JPH0349U - - Google Patents

Info

Publication number
JPH0349U
JPH0349U JP1989058262U JP5826289U JPH0349U JP H0349 U JPH0349 U JP H0349U JP 1989058262 U JP1989058262 U JP 1989058262U JP 5826289 U JP5826289 U JP 5826289U JP H0349 U JPH0349 U JP H0349U
Authority
JP
Japan
Prior art keywords
horizontal
semiconductor chip
lead body
surface mount
mount component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989058262U
Other languages
English (en)
Japanese (ja)
Other versions
JPH085562Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989058262U priority Critical patent/JPH085562Y2/ja
Publication of JPH0349U publication Critical patent/JPH0349U/ja
Application granted granted Critical
Publication of JPH085562Y2 publication Critical patent/JPH085562Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W90/756—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1989058262U 1989-05-19 1989-05-19 表面実装部品 Expired - Fee Related JPH085562Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989058262U JPH085562Y2 (ja) 1989-05-19 1989-05-19 表面実装部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989058262U JPH085562Y2 (ja) 1989-05-19 1989-05-19 表面実装部品

Publications (2)

Publication Number Publication Date
JPH0349U true JPH0349U (enExample) 1991-01-07
JPH085562Y2 JPH085562Y2 (ja) 1996-02-14

Family

ID=31583712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989058262U Expired - Fee Related JPH085562Y2 (ja) 1989-05-19 1989-05-19 表面実装部品

Country Status (1)

Country Link
JP (1) JPH085562Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145825U (ja) * 1984-03-06 1985-09-27 株式会社　六▲よう▼社 袋吊り下げ具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device
JPS59145554A (ja) * 1984-02-03 1984-08-21 Hitachi Ltd 複数個の端子を有する電子部品
JPS6371551U (enExample) * 1986-10-29 1988-05-13
JPS63151058A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 樹脂封止型半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device
JPS59145554A (ja) * 1984-02-03 1984-08-21 Hitachi Ltd 複数個の端子を有する電子部品
JPS6371551U (enExample) * 1986-10-29 1988-05-13
JPS63151058A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 樹脂封止型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145825U (ja) * 1984-03-06 1985-09-27 株式会社　六▲よう▼社 袋吊り下げ具

Also Published As

Publication number Publication date
JPH085562Y2 (ja) 1996-02-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees