JPS62132987A - Adhesive for metal-clad laminated sheet - Google Patents

Abstract

PURPOSE:To obtain the titled composition resistant to the lowering of soldering heat-resistance and the delay of gel time and suitable for electrical appliance, electronic device, etc., by adding a melamine resin, polyvinyl butyral, an isocyanate and an organic acid to an epoxy resin and dissolving the mixture in an organic solvent. CONSTITUTION:The objective adhesive can be produced by mixing (A) an epoxy resin (preferably phenolic epoxy resin) with (B) a melamine resin, (C) polyvinyl butyral, (D) an isocyanate and (E) an organic acid (preferably adipic acid) and dissolving the mixture in an organic solvent. The amounts of the components A, B, C and D are preferably 1-5(wt)%, 2-15%, 5-20% and 0.5-5%, respectively. EFFECT:There is no lowering of applicability with time. USE:Suitable for computer, communication instrument, etc.

Description

[Detailed Description of the Invention] I [Technical Field] 1 The present invention relates to an adhesive for metal-clad laminates used in electrical equipment, electronic equipment, computing equipment, communication equipment, etc.

[Background technology]

Tracking resistance, heat resistance, and circuit adhesion have been strongly required for metal-clad laminates used in electrical equipment, electronic equipment, computing equipment, communication equipment, etc. Although those based on silica are widely used, they have problems such as large changes in the soldering temperature at a later date, a decrease in solder heat resistance due to changes in the shed, a delay in gel time, and a decrease in applicability.

[Object of the Invention] An object of the present invention is to provide an adhesive for metal-clad laminates that does not deteriorate solder heat resistance, delay gel time, or reduce applicability due to changes occurring over time.

Disclosure of the Invention The present invention is an adhesive for metal-clad laminates, which is characterized by adding melamine resin, polypinylbutyral, isocyanate, and an organic acid to an epoxy resin and dissolving it in an organic solvent. The present invention will be described in detail below.

The epoxy resins used in the present invention include phenol type epoxy resins such as novolac type epoxy resins, resol type epoxy resins, and cresol type epoxy resins, glycidyl ester type epoxy resins, polymer type epoxy resins, halogenated epoxy resins, flexible, epoxy resins, etc. Although all epoxy resins such as resins and polyfunctional epoxy resins can be used, it is preferable to use a phenol type epoxy resin or a mixture of a phenol type epoxy resin and a polyfunctional epoxy resin to further improve heat resistance and adhesive strength. Therefore, this is desirable. Regarding melamine resin, polypynylbutyral, and isocyanate, their derivatives, modified products, etc. can be used and are not particularly limited, and there is no particular limitation on the use of these materials, but it is preferable to use them. Based on the total amount, 1 to 5% by weight of epoxy resin (hereinafter referred to as 1c%), 2 to 15% of melamine resin, 5 to 20% of polyvinyl vinyl,
It is desirable that the amount of inV anate be 0.5 to 5. Organic acids include adipic acid, salicylic acid, acetic acid, and benzoic acid. Butyric acid, oxalic acid, etc. can be used,
(It is not limited to j, but it is preferable to use adipic acid because it can better prevent aging.) The fine solvent may be one that dissolves the above-mentioned materials. It is not particularly limited.

The present invention will be explained below based on examples.

Example Phenol type epoxy resin (manufactured by Shell Chemical Co., Ltd., trade name Epicote 153) Melamine resin 6 for part a
parts, 9 parts of polypynyl petyral, 1 part of incyanate,
0.02 parts of adipic acid, 40 parts of methyl ethyl ketone, and 39.98 parts of methanol were added and uniformly dissolved to obtain an adhesive for metal-clad laminates. After measuring the gel time of this adhesive,
After measuring the applicability when applied to a copper foil with a thickness of 35 mils, it was dried to obtain an adhesive-coated copper foil. Eight sheets of the phenol resin-impregnated base material were stacked on top of the adhesive-coated copper foil. A copper-clad laminate is produced by stacking the laminate with the adhesive side of the foil facing the base material side, sandwiching it between metal plates, and heating and press-forming it at 160 C, too KrJd for 60 minutes to produce a copper-clad laminate. The soldering heat resistance was measured.

Furthermore, after holding the above adhesive at 40°C for 30 days and measuring the gel time in the same manner as above, it was applied to copper foil to check the applicability.
lj was determined, and the solder heat resistance of a copper-clad M-layer board obtained by m-coating this adhesive-coated copper foil was measured.

Comparative Example 2 parts of adipine MO, 0 of Example was mixed with BFs heptanoethylamine complex compound (manufactured by Hashimoto Kasei Kogyo Co., Ltd., trade name: BFs).
400) Except that 0.02 part was substituted, the adhesive for metal-clad laminates was obtained by processing in the same manner as in the example, and the gel time, applicability, The solder heat resistance of copper-clad laminates was measured.

〔Effect of the invention〕

As is clear from Table 1, the gel time % coating properties of the adhesives of the Examples and Comparative Examples and the soldering heat resistance of the copper-clad laminates show that the adhesives of the present invention show little change over time, resulting in a delay in gel time, a decrease in coating properties, and There was no decrease in solder heat resistance, confirming the superiority of the present invention.

Table 1

Claims (2)

[Claims] (1) An adhesive for metal-clad laminates comprising an epoxy resin in which a melamine resin, polypinylbutyral, isocyanate, and an organic acid are dissolved in an organic solvent. (2) The adhesive for metal-clad laminates according to claim 1, wherein the organic acid is adipic acid.