JPH0348469A - Formation of terminal of electronic parts - Google Patents

Abstract

PURPOSE:To obtain a freedom degree of height at the time of mounting electric parts to a circuit board or the like by providing a first process of arranging a flat terminal of electronic parts and a second process of removing by cutting- off both sides of a terminal in a position of the prescribed height. CONSTITUTION:Lead wire parts Ro1 are formed long while supposing the state of being mounted on a circuit board Pc in various heights. In order to mount at a desired height, a Cu part (a part of the side of a wide part formed in the middle part of the lead wires) while cutting off P1 and P2. After such a process, the projected parts Ro1-1, Ro1-2 from the circuit board Pc are bent in the prescribed direction for performing soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to electronic components such as LEDs, photodiodes/transistors, etc., and the height position thereof when fixed to a circuit board etc. This paper concerns a method for shaping the terminals of electronic components that provides a degree of freedom in terms of texture. [Prior Art] Conventionally, when a PCB mounting part such as an LED is fixed to a circuit board by soldering, a high degree of mounting accuracy is required in terms of height from the circuit board and displacement in the orthogonal direction. This is said to be done to ensure good insertion alignment and fixing position when inserted into a through hole at a predetermined position in a case or the like for visual confirmation of light emission. In particular, when a plurality of LEDs, etc. are fixed, a high degree of mounting accuracy is required regarding their mutual heights.

An example of a conventional example of such attachment is shown in FIG.

In this example, convex portions (tie bar cut portions) 4a and 4b are formed in advance on the lead wires 3a and 3b of the LED 2, and soldering is performed by bringing the convex portions 4a and 4b into contact with the circuit board FiPC. be exposed. In the method of fitting the terminals of such electronic components, the error in the mounting height is, for example, ±0.3
That's about it.

Incidentally, the lead wires 3a and 3b are flat plate members so that the convex portions 4a and 4b can be formed integrally and easily by punching. [Problem to be Solved by the Invention] However, in the above-described method for forming a terminal of an electronic component, the convex portions 4a and 4b formed on the lead wires 3a and 3b
must be shaped according to the height from the circuit board Pc. Therefore, it is necessary to prepare in advance a large number of LEDs 2 with different heights H, or to make them at different heights H each time. I don't get it. In addition, a convex portion (tie bar cut portion) 4 is provided on the lead wires 3a and 3b.
A and 4b are flat plate members, and therefore, the cut surfaces of the lead wires 3a and 3b perpendicular to the longitudinal direction are square. For this reason, the circuit board l,Fj P c
After inserting the terminal into the through hole of the circuit board, the terminal protruding from the circuit board Pc is bent to be temporarily fixed for soldering, which is a post-processing process, but the bending is relatively difficult. The present invention has been made in view of the above points, and an object of the present invention is to provide a method for forming a terminal of an electronic component that allows flexibility in height when the electronic component is fixed to a circuit board or the like. ．． [Means for Solving the Problems] In order to solve the above object, the method for determining the shape of a terminal for an electronic component according to the present invention includes a first step in which a flat terminal is arranged on an electronic component; The terminal is characterized by comprising a second step of removing and separating the protruding portion of the terminal at a predetermined height position. [Function] In the method for shaping a terminal of an electronic component according to the present invention configured as described above, a terminal that has been shaped wide and long in advance is cut to a desired length.

This provides flexibility in positioning the height of the applied electronic component when it is fixed to a circuit board or the like. [Example] Hereinafter, an example of the method for forming a terminal of an electronic component according to the present invention will be described in detail with reference to the accompanying drawings. Figure 1(a)
(b) (c) shows an example, (d) shows another example, FIGS. 2 and 3 are used to explain the example shown in FIG. 1, and FIG. The apparatus for manufacturing the example is schematically shown. This example is a method for forming a terminal of an electronic component related to a rectangular LED shown in FIG. 1(a). First, the LE
DIO has a light emitting section 1l and lead wires 12a and 12b. The C portions of the lead wires 12a and 12b shown in the figure are inserted into through holes of a circuit board, etc., and soldered after cutting, bending, and other processing. The 390 part has been processed to have a rectangular shape as shown in FIG. 39B, or to have a C-face or R-face as shown in FIGS. Such C-side or R-side punching processing allows the wiring pattern formed on the circuit board to be bent relatively freely in the arrangement direction after being inserted into the through hole of the circuit board using an automatic mounting device. Here, the method for forming terminals of electronic components will be explained in detail. Figure 2 shows the state before processing, and L + L!・
...The LEDs of L7 are arranged at equal intervals on the tape Tp to form a taping product for automatic insertion machines. Furthermore, T. ,
T, . . . T8 is a light emitting part, and each LED lead wire part Rol Ro! ,...The middle part of Ro,l has a wide shape as shown in the figure. After being shaped in this way, processing is performed as shown in Figure 3. Here, only the LED L1 will be explained. The same goes for the others. Lead wire part Ro. is the circuit board Pc
The Cu part shown in the figure (lead wire Ro
+ lateral part of the wide part formed in the middle part of P1 and P! is separated. Next, C-face or R-face processing is performed as necessary. After such processing, the portion R O + protruding from the circuit board PC
-+ R O +-t is bent and soldered in a predetermined direction, here along a wiring pattern (not shown) formed on the circuit board Pc. Next, as a processing device suitable for such processing, a press device using a fully closed NCilm shown in FIG. 4 is suitable. In the figure, reference numeral 30 denotes a delivery section on which a reel 30a wound with the insertion taping product is attached. Furthermore, it has a winding part 32 in which the fed-out taping part Tom is wound up. Note that the reference numeral 32a is a take-up reel. Furthermore, while supporting the taping part ROM, a predetermined portion, the Cu portion shown in FIG. 3, is removed, and P1 and Pt are separated. Subsequently, it has a press section 32 in which a continuous mold or the like is installed in order to perform C-face or R-face punching as needed.

Here, each sending section 30, winding section 32, press section 34, etc. are sequentially controlled by an NC control section 36, so that
The Cu portion is removed and P1 and P2 are cut. Furthermore, the C-face or R-face punching described above is not necessarily required.

In this manner, with a relatively simple device, it becomes possible to remove and separate the required portions, and processing is performed to attach the circuit board to various desired heights h from the circuit board Pc. In this case, it will be possible to meet the recent demand for small-lot, wide-variety production.
Furthermore, by applying C-face and/or R-face punching to the terminal, the degree of freedom in the bending direction is improved. [Effects of the Invention] As described above, according to the method for forming a terminal for an electronic component of the present invention, a flat terminal is arranged on an electronic component. A second step of removing and separating the applied electronic component at the position shown in FIG. If C-face or R-face punching is performed on the material, it is possible to obtain flexibility in the bending direction after installation.

[Brief explanation of drawings]

FIGS. 1(a), (b), and (c) are a side view and a partial cross section of an electronic component according to an embodiment of the method for forming a terminal of an electronic component according to the present invention, and FIGS. 2 and 3 are shown in FIG. 1. FIG.
FIG. 5 is a schematic diagram of the manufacturing equipment used in the production of the diagram, and is a diagram used to explain a conventional method for forming terminals of electronic components. l 0... L ED, 1 l light emitting section, l 2 ■ 2 b... lead wire, P... circuit board. Figure l Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] A first step in which a flat terminal is disposed on an electronic component, and a second step in which a side portion of the surface of the terminal is removed and separated at a predetermined height position.
A method for forming a terminal for an electronic component, comprising the steps of: