部を伸縮自在に変位
させることにより保護流体の熱膨張時の体積増圧
力を吸収して封止部からの保護流体の漏洩を防止
することである。
C. Object of the Invention The object of the present invention is to provide an injection method used for sealing a protective fluid in a thin-film EL panel in which a thin-film EL element and its insulating protective fluid are housed in an envelope consisting of a translucent front substrate and a back plate. This makes it possible to use the pipe repeatedly, and by elastically displacing the sealing part of the injection hole, it absorbs the volume increase pressure caused by thermal expansion of the protective fluid and prevents leakage of the protective fluid from the sealing part. That's true.

ニ 発明の構成 本発明は、透光性前面基板と背面板とから成る
外囲器内に薄膜EL素子及び該薄膜EL素子に対す
る絶縁性保護流体を収納した薄膜ELパネルにお
いて、前記外囲器に設けられた前記保護流体の注
入孔に該注入孔よりも小径の孔を有するパツキン
材を同心配置して接着固定し前記保護流体の注入
後、前記パツキン材の孔を変形可能な薄板で封止
し、かつ前記薄板を凹部付キヤツプで被冠・封止
したことを特徴とする。
D. Structure of the Invention The present invention provides a thin-film EL panel in which a thin-film EL element and an insulating protective fluid for the thin-film EL element are housed in an envelope consisting of a translucent front substrate and a back plate. A packing material having a hole smaller in diameter than the injection hole is concentrically arranged and adhesively fixed to the provided injection hole for the protective fluid, and after the protective fluid is injected, the hole in the packing material is sealed with a deformable thin plate. and the thin plate is covered and sealed with a cap with a recess.

ホ 実施例 本発明に係る薄膜ELパネルの実施例をその保
護流体注入封止構造の製造工程順に従つて説明す
る。まず薄膜ELパネルの背面ガラス板10とし
て、第8図に示すように所定厚さのソーダガラス
板を加熱加圧成型し乃至はサンドエツチングによ
りEL素子構造部の収納部分が所定深さに凹陥成
形される。そして凹陥成形領域の隅部1個所には
流体注入用の注入孔13が形成される。
E. Examples Examples of the thin film EL panel according to the present invention will be described in accordance with the manufacturing process order of its protective fluid injection sealing structure. First, as the rear glass plate 10 of the thin-film EL panel, a soda glass plate of a predetermined thickness is heated and pressure molded as shown in FIG. be done. An injection hole 13 for fluid injection is formed at one corner of the concave molding area.

次に第9図に示すように注入孔13に孔を有す
るパツキン材19を同心配置して接着固定する
が、パツキン材19の孔径は注入孔13よりも小
径に成形される。又、パツキン材19として第1
0図に示すように注入孔13内周面を覆う形状に
成形してもよい。
Next, as shown in FIG. 9, a packing material 19 having a hole is arranged concentrically with the injection hole 13 and fixed by adhesive. The hole diameter of the packing material 19 is formed to be smaller than the injection hole 13. In addition, the first packing material 19 is
It may be formed into a shape that covers the inner circumferential surface of the injection hole 13 as shown in FIG.

そして第11図に示すようにパツキン材19の
孔に流体注入用の外部注入管20を挿入するが、
外部注入管20は注入孔13に接着固定されず、
流体注入が終了すれば、注入孔13から抜き取ら
れる。従つて外部注入管20の反復使用が可能と
なり、同時にパツキン材19により流体注入時、
及び外部注入管20抜き取り時の流体漏れが防止
される。
Then, as shown in FIG. 11, an external injection pipe 20 for fluid injection is inserted into the hole of the packing material 19.
The external injection pipe 20 is not adhesively fixed to the injection hole 13,
When the fluid injection is completed, the fluid is extracted from the injection hole 13. Therefore, the external injection pipe 20 can be used repeatedly, and at the same time, the packing material 19 prevents the injection of fluid.
Also, fluid leakage when the external injection pipe 20 is removed is prevented.

外部注入管20の挿入された背面ガラス板10
とガラス基板1により薄膜EL素子9を収納する
外囲器11を構成すれば、従来同様第12図a,
bに示すように外囲器11内に絶縁性保護流体1
2が注入される。即ち、まず外囲器11と流体収
納槽21を第12図aに示すように真空槽22内
に設置する。この時外囲器11の外部注入管20
の先端は流体収納槽21内の注入流体と離反して
いる。この状態で真空槽22内を減圧し、注入流
体及び薄膜EL素子9のガス出しを行なう。次に
真空保持のまま流体収納槽21を上昇させ、第1
2図bに示すように外部注入管20の先端を注入
流体内へ挿入させる。この後、真空槽22にN2
ガスを常圧まで導入し、これによつて外囲器11
内へ流体収納槽21内の注入流体が外部注入管2
0を介して注入される。
Rear glass plate 10 with external injection tube 20 inserted
If the envelope 11 for housing the thin film EL element 9 is configured by the glass substrate 1, then as in the conventional case, FIG. 12a,
As shown in b, an insulating protective fluid 1 is placed inside the envelope 11.
2 is injected. That is, first, the envelope 11 and the fluid storage tank 21 are placed in a vacuum tank 22 as shown in FIG. 12a. At this time, the external injection pipe 20 of the envelope 11
The tip is separated from the injection fluid in the fluid storage tank 21. In this state, the pressure inside the vacuum chamber 22 is reduced, and the injected fluid and the gas from the thin film EL element 9 are vented. Next, the fluid storage tank 21 is raised while maintaining the vacuum, and the first
The tip of the external injection tube 20 is inserted into the injection fluid as shown in Figure 2b. After this, N 2 is added to the vacuum chamber 22.
Gas is introduced to normal pressure, thereby causing the envelope 11 to
The injected fluid in the fluid storage tank 21 is transferred to the external injection pipe 2.
Injected via 0.

注入流体の上記注入操作が完了すると、外囲器
11から外囲注入管20を抜き取る。この時、パ
ツキン材19の封止後に外囲器11内に気体が残
らないよう外部注入管20の抜き取り後、流体補
充などを行い第13図に示すように流体表面がパ
ツキン材19の表面レベルより低下しないように
する。この工程はN2ガス雰囲気中で実施するこ
とが望ましい。
When the injection operation of the injection fluid is completed, the envelope injection tube 20 is removed from the envelope 11. At this time, after the external injection tube 20 is removed and fluid is replenished so that no gas remains in the envelope 11 after sealing the packing material 19, the fluid surface is level with the surface of the packing material 19 as shown in FIG. Avoid further decline. This step is preferably carried out in a N2 gas atmosphere.

そして第14図に示すようにパツキン材19の
孔を薄板23で封止して保護流体12を外囲器1
1内に密閉する。薄板23は保護流体12の膨
張・収縮に応じて変形できるように伸縮自在でな
ければならず、その形状は第15図a,bに示す
ようにゴム製の薄い平板のもの、第16図a,b
に示すように金属製平板にひだを設けたものなど
である。即ち薄板23は伸縮自在であるため流体
熱膨張時の流体封止部の損傷が防止され、同時に
流体漏洩も防止される。
Then, as shown in FIG.
Seal it inside 1. The thin plate 23 must be stretchable so that it can deform according to the expansion and contraction of the protective fluid 12, and its shape can be a thin flat plate made of rubber as shown in Figures 15a and 15b, or a thin flat plate made of rubber as shown in Figure 16a. ,b
As shown in the figure, it is a flat metal plate with pleats. That is, since the thin plate 23 is expandable and contractible, the fluid sealing portion is prevented from being damaged during thermal expansion of the fluid, and at the same time, fluid leakage is also prevented.

更に第17図に示すように凹部を有するキヤツ
プ24を注入孔13封止部の背面ガラス板10上
に接着剤を介して被冠し、注入流体に対する二重
封止構造を構成する。キヤツプ24は第18図に
示すように2段凹部を有し、第1封止面24aと
第2封止面24bが形成される。即ちキヤツプ2
4の被冠時、第1封止面24aは薄板23とパツ
キン材19を圧接して封止し、第2封止面24b
は背面ガラス板10に接着されて封止する。ここ
で第19図に示すように第1封止面24aに突起
24cを設ければ、薄板23の圧接がより強固に
なつて封止をより確実にする。又、背面ガラス板
10上からの第1封止面24aの高さを薄板23
とパツキン材19の厚さよりも小さくすることに
より薄板23の圧接を強くすることも可能であ
る。従つて第1封止面24aの上記高さ寸法を所
定範囲内に許容できる。そして第2封止面24b
の接着には光硬化性樹脂等が用いられる。
Furthermore, as shown in FIG. 17, a cap 24 having a concave portion is placed on the rear glass plate 10 of the sealing portion of the injection hole 13 via an adhesive to form a double sealing structure against the injection fluid. As shown in FIG. 18, the cap 24 has a two-stage recessed portion, and a first sealing surface 24a and a second sealing surface 24b are formed. That is, cap 2
4, the first sealing surface 24a presses and seals the thin plate 23 and the packing material 19, and the second sealing surface 24b
is adhered to the rear glass plate 10 for sealing. Here, if a protrusion 24c is provided on the first sealing surface 24a as shown in FIG. 19, the pressure contact between the thin plate 23 becomes stronger and the sealing becomes more reliable. Also, the height of the first sealing surface 24a from the top of the rear glass plate 10 is determined by the height of the thin plate 23.
It is also possible to strengthen the pressure contact of the thin plate 23 by making the thickness smaller than that of the packing material 19. Therefore, the height of the first sealing surface 24a can be allowed within a predetermined range. and second sealing surface 24b
A photocurable resin or the like is used for adhesion.

上記封入操作工程を経て薄膜ELパネルは作成
される。
A thin film EL panel is created through the above-mentioned encapsulation process.

尚、キヤツプ24は図示例のように2段凹部を
有するもののみならず、単純な皿状のものでよ
い。
Incidentally, the cap 24 is not limited to a cap having a two-stage recess as shown in the drawing, but may be a simple plate-shaped cap.

ヘ 発明の効果 本発明によれば、透光性前面基板と背面板とか
ら成る外囲器内に薄膜EL素子とその絶縁性保護
流体を収納した薄膜ELパネルにおいて流体封入
操作に用いられる流体注入用の注入管を1本で反
復使用できるようにしたから、製造工程の簡略化
が図れる。又、流体注入孔の封止に伸縮自在の薄
板を用い、かつ薄板に凹部付キヤツプを被冠して
封止したから、流体熱膨張時の注入孔封止部の損
傷が防止され、封止が確実となつてパネルの耐湿
性が向上する。更に注入孔に注入孔より小径の孔
を有するパツキン材を接着固定したから、流体注
入時及び注入管抜き取り時の流体漏れが防止さ
れ、しかもパツキン材の厚さにより薄板を被冠す
る凹部付キヤツプのキヤツプ高さの寸法公差を許
容するのに有利となる。
F. Effects of the Invention According to the present invention, fluid injection is used for fluid filling operation in a thin film EL panel in which a thin film EL element and its insulating protective fluid are housed in an envelope consisting of a translucent front substrate and a back plate. Since only one injection tube can be used repeatedly, the manufacturing process can be simplified. In addition, since a stretchable thin plate is used to seal the fluid injection hole, and the thin plate is covered with a cap with a recess for sealing, damage to the injection hole sealing part due to thermal expansion of the fluid is prevented, and the sealing This ensures that the moisture resistance of the panel improves. Furthermore, since a packing material having a hole with a smaller diameter than the injection hole is adhesively fixed to the injection hole, fluid leakage is prevented when fluid is injected or when the injection tube is removed.Moreover, the thickness of the packing material allows a cap with a concave portion to cover the thin plate. This is advantageous in allowing for dimensional tolerances in cap height.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は薄膜EL素子の概略側断面図、第2図
はその透明電極と背面電極の概略平面図、第3図
は従来の薄膜ELパネルの概略側断面図、第4図
はその流体注入操作工程における背面ガラス板の
側断面図、第5図a,bはその流体注入操作の説
明図、第6図a,b,cはその流体注入管の封止
操作の説明図、第7図はその封止部を凹部付キヤ
ツプで2重に封止した封止部の側断面図、第8図
は本発明に係る薄膜ELパネルに用いられる背面
ガラス板、第9図と第10図はその背面ガラス板
にパツキン材を接着固定した時の背面ガラス板の
部分側断面図、第11図はその背面ガラス板に外
部注入管を挿入した時の背面ガラス板の部分側断
面図、第12図a,bは本発明に係る薄膜ELパネ
ルの流体注入操作の説明図で、第13図はその注
入操作終了後の薄膜ELパネルの部分概略側断面
図、第14図は注入孔を薄板で封止した本発明に
係る薄膜ELパネルの部分概略側断面図、第15
図aはその薄板の一例の側面図で、第15図bは
その平面図、第16図aはその他の形状の薄板の
断面図で、第16図bはその平面図、第17図は
その薄板を凹部付キヤツプで2重に封止した本発
明に係る薄膜ELパネルの部分概略側断面図、第
18図はその凹部付キヤツプの一例の断面図、第
19図はその他の形状を有する凹部付キヤツプの
断面図である。 1……透光性前面基板、9……薄膜EL素子、
10……背面板、11……外囲器、12……絶縁
性保護流体、13……注入孔、19……パツキン
材、23……薄板、24……凹部付キヤツプ。
Figure 1 is a schematic side sectional view of a thin film EL element, Figure 2 is a schematic plan view of its transparent electrode and back electrode, Figure 3 is a schematic side sectional view of a conventional thin film EL panel, and Figure 4 is its fluid injection. A side sectional view of the rear glass plate during the operation process, FIGS. 5a and 5b are explanatory diagrams of the fluid injection operation, FIGS. 6a, b, and c are explanatory diagrams of the fluid injection tube sealing operation, and FIG. 7 8 is a side sectional view of the sealed portion double-sealed with a cap with a concave portion, FIG. 8 is a rear glass plate used in the thin film EL panel according to the present invention, and FIGS. 9 and 10 are Fig. 11 is a partial side sectional view of the back glass plate when the packing material is adhesively fixed to the back glass plate, and Fig. 11 is a partial side sectional view of the back glass plate when the external injection tube is inserted into the back glass plate. Figures a and b are explanatory diagrams of the fluid injection operation of the thin film EL panel according to the present invention, Figure 13 is a partial schematic side sectional view of the thin film EL panel after the injection operation is completed, and Figure 14 is an illustration of the injection hole with a thin plate. Partial schematic side sectional view of a sealed thin film EL panel according to the present invention, No. 15
Figure a is a side view of an example of the thin plate, Figure 15b is a plan view thereof, Figure 16a is a sectional view of a thin plate of other shapes, Figure 16b is a plan view thereof, and Figure 17 is its plan view. A partial schematic side cross-sectional view of a thin film EL panel according to the present invention in which a thin plate is double-sealed with a cap with a recess, FIG. 18 is a cross-sectional view of an example of the cap with a recess, and FIG. 19 is a recess having another shape. FIG. 3 is a sectional view of the attached cap. 1... Translucent front substrate, 9... Thin film EL element,
DESCRIPTION OF SYMBOLS 10... Rear plate, 11... Envelope, 12... Insulating protective fluid, 13... Injection hole, 19... Packing material, 23... Thin plate, 24... Cap with recess.

Claims (1)

【特許請求の範囲】[Claims] 1 透光性前面基板と背面板とから成る外囲器内
に薄膜EL素子及び該薄膜EL素子に対する絶縁性
保護流体を収納した薄膜ELパネルにおいて、前
記外囲器に設けられた前記保護流体の注入孔に該
注入孔よりも小径の孔を有するパツキン材を同心
配置して接着して、前記パツキン材の孔を変形可
能な薄板で封止し、かつ前記薄板を凹部付キヤツ
プで封止したことを特徴とする薄膜ELパネル。
1. In a thin film EL panel in which a thin film EL element and an insulating protective fluid for the thin film EL element are housed in an envelope consisting of a translucent front substrate and a back plate, the protective fluid provided in the envelope is A packing material having a hole smaller in diameter than the injection hole is concentrically arranged and adhered to the injection hole, the hole in the packing material is sealed with a deformable thin plate, and the thin plate is sealed with a cap with a recess. A thin film EL panel characterized by:
JP58222766A 1983-11-25 1983-11-25 Thin film el panel Granted JPS60115192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58222766A JPS60115192A (en) 1983-11-25 1983-11-25 Thin film el panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58222766A JPS60115192A (en) 1983-11-25 1983-11-25 Thin film el panel

Publications (2)

Publication Number Publication Date
JPS60115192A JPS60115192A (en) 1985-06-21
JPH0351080B2 true JPH0351080B2 (en) 1991-08-05

Family

ID=16787557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58222766A Granted JPS60115192A (en) 1983-11-25 1983-11-25 Thin film el panel

Country Status (1)

Country Link
JP (1) JPS60115192A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6352297U (en) * 1986-09-22 1988-04-08

Also Published As

Publication number Publication date
JPS60115192A (en) 1985-06-21

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