JPH0350975B2 - - Google Patents
Info
- Publication number
- JPH0350975B2 JPH0350975B2 JP2768484A JP2768484A JPH0350975B2 JP H0350975 B2 JPH0350975 B2 JP H0350975B2 JP 2768484 A JP2768484 A JP 2768484A JP 2768484 A JP2768484 A JP 2768484A JP H0350975 B2 JPH0350975 B2 JP H0350975B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- chip
- infrared rays
- paste
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000001066 destructive effect Effects 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000013007 heat curing Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 239000011888 foil Substances 0.000 abstract 3
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 230000035699 permeability Effects 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2768484A JPS60171441A (ja) | 1984-02-16 | 1984-02-16 | ダイボンド接着状態の検出方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2768484A JPS60171441A (ja) | 1984-02-16 | 1984-02-16 | ダイボンド接着状態の検出方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60171441A JPS60171441A (ja) | 1985-09-04 |
| JPH0350975B2 true JPH0350975B2 (enrdf_load_stackoverflow) | 1991-08-05 |
Family
ID=12227790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2768484A Granted JPS60171441A (ja) | 1984-02-16 | 1984-02-16 | ダイボンド接着状態の検出方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60171441A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0210256A (ja) * | 1988-06-29 | 1990-01-16 | Ishikawajima Kensa Keisoku Kk | セラミックス基板の探傷方法 |
| US5228776A (en) * | 1992-05-06 | 1993-07-20 | Therma-Wave, Inc. | Apparatus for evaluating thermal and electrical characteristics in a sample |
| DE102015122733A1 (de) * | 2015-12-23 | 2017-06-29 | Bundesdruckerei Gmbh | Inspektionsvorrichtung und Verfahren zum Verifizieren einer Klebstoffverbindung |
| JPWO2022264773A1 (enrdf_load_stackoverflow) * | 2021-06-16 | 2022-12-22 |
-
1984
- 1984-02-16 JP JP2768484A patent/JPS60171441A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60171441A (ja) | 1985-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |