JPH0350283A - Adhesive for copper foil - Google Patents
Adhesive for copper foilInfo
- Publication number
- JPH0350283A JPH0350283A JP18498589A JP18498589A JPH0350283A JP H0350283 A JPH0350283 A JP H0350283A JP 18498589 A JP18498589 A JP 18498589A JP 18498589 A JP18498589 A JP 18498589A JP H0350283 A JPH0350283 A JP H0350283A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- adhesive
- copper foil
- polyhydroxyether
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 239000011889 copper foil Substances 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 12
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical group C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000005011 phenolic resin Substances 0.000 claims description 7
- -1 amine imide Chemical class 0.000 claims description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 239000004640 Melamine resin Substances 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 abstract description 21
- 238000013329 compounding Methods 0.000 abstract 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical class [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は熱硬化性樹脂と反復単位としてビスフェノール
Ａ骨格およびビスフェノールＳ骨格をもつポリヒドロキ
シエーテル樹脂を含有する銅箔用接着剤に関し、加熱乾
燥によってＢステージ化し、さらに加熱加圧によってＣ
ステージ化することにより特に耐溶剤性と耐熱性に優れ
た銅箔用接着剤に係る。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an adhesive for copper foil containing a thermosetting resin and a polyhydroxyether resin having a bisphenol A skeleton and a bisphenol S skeleton as repeating units. B stage by heating and pressurizing to C stage.
The present invention relates to an adhesive for copper foil that has particularly excellent solvent resistance and heat resistance by being staged.
一般に、電気機器、電子機器、計算機器、通信機器等に
用いられるプリント配線板用銅張積層板の銅箔エツチン
グによる印刷配線板の製造工程は、孔の打ち抜き、非回
路部分のエツチング、溶剤処理を経て部品取り付けのた
めの半田付けされるものである。そのため、プリント配
線板用銅張積層板には１強い接着強度、耐クラツク性、
耐薬品性、耐溶剤性、耐熱性等種々の特性が要求される
。Generally, the manufacturing process of printed wiring boards by copper foil etching of copper-clad laminates for printed wiring boards used in electrical equipment, electronic equipment, computing equipment, communication equipment, etc. includes punching holes, etching non-circuit parts, and solvent treatment. After that, the parts are soldered to attach them. Therefore, copper-clad laminates for printed wiring boards have strong adhesive strength, crack resistance,
Various properties are required such as chemical resistance, solvent resistance, and heat resistance.
これら特性には、積層板基材と銅箔を張り合わせる接着
剤の性能が大きく関与している。These characteristics are largely influenced by the performance of the adhesive used to bond the laminate base material and the copper foil.
従来、上記の如き銅箔用接着剤として代表的にはポリビ
ニルブチラール樹脂とフェノール樹脂を主成分とするも
のが用いられてきた。また、部品取り付けを半田ではな
く、ペースト焼付で行う場合には、熱量が多く加わるた
め、熱放散性の良い金属をベースにした基板が用いられ
、特に耐熱性の高い接着剤が望まれる。Conventionally, as the above-mentioned copper foil adhesives, adhesives mainly containing polyvinyl butyral resin and phenol resin have been typically used. Furthermore, when parts are attached by baking paste instead of soldering, a large amount of heat is added, so a metal-based board with good heat dissipation properties is used, and an adhesive with particularly high heat resistance is desired.
しかしながら、従来の銅箔用接着剤の主原料として用い
られてきたポリビニルブチラール樹脂とフェノール樹脂
との組合せでは、耐溶剤性および耐熱性の向上には限界
があった。すなわち、銅張積層板の銅箔エツチングによ
る印刷配線板の製造には、エツチングレジストを剥離す
るために、塩化メチレン溶液や１，１．１−トリクロル
エチレン溶液などの有機溶剤で接着剤層がむき出しにな
った基材表面を機械的ブラッシングを併用し洗浄する工
程がある。その際、従来から銅箔用接着剤の主原料とし
て用いられてきたポリビニルブチラール樹脂とフェノー
ル樹脂との組合せでは、接着剤層が膨潤または溶解する
ため銅箔と基材との接着信頼性に欠ける問題があった。However, the combination of polyvinyl butyral resin and phenol resin, which has been used as the main raw material for conventional copper foil adhesives, has a limit in improving solvent resistance and heat resistance. That is, in the production of printed wiring boards by copper foil etching of copper-clad laminates, the adhesive layer is exposed using an organic solvent such as a methylene chloride solution or a 1,1,1-trichloroethylene solution in order to peel off the etching resist. There is a step of cleaning the surface of the base material that has become stained using mechanical brushing. In this case, the combination of polyvinyl butyral resin and phenol resin, which has traditionally been used as the main raw material for adhesives for copper foil, causes the adhesive layer to swell or dissolve, resulting in a lack of reliability in adhesion between the copper foil and the base material. There was a problem.
また、ペーストの焼付は工程など多量の熱が加わる分野
には熱放散性の良い金属ベースの基材が用いられている
が、従来用いられてきたポリビニルブチラール樹脂とフ
ェノール樹脂との組合せでは、熱が加わった際、接着剤
層からガスが発生し回路に膨れが出来る等、耐熱性に問
題があった。In addition, metal-based substrates with good heat dissipation properties are used for paste baking in fields where a large amount of heat is applied, such as in processes, but the combination of polyvinyl butyral resin and phenolic resin that has been used in the past There were problems with heat resistance, such as gas being generated from the adhesive layer and causing bulges in the circuit.
本発明は、上記の問題点に鑑み得られたもので、Ｃステ
ージ状態で接着剤層がハロゲン化溶剤に侵され易い欠点
およびＣステージ状態で接着剤層の耐熱温度が低い欠点
を解決するもので特に耐熱性と耐溶剤性に優れた銅箔用
接着剤を提供することを目的とするものである。The present invention has been achieved in view of the above-mentioned problems, and solves the drawbacks that the adhesive layer is easily attacked by halogenated solvents in the C-stage state and the drawback that the heat resistance temperature of the adhesive layer is low in the C-stage state. The object of the present invention is to provide an adhesive for copper foil that has particularly excellent heat resistance and solvent resistance.
本発明は熱硬化性樹脂と下記一般式で表わされる反復単
位をもつポリヒドロキシエーテル樹脂とを含有すること
を特徴とする銅箔用接着剤により前記課題を達成したも
のである。The present invention has achieved the above object by using an adhesive for copper foil, which is characterized by containing a thermosetting resin and a polyhydroxyether resin having a repeating unit represented by the following general formula.
本発明接着剤ではポリヒドロキシエーテル樹脂を用いて
いるため、このポリヒドロキシエーテル樹脂の優れた耐
溶剤性（特にハロゲン化有機溶剤）により、銅張積層板
の銅箔エツチングによる印刷配線板の製造における塩化
メチレン溶液やｔ、ｉ、ｉ−トリクロルエチレン溶液等
の有機溶剤による基板表面の洗浄工程で接着剤層が膨潤
したり溶解することを防止し、銅箔と基材との接着信頼
性を向上させる。Since the adhesive of the present invention uses polyhydroxyether resin, the excellent solvent resistance (especially halogenated organic solvents) of this polyhydroxyether resin makes it suitable for manufacturing printed wiring boards by copper foil etching of copper-clad laminates. Prevents the adhesive layer from swelling or dissolving during the cleaning process of the substrate surface with organic solvents such as methylene chloride solution and t,i,i-trichloroethylene solution, improving the reliability of adhesion between copper foil and base material. let
また５本発明接着剤ではポリヒドロキシエーテル樹脂と
熱硬化性樹脂とを組合せているため、特に耐熱性に優れ
、金属ベース基材等にペースト焼付は等多量の熱が加わ
る工程を通しても接着剤層から気泡が発生しにくく、回
路に膨れが発生することを防止し、銅箔と基材との接着
信頼性を向上させる。In addition, since the adhesive of the present invention combines polyhydroxyether resin and thermosetting resin, it has particularly excellent heat resistance, and the adhesive layer can be applied to metal base materials etc. even through processes where a large amount of heat is applied, such as paste baking. This makes it difficult for air bubbles to form, prevents bulges from forming in the circuit, and improves the adhesion reliability between the copper foil and the base material.
以下に本発明をより詳しく説明する。The present invention will be explained in more detail below.
本発明に用いるポリヒドロキシエーテル樹脂は、ビスフ
ェノール人骨格：ビスフェノールＳ骨格＝１：９〜８：
２であり且つ１重量平均分子量＝ ｔｏ、ｏｏｏ以上の
ものが好ましい。ビスフェノールＡ骨格とビスフェノー
ルＳ骨格の比率は、１：９〜２：８が好ましく、この比
率よりビスフェノールＡ骨格が多くなると耐溶剤性に悪
影響を与え、逆にビスフェノールＳ骨格が多くなると耐
水性に悪影響を与え且つ、樹脂を溶解するのに用いる有
機溶剤の使用量が増すためコスト高となり好ましくない
。また重量平均分子量が１０，０００以下の場合は、銅
箔と基材の接着性が低下するため好ましくない。The polyhydroxyether resin used in the present invention has a bisphenol human skeleton:bisphenol S skeleton=1:9 to 8:
2 and 1 weight average molecular weight = to, ooo or more is preferable. The ratio of bisphenol A skeleton to bisphenol S skeleton is preferably 1:9 to 2:8. If the bisphenol A skeleton exceeds this ratio, solvent resistance will be adversely affected, and conversely, if the bisphenol S skeleton increases, water resistance will be adversely affected. In addition, the amount of organic solvent used to dissolve the resin increases, resulting in high costs, which is not preferable. Moreover, when the weight average molecular weight is 10,000 or less, the adhesion between the copper foil and the base material decreases, which is not preferable.
本発明に用いる熱硬化性樹脂としては、エポキシ樹脂、
フェノール樹脂、メラミン樹脂、キシレン樹脂、ポリエ
ステル樹脂、イミド樹脂、アミンイミド樹脂等が挙げら
れる。この中でも特にエポキシ樹脂が好ましく用いられ
、エポキシ樹脂の硬化剤として一般に知られているもの
と併せて使用することが出来る。エポキシ樹脂の硬化剤
として一般に知られているものとして、アミン塩、イミ
ダゾール、塩基性活性水素化合物、ルイス酸、ブレンス
テッド酸などがあり、これらは、単独または二種以上混
合して用いることが出来る。これらの熱硬化性樹脂は、
本発明の耐熱性、耐溶剤性を損なわないように市販品を
適時選択して単独もしくは二種以上混合して配合する。The thermosetting resin used in the present invention includes epoxy resin,
Examples include phenol resin, melamine resin, xylene resin, polyester resin, imide resin, amine imide resin, and the like. Among these, epoxy resins are particularly preferably used, and can be used in combination with those generally known as curing agents for epoxy resins. Commonly known curing agents for epoxy resins include amine salts, imidazole, basic active hydrogen compounds, Lewis acids, Brønsted acids, etc. These can be used alone or in combination of two or more. . These thermosetting resins are
Commercially available products are appropriately selected and blended singly or in combination of two or more so as not to impair the heat resistance and solvent resistance of the present invention.
上記ポリヒドロキシエーテル樹脂と熱硬化性樹脂を２：
８〜８：２（重量比）配合し、メチルエチルケトン溶媒
及びシクロヘキサノン溶媒に固形分２０〜５０％になる
ように溶解し接着剤とする。その後、銅箔に塗布を行い
加熱乾燥によってＢステージ化し、さらに基材と張り合
わせ加熱加圧によってＣステージ化させる。The above polyhydroxyether resin and thermosetting resin are 2:
8 to 8:2 (weight ratio) and dissolved in a methyl ethyl ketone solvent and a cyclohexanone solvent to a solid content of 20 to 50% to obtain an adhesive. Thereafter, it is coated on copper foil and heated and dried to form a B stage, and then laminated to a base material and heated and pressurized to form a C stage.
なお１本発明の硬化に悪影響を及ぼさない限り必要に応
じ、水酸化マグネシウム、炭酸カルシウム、シリカ、酸
化チタンなどの充填剤を添加配合することが出来る。こ
れらの充填剤は、添加することによって接着剤のチクソ
性を改善するものである。Note that fillers such as magnesium hydroxide, calcium carbonate, silica, and titanium oxide may be added and blended as necessary as long as they do not adversely affect the curing of the present invention. When added, these fillers improve the thixotropic properties of the adhesive.
以下に示す実施例および比較例において、１部」とは「
重量部」を意味する。In the Examples and Comparative Examples shown below, "1 part" means "
Parts by weight.
実施例１
ポリヒドロキシエーテル樹脂フェノトートＹＰＳ−００
７（東部化成社製、商品名）５０部、エポキシ樹脂エポ
トートＶＤ−１２８（東部化成社製、商品名）５０部、
エポキシ樹脂の硬化剤として第３アミン塩アミキュアー
ＰＮ−２３（味の素社製、商品名）５部をメチルエチル
ケトン溶剤および、シクロヘキサノン溶剤に溶解し濃度
３５％樹脂溶液を調製し接着剤とした。この接着剤を厚
さ３０〜４０μｍの電解処理銅箔の処理面に塗布して、
風乾後、１２０℃で１５分間加熱乾燥し、接着剤付き銅
箔を得た。この銅箔と、表面をクロメート処理した厚さ
ｌｌ１１１Ｉのアルミニウム金属基板とを重畳して、１
７０℃、１００ｋｇ／口、１時間の条件で加熱加圧成形
して銅張積層板を製造した。Example 1 Polyhydroxyether resin Phenotote YPS-00
7 (manufactured by Tobu Kasei Co., Ltd., trade name) 50 parts, epoxy resin Epotote VD-128 (manufactured by Tobu Kasei Co., Ltd., trade name) 50 parts,
As a curing agent for epoxy resin, 5 parts of tertiary amine salt Amicure PN-23 (manufactured by Ajinomoto Co., Ltd., trade name) was dissolved in a methyl ethyl ketone solvent and a cyclohexanone solvent to prepare a 35% resin solution and used as an adhesive. Apply this adhesive to the treated surface of electrolytically treated copper foil with a thickness of 30 to 40 μm,
After air drying, it was heated and dried at 120° C. for 15 minutes to obtain an adhesive-coated copper foil. This copper foil and an aluminum metal substrate with a thickness of 111I and whose surface has been chromate-treated are overlapped to form a 1
A copper-clad laminate was produced by heating and press forming at 70° C., 100 kg/mouth, and 1 hour.
実施例２
実施例１においてエポキシ樹脂エポトートＶＤ−１２８
の代わりにエポキシ樹脂エピコート１００１（油化シェ
ル社製、商品名）を同、量の５０部用いた以外はすべて
実施例１と同一にして接着剤を調製して銅箔に塗布し１
次いで銅張積層板を製造した。Example 2 In Example 1, epoxy resin Epotote VD-128
An adhesive was prepared in the same manner as in Example 1 except that 50 parts of the epoxy resin Epicoat 1001 (manufactured by Yuka Shell Co., Ltd., trade name) was used in place of the adhesive, and applied to the copper foil.
Next, a copper-clad laminate was manufactured.
実施例３
ポリヒドロキシエーテル樹脂フェノトートＹＰＳ−００
７５０部、エポキシ樹脂エポトートＶＤ−１２８７０部
、エポキシ樹脂の硬化剤としてイミダゾール類であるキ
ュアゾール２Ｅ４ＭＺ（四国化成社製、商品名）５部を
メチルエチルケトン溶剤および、シクロヘキサノン溶剤
に溶解し濃度３５％樹脂溶液を調製し接着剤とした。Example 3 Polyhydroxyether resin Phenotote YPS-00
750 parts of epoxy resin Epotote VD-12870 parts, and 5 parts of Curazole 2E4MZ (manufactured by Shikoku Kasei Co., Ltd., trade name), which is an imidazole as a curing agent for epoxy resin, were dissolved in methyl ethyl ketone solvent and cyclohexanone solvent to form a 35% resin solution. It was prepared and used as an adhesive.
この接着剤を厚さ３０〜４０μ−の電解処理銅箔の処理
面に塗布して、風乾後、１２０℃で１５分間加熱乾燥し
、接着剤付き銅箔を得た。この銅箔と、表面をクロメー
ト処理した厚さＩＩのアルミニウム金属基板とを重畳し
て、１７０℃、１００ｋｇ／＞、１時間の条件で加熱加
圧成形して銅張積層板を製造した。This adhesive was applied to the treated surface of an electrolytically treated copper foil having a thickness of 30 to 40 μm, air-dried, and then heated and dried at 120° C. for 15 minutes to obtain an adhesive-coated copper foil. This copper foil was superimposed on an aluminum metal substrate having a thickness of II and whose surface had been chromate-treated, and was heated and pressed under conditions of 170° C., 100 kg/>, and 1 hour to produce a copper-clad laminate.
実施例４
実施例３においてエポキシ樹脂エボトートＹＤ−１２８
の代わりにエポキシ樹脂エピコート１００１（油化シェ
ル社製、商品名）を同量の７０部用いた以外はすべて実
施例３と同一にして接着剤を調製して銅箔に塗布し、次
いで銅張積層板を製造した。Example 4 In Example 3, epoxy resin Evototo YD-128
An adhesive was prepared in the same manner as in Example 3, except that the same amount of 70 parts of epoxy resin Epikote 1001 (manufactured by Yuka Shell Co., Ltd., trade name) was used instead of epoxy resin. A laminate was manufactured.
比較例１
ポリビニルブチラール樹脂デンカブチラール４０００−
２ （電気化学社製、商品名）６０部、フエノール樹脂
プライオーヘン５０１０（大日本インキ社製、商品名）
４０部をメチルエチルケトン溶剤および、キシレン溶剤
に溶解し濃度２０％樹脂溶液を調製し接着剤とした。こ
の接着剤を厚さ３０〜４０μｍの電解処理＠箔の処理面
に塗布して、風乾後、 １２０℃で１０分間加熱乾燥し
、接着剤付き銅箔を得た。この銅箔と。Comparative Example 1 Polyvinyl butyral resin Denka Butyral 4000-
2 (manufactured by Denki Kagaku Co., Ltd., trade name) 60 parts, phenolic resin Plyohene 5010 (manufactured by Dainippon Ink Co., Ltd., trade name)
40 parts were dissolved in a methyl ethyl ketone solvent and a xylene solvent to prepare a 20% resin solution, which was used as an adhesive. This adhesive was applied to the treated surface of an electrolytically treated foil having a thickness of 30 to 40 μm, air-dried, and then heated and dried at 120° C. for 10 minutes to obtain an adhesive-coated copper foil. With this copper foil.
表面をクロメート処理した厚さ１ｍｉのアルミニウム金
属基板とを重畳して、１７０℃、１００ｋｇ／Ｃ！１，
１時間の条件で加熱加圧成形して網張積層板を製造した
。A 1mm thick aluminum metal substrate with a chromate-treated surface is superimposed and heated at 170℃ and 100kg/C! 1,
A mesh laminate was produced by heat-pressing molding for 1 hour.
実施例１〜４及び比較例１で製造された銅張積層板につ
いて引き剥し強度、半田耐熱性をＪＩＳ−（１ニー６４
８１に従い、また、耐溶剤性は有機溶剤中に浸した後目
視によって評価を行った。それらの結果を第１表に示す
。The peel strength and soldering heat resistance of the copper-clad laminates manufactured in Examples 1 to 4 and Comparative Example 1 were determined according to JIS-(1 knee 64
81, the solvent resistance was evaluated by visual observation after immersion in an organic solvent. The results are shown in Table 1.
（以下余白） 第１表 第１表から明らかなように本発明の接着剤は。(Margin below) Table 1 As is clear from Table 1, the adhesive of the present invention.
特に耐熱性と耐溶剤性に優れており本発明の効果が確認
された。In particular, the heat resistance and solvent resistance were excellent, and the effects of the present invention were confirmed.
以上説明したように本発明の銅箔用接着剤は。 As explained above, the copper foil adhesive of the present invention.
ビスフェノールＡ骨格とビスフェノールＳ骨格を有する
ポリヒドロキシエーテル樹脂を熱硬化性樹脂と組合せて
用いることにより、特に耐熱性と耐溶剤性に優れたもの
である。By using a polyhydroxyether resin having a bisphenol A skeleton and a bisphenol S skeleton in combination with a thermosetting resin, it has particularly excellent heat resistance and solvent resistance.
Claims (1)
もつポリヒドロキシエーテル樹脂とを含有することを特
徴とする銅箔用接着剤。 ▲数式、化学式、表等があります▼ ２、ポリヒドロキシエーテル樹脂は、ビスフェノールＡ
骨格：ビスフェノールＳ骨格＝１：９〜８：２であり、
かつ重量平均分子量＝１００００以上である請求項１記
載の銅箔用接着剤。 ３、ポリヒドロキシエーテル樹脂と熱硬化性樹脂の配合
割合が重量比で２：８〜８：２である請求項１記載の銅
箔用接着剤。 ４、熱硬化性樹脂として、エポキシ樹脂、フェノール樹
脂、メラミン樹脂、キシレン樹脂、ポリエステル樹脂、
イミド樹脂、アミンイミド樹脂を単独または２種以上混
合したものである請求項１記載の銅箔用接着剤。[Scope of Claims] 1. An adhesive for copper foil comprising a thermosetting resin and a polyhydroxyether resin having a repeating unit represented by the following general formula. ▲There are mathematical formulas, chemical formulas, tables, etc.▼ 2. Polyhydroxyether resin is bisphenol A
Skeleton: bisphenol S skeleton = 1:9 to 8:2,
The adhesive for copper foil according to claim 1, which has a weight average molecular weight of 10,000 or more. 3. The adhesive for copper foil according to claim 1, wherein the blending ratio of the polyhydroxyether resin and the thermosetting resin is 2:8 to 8:2 by weight. 4. Thermosetting resins include epoxy resin, phenol resin, melamine resin, xylene resin, polyester resin,
The adhesive for copper foil according to claim 1, which is an imide resin or an amine imide resin alone or in a mixture of two or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18498589A JPH0350283A (en) | 1989-07-18 | 1989-07-18 | Adhesive for copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18498589A JPH0350283A (en) | 1989-07-18 | 1989-07-18 | Adhesive for copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350283A true JPH0350283A (en) | 1991-03-04 |
Family
ID=16162780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18498589A Pending JPH0350283A (en) | 1989-07-18 | 1989-07-18 | Adhesive for copper foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350283A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006322006A (en) * | 2006-06-12 | 2006-11-30 | Sumitomo Bakelite Co Ltd | Interlayer insulation adhesive for multilayer printed wiring board, and copper foil |
| US20130230809A1 (en) * | 2010-11-17 | 2013-09-05 | Nissan Chemical Industries, Ltd. | Resist underlayer film forming composition, and method for forming resist pattern using the same |
-
1989
- 1989-07-18 JP JP18498589A patent/JPH0350283A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006322006A (en) * | 2006-06-12 | 2006-11-30 | Sumitomo Bakelite Co Ltd | Interlayer insulation adhesive for multilayer printed wiring board, and copper foil |
| US20130230809A1 (en) * | 2010-11-17 | 2013-09-05 | Nissan Chemical Industries, Ltd. | Resist underlayer film forming composition, and method for forming resist pattern using the same |
| US8722840B2 (en) * | 2010-11-17 | 2014-05-13 | Nissan Chemical Industries, Ltd. | Resist underlayer film forming composition, and method for forming resist pattern using the same |
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