CN116614941A - Circuit board assembling system and method - Google Patents

Abstract

The application relates to a circuit board assembly system and a method. The apparatus includes a circuit board and a plurality of bus bars secured to the circuit board. The plurality of bus bars may include a first bus bar and a second bus bar formed from adjacent portions of bus bar wires. The first bus bar may include a first non-plated portion of the first bus bar, and the second bus bar may include a first non-plated portion of the second bus bar. The first non-plated portion of the first bus bar and the first non-plated portion of the second bus bar may be formed during formation of the first bus bar.

Description

Circuit board assembling system and method

Cross Reference to Related Applications

The present application claims the benefit and priority of U.S. provisional patent application serial No. 63/310,407 filed on month 15 of 2022, the disclosure of which is hereby incorporated by reference in its entirety as if fully set forth herein.

Technical Field

The present disclosure relates generally to circuit board assembly systems and methods, including circuit board assembly systems and methods that may involve assembly lines.

Brief Description of Drawings

While the claims are not limited to the particular illustrations, an appreciation of various aspects can be gained through a discussion of various examples. The figures are not necessarily to scale and certain features may be exaggerated or hidden to better illustrate and explain an innovative aspect of an example. Furthermore, the exemplary illustrations described herein are not intended to be exhaustive or otherwise limiting, and the embodiments are not limited to the precise forms and configurations shown in the drawings or disclosed in the following detailed description. The exemplary illustrations are described in detail below by referring to the drawings:

fig. 1 is a schematic diagram generally illustrating an embodiment of a circuit board assembly system according to the teachings of the present disclosure.

Fig. 2 is a top view generally illustrating an embodiment of a circuit board with solder paste according to the teachings of the present disclosure.

Fig. 3 is a perspective view generally illustrating an embodiment of a second machine of a circuit board assembly system according to the teachings of the present disclosure.

Fig. 4 is a side view generally illustrating an embodiment of a bus bar wire (bus bar) of a circuit board assembly system according to the teachings of the present disclosure.

Fig. 5 is a top view generally illustrating an embodiment of a circuit board with solder paste and bus bars according to the teachings of the present disclosure.

Fig. 6 is a partial side view generally illustrating an embodiment of a circuit board with solder paste and bus bars according to the teachings of the present disclosure.

Fig. 7 is a top view generally illustrating an embodiment of a circuit board with solder paste, bus bars, and electrical components according to the teachings of the present disclosure.

Fig. 8 is a partial side view generally illustrating an embodiment of a circuit board with solder paste and electrical components according to the teachings of the present disclosure.

Fig. 9 is a schematic diagram generally illustrating an embodiment of a circuit board assembly system according to the teachings of the present disclosure.

Fig. 10 is a flowchart view generally illustrating an embodiment of a circuit board assembly method according to the teachings of the present disclosure.

Detailed Description

Reference will now be made in detail to the embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the various embodiments described. It will be apparent, however, to one of ordinary skill in the art that the various embodiments described may be practiced without these specific details. In other instances, well-known methods, procedures, components, circuits, and networks have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

Some designs utilize preformed bus bars, which may not allow for adequate design and/or manufacturing flexibility, and/or may involve significant packaging costs. For example, the preformed bus bars may be housed in a tape reel (tape reel) having a mounting substrate (e.g., from which the bus bars are removed) and/or a space between each bus bar. Such a configuration may result in waste (e.g., mounting the substrate) and/or may involve the use of additional reels (when fewer bus bars may be provided from each reel). Furthermore, the preformed bus bars may involve separate reels for each bus bar configuration (e.g., length, shape, etc.), which may create additional waste and/or require additional space (e.g., within or near the machine). Some designs utilize bus bars that are connected to the circuit board via through-hole-technology (THT), such as via bus bar nails (staples). THT designs may involve additional assembly steps to form and place nails and/or to press nails into circuit boards, which may involve relatively large machines to provide sufficient insertion force and/or components to limit stresses applied to the circuit board.

In embodiments, such as generally illustrated in fig. 1, the circuit board assembly system 20 may include an assembly line 30, and the assembly line 30 may include one or more machines, such as a first machine 32, a second machine 34, a third machine 36, a fourth machine 38, a fifth machine 40, and/or one or more other machines. The first machine 32 may, for example, but not limited to, include a solder applicator/applicator that may be configured to apply solder 52 (e.g., solder paste and/or pads) to a circuit board 50 (see, e.g., fig. 2). In some cases, the circuit board 50 may include one or more pads 56 (see, e.g., fig. 6 and 8), and at least some of the solder/solder paste 52 may be applied to the one or more pads 56. As generally illustrated in fig. 9, the second machine 34 may, for example and without limitation, include a bus bar machine that may be configured to form bus bars 54 (e.g., surface mount device (surface mount device, SMD) bus bars), such as bus bars 54 formed from one or more bus bar wires 60, 60' (see, e.g., fig. 3 and 4), and/or the bus bar machine may be configured to place bus bars 54 on circuit board 50 and/or solder/paste 52 thereof (see, e.g., fig. 5 and 6). For example, and without limitation, one or more bus bar wires 60, 60' may be provided as raw wire reels 60A, 60A ', which raw wire reels 60A, 60A ' may include different wire materials, coatings, and/or cross-sectional dimensions and/or cross-sectional shapes. The wall 30A of the assembly line 30 may be disposed between the reels 60A, 60A' and the conveyor system 42 (see, e.g., fig. 3). The bus bar wires 60, 60' may extend over the wall 30A, such as into other portions of the second machine 34.

In an embodiment, the third machine 36 may include, for example, but not limited to, a soldering machine, such as a reflow oven, which may be configured to solder the bus bars 54 and/or other electrical components 70 to the circuit board 50, such as by heating the solder/paste 52. The fourth machine 38 may, for example, but not limited to, include one or more pick and place machines/robots that may be configured to place the electrical components 70 on the circuit board 50 and/or solder/paste 52 thereof (see, e.g., fig. 7 and 8). For example, fourth machine 38 may include multiple machines/robots to more quickly place a large number of parts 70 and/or to place parts 70 of significantly different sizes. The fifth machine 40 may be configured to inspect the solder/solder paste 52 applied to the circuit board 50 (e.g., the solder/solder paste 52 applied via the first machine 32). For example, the fifth machine 40 may perform an optical inspection, such as via one or more cameras or other optical devices.

In embodiments, the second machine 34 may be disposed along the assembly line 30 between the first machine 32 and the third machine 36, and/or between the first machine 32 and the fourth machine 38. A fourth machine 38 may be disposed between the second machine 34 and the third machine 36. The second machine 34 may be disposed adjacent to the first machine 32 or the fifth machine (e.g., in the assembly direction, after the first machine 32 or the fifth machine) and/or adjacent to the third machine 36 or the fourth machine 38 (e.g., in the assembly direction, before the third machine 36 or the fourth machine 38). In some configurations, the fourth machine 38 may be disposed along the assembly line 30 before the second machine 34. In some cases, the system 20 may include one or more machines for inserting THT components, such as THT connectors or relays (relays), which may be configured for reflow oven temperatures. If THT components are to be inserted, the solder/paste 52 may be applied in accordance with a through-hole reflow (pin-in-paste) specification. Additionally or alternatively, THT components may be added/inserted via a machine disposed after a third machine or at a different assembly line, which may be configured for wave soldering THT components.

In embodiments, the assembly line 30 may include a conveyor system 42, and the conveyor system 42 may extend into, through, and/or adjacent to the first machine 32, the second machine 34, the third machine 36, the fourth machine 38, the fifth machine 40, and/or one or more other machines (e.g., see fig. 1). For example, but not limited to, the conveyor system 42 may extend through the first machine 32, the fifth machine 40, the second machine 34, the fourth machine 38, and/or the third machine 36 (e.g., in a straight line) to move the circuit board 50 and/or the bus bar 54/component 70 connected to the circuit board along the assembly line 30.

In some configurations, machines 32-40 may include one or more machine sections that may be configured to perform various actions and may or may not be independent of each other. For example, and without limitation, the second machine 34 may include a first portion 90 that forms the bus bar 54, a second portion 92 (e.g., one or more movable adaptors and/or robotic arms) that positions the bus bar 54 on the circuit board 50, a third portion 94 having one or more sensors for optical inspection, and/or a fourth portion 96 (e.g., a fan, pump, and/or connection to an external compressed air source) that blows air away from the circuit board 50, and other possible portions (e.g., see fig. 9). The first portion 90 of the second machine 34 may, for example, include a blade and/or saw 82 for cutting the bus bar 54 and/or one or more bending dies/presses 84 for bending the bus bar 54. The second machine 34 may include one or more actuators 86 (e.g., motors, cylinders, presses, etc.) and/or one or more bending dies/presses 84, the one or more actuators 86 actuating elements of the first portion 90, such as the blade/saw 82. The first portion 90 may include a feed line 98, and the feed line 98 may be disposed between the reels 60A, 60A ' and the blade/saw 82 and may align the wires 60, 60' and/or urge the wires 60, 60' toward the blade/saw 82. For example, the feed line 98 may feed the wires 60, 60 'according to a desired length of the bus bars 54, 54'. The feed line 98 may be at an oblique angle or a right angle to the assembly line 30.

In some embodiments, one or more of machines 32-40 may include a common portion and/or may be at least partially integrated with each other. Additionally or alternatively, one or more of the machines 32-40 may be separate from the other machines 32-40.

According to an embodiment, such as the embodiment generally illustrated in fig. 10, the circuit board assembly method 100 may include providing a circuit board 50 (block 102). The method 100 may include applying the solder/solder paste 52 to the circuit board 50 (block 104), such as applying the solder/solder paste 52 to the circuit board 50 via the first machine 32. Applying solder/paste 52 to the circuit board 50 may include the conveyor system 42 of the assembly line 30 moving the circuit board 50 toward the first machine 32, moving the circuit board 50 into and/or through the first machine 32. The solder/paste 52 may be applied to a plurality of locations on the circuit board 50 and may be applied in a variety of shapes and/or onto the pads 56 of the circuit board 50.

In an embodiment, the method 100 may include forming the bus bar 54 (block 106), such as forming the bus bar 54 via the second machine 34. Forming the bus bar 54 may include cutting the bus bar 54, such as cutting the bus bar 54 from one or more bus bar wires 60, 60' via one or more blades/saws 82, and/or shaping the bus bar 54. Shaping the bus bar 54 may include the second machine 34 bending the bus bar 54 via one or more bending dies/presses 84 such that the bus bar 54 includes one or more bends 58. The one or more bends 58 may include bends of various angles (such as acute, right, and/or obtuse angles) (see, e.g., fig. 5 and 7). In some configurations, the bus bar 54 may be bent from the wires 60, 60' prior to final cutting to cut the bus bar 54 from the wires, which may facilitate fixation. The one or more bends 58 may be formed such that the bus bar 54 is generally parallel to a single plane (e.g., parallel to the circuit board 50), or may be formed such that at least some portions of the bus bar 54 are disposed at one or more oblique or right angles relative to the circuit board 50. For example, the bus bar 54 may be formed to extend over the already placed components (e.g., like a bridge), such as via one or more bending dies/presses that may be disposed parallel to the vertical direction and/or may be movable parallel to the vertical direction. In some configurations, the bus bar 54 may be formed with one or more rounded or rounded portions (e.g., having a corresponding radius of curvature). The second machine 34 may be configured to form/cut bus bars 54 of different lengths. In some cases, the bus bar 54 may be formed via a first bus bar wire 60 and one or more additional bus bar wires 60' to provide the bus bar 54 with increased width and/or thickness/height. The bus bars 54 may be formed to have one or more of a variety of cross-sectional shapes, such as rectangular, square, circular, oval, and/or triangular, among others. The bus bar 54 may be tin plated after formation to facilitate soldering, and/or the bus bar wires 60, 60' may be pre-tin plated.

In some embodiments, forming the bus bars 54, 54 'with pre-plated bus bar wires 60, 60' may result in at least a portion of the cores 54A, 54A 'of the bus bars 54, 54' being exposed (e.g., uncovered by the plating 54B, 54B '), such as when the bus bars 54, 54' are cut from the wires (e.g., see fig. 6).

According to an embodiment, the method 100 may include disposing the formed bus bar 54 on the circuit board 50 and/or on the solder/paste 52 on the circuit board 50 (block 108), such as via the second machine 34 and/or another machine. For example, but not limited to, the second machine 34 may include a second portion 92 (e.g., pick and place portion), and the second portion 92 may include one or more movable adaptors and/or robots. In some configurations, disposing the bus bars 54 (block 108) may include optically inspecting via an optical inspection system (e.g., an automated optical inspection system) that may be included in the third portion 94 of the second machine 34 and/or another machine to confirm proper placement of the or each bus bar 54 on the circuit board 50.

In an embodiment, the method 100 may include disposing one or more electrical components 70 on the circuit board 50 and/or on the solder/paste 52 on the circuit board 50 (block 110), such as via the fourth machine 38 and/or another machine. Fourth machine 38 may include, for example, without limitation, a pick and place machine and/or a robot. The one or more electrical components 70 may include, for example, SMDs such as chips/integrated circuits, operational amplifiers, fuses, resistors, capacitors, inductors, transistors, diodes, and/or the like. Providing one or more electrical components 70 may include conveyor system 42 moving circuit board 50, such as from second machine 34 to fourth machine 38. When the circuit board 50 moves from the second machine 34 to the fourth machine 38, solder/paste 52 may already be disposed on the circuit board 50 and one or more bus bars 54 may be in contact with the circuit board 50 and/or the solder/paste 52. In some configurations, block 110 may occur before block 106 and/or may occur before and after blocks 106, 108.

According to an embodiment, the method 100 may include soldering one or more bus bars 54 with the circuit board 50 (block 112), such as via the third machine 36. One or more electrical components 70 may be soldered to circuit board 50 at or about the same time as one or more bus bars 54 (e.g., third machine 36 may simultaneously solder one or more bus bars 54 and one or more electrical components 70 to circuit board 50). Soldering one or more bus bars 54 may include conveying system 42 moving circuit board 50, such as from fourth machine 38 to third machine 36. When the circuit board 50 moves from the fourth machine 38 to the third machine 36, the solder/solder paste 52 may already be disposed on the circuit board 50 and one or more of the bus bars 54 and/or one or more of the electrical components 70 may be in contact with the circuit board 50 and/or the solder/solder paste 52. In some configurations, system 20 may not include fourth machine 38 and/or conveyor system 42 may move circuit board 50 from second machine 34 (e.g., directly) to third machine 36.

In an embodiment, the method 100 may include forming one or more additional bus bars 54' for connection with the circuit board 50. For example, the method 100 may include forming the first bus bar 54 in block 106, disposing the first bus bar 54 on the circuit board 50 in block 108, forming the second bus bar 54', such as by repeating block 106, and/or disposing the second bus bar 54' on the circuit board 50, such as by repeating block 108 (see, e.g., arrow 120). In some configurations, the second bus bar 54' may be formed at least partially while the first bus bar 54 is being disposed on the circuit board 50 or already disposed on the circuit board 50 and before the bus bars 54 are soldered. The second bus bar 54' may or may not include a different length and/or shape than the first bus bar 54.

In some configurations, multiple bus bars 54 having different lengths and/or shapes may be formed and placed on the same circuit board 50. In some cases, the first and second bus bars 54, 54' may be formed from adjacent portions (adjacent portions) 62, 64 of the bus bar wire 60 (see, e.g., fig. 4). The separation of the portions 62, 64 from the bus bar wire 60 may involve a cutting operation that separates the second end of the bus bar 54 from the first end of the bus bar 54'. In some cases, the cutting operation includes exposing the core 54A, 54A 'from one or both of the bus bars 54, 54', which may result in one or both of the bus bars 54, 54 'having an unplated or bare portion of the core 54A, 54A'. For example, but not limited to, the first bus bar 54 may include an unplated portion 66B and the second bus bar 54' may include an unplated portion 68A, which unplated portion 68A may be formed (e.g., simultaneously formed) during formation of the first bus bar 54 (e.g., see fig. 6). The first bus bar 54 may include another unplated portion 66A, which unplated portion 66A may have been formed during formation of the previous bus bar. The second bus bar may include another unplated portion 68B, which unplated portion 68B may be formed during formation of a subsequent/third bus bar. For example, for the plated wires 60, 60', each bus bar 54, 54' may include a first and second non-plated portion that are disposed at respective ends of the bus bar 54, 54' and that are formed during separation of the bus bar 54, 54' from adjacent portions of the wires 60, 60'. The non-plated portions may include portions of the cores 54A, 54A 'that are not covered by the plating layers 54B, 54B'.

According to an embodiment, the method 100 may include assembling the second circuit board assembly and/or one or more additional circuit board assemblies, such as by repeating blocks 102, 104, 106, 108, 110, and/or 112 (see, e.g., arrow 130).The second circuit board assembly may be substantially similar to that shown in fig. 7 and may include the same or different configurations of solder/paste 52, bus bars 54, and/or electrical components 70. In some cases, the bus bar 54 for the second circuit board assembly may be at least partially formed when one or more electrical components 70 are disposed on the first circuit board 50. The second circuit board assembly may include a second circuit board 50 ₂ And/or additional circuit board assemblies may include additional circuit boards 50 ₃ (see, e.g., fig. 9).

In an embodiment, the second machine 34 may include a guard (shield) 80, which guard 80 may be configured to limit movement of bus bar particles (e.g., shavings, dust, etc., generated by a cutting or sawing operation) that may be formed from the bus bar wires 60, 60' during formation of the bus bar 54 (e.g., see fig. 9). For example, the guard 80 may be configured to limit particles from reaching the solder/solder paste 52 of the current circuit board 50 (e.g., the circuit board to which the bus bar 54 is to be connected), one or more previous circuit boards, and/or one or more subsequent circuit boards. In some configurations, the second machine 34 may form a bus bar 54 adjacent to the circuit board 50. For example, and without limitation, the bus bars 54 may be formed within about three feet per meter of the circuit board 50, and the circuit board 50 may have the solder paste 52 applied. In some configurations, the formation of the bus bars 54 may be at a low elevation (e.g., below the level of the circuit board 50 on the conveyor system 42), which may limit particle movement and/or increase the effectiveness of the guard 80. Additionally or alternatively, the fourth portion 96 of the second machine 34 may be configured to provide air flow away from the conveyor system 42 and/or the circuit board 50 (e.g., the second machine 34 may include and/or be connected to a fan and/or a pump).

In systems that do not use SMD bus bars, particles may be removed from the circuit board by applying air directly to the circuit board (e.g., a fan, a spray, etc.). However, because the circuit board 50 of an embodiment of the system 20 may include the solder/solder paste 52 that is not soldered, the particles may adhere to the solder/solder paste 52 such that the particles are not easily removed from the circuit board 50 by the application of air. The guard 80 may prevent and/or limit particles from reaching the circuit board 50 even though the bus bar 54 may be formed near the circuit board 50.

According to an embodiment, a circuit board assembly (e.g., circuit boards 50, 50 ₂ 、50 ₃ Wherein one or more bus bars 54 and/or one or more electrical components 70 are secured to the circuit boards) may be formed via soldering, such as without the use of separate fasteners, such as nails or screws, and may or may not include THT components. In some configurations, the bus bars 54 and/or the electrical components 70 may not be inserted into the circuit board 50 and may not extend into the circuit board 50 or extend through the circuit board 50.

According to an embodiment, the system 20 may include an Electronic Control Unit (ECU) 200.ECU 200 may be connected to (e.g., via a wired and/or wireless connection) one or more of assembly line 30, first machine 32, second machine 34, third machine 36, fourth machine 38, and/or conveyance system 42 and/or configured to at least partially control one or more of assembly line 30, first machine 32, second machine 34, third machine 36, fourth machine 38, and/or conveyance system 42. For example, and without limitation, ECU 200 may be configured to operate conveyance system 42 to move circuit board 50 to machines 32-40 and/or to operate respective machines 32-40 to assemble a circuit board assembly. ECU 200 may, for example, at least partially control the operation of first portion 90 (e.g., one or more blades/saws 82, one or more bending dies/presses 84, one or more actuators 86), second portion 92, third portion 94, and/or fourth portion 96 of second machine 34.

In an embodiment, the formed bus bars 54 may be disposed in substantially the same three-dimensional position relative to the assembly line 30, which may facilitate the second machine 34 (e.g., the second portion 92 and/or arms/adaptors thereof) to pick up the bus bars 54. In contrast, for reels of preformed bars (particularly longer bars), the position of the preformed bars may vary, which may make the pick-up of the bars more challenging (e.g., less accurate/consistent, more time consuming, etc.).

The present disclosure includes the following non-limiting examples:

1. an apparatus, comprising: a circuit board; and a plurality of bus bars fixed to the circuit board; wherein the plurality of bus bars includes a first bus bar and a second bus bar formed from adjacent portions of bus bar wires.

2. The apparatus of embodiment 1, wherein the first bus bar includes a first bus bar first unplated portion and the second bus bar includes a second bus bar first unplated portion, the first bus bar first unplated portion and the second bus bar first unplated portion being formed during formation of the first bus bar.

3. The apparatus of any preceding embodiment, wherein the first and second bus bars are surface mounted and do not extend into or through the circuit board.

4. The apparatus of any preceding embodiment, wherein the first and second bus bars are not secured to the circuit board via fasteners (e.g., the bus bars may be soldered to the circuit board without separate/discrete fasteners).

5. The apparatus of any preceding embodiment, wherein the second bus bar has a different length and/or a different shape than the first bus bar.

6. A method of assembling the apparatus of any preceding embodiment, the method comprising: applying solder paste to the circuit board; forming a first bus bar from a bus bar wire; disposing a first bus bar on a solder paste on a circuit board; forming a second bus bar from a bus bar wire; disposing a second bus bar on the solder paste on the circuit board; and soldering the first bus bar and the second bus bar to the circuit board.

7. The method of embodiment 6, comprising disposing a plurality of electronic devices on the solder paste; wherein when the plurality of bus bars are soldered to the circuit board, the plurality of electronic devices are soldered to the circuit board.

8. The method of any of embodiments 6-7, wherein forming the first and second bus bars includes cutting the first and second bus bars from a bus bar wire.

9. The method of any of embodiments 6-8, wherein forming the first bus bar includes bending the first bus bar.

10. The method of any of embodiments 6-9, comprising forming a third bus bar from a second bus bar wire having a different material and/or cross section than the bus bar wire.

11. The method of any of embodiments 6-10, wherein cutting the primary bus bar exposes a core of the primary bus bar and a core of the secondary bus bar.

12. The method of any of embodiments 6-11, wherein the solder paste is applied to the circuit board via a first machine of an assembly line; the first and second bus bars are formed via a second machine of the assembly line; the first bus bar and the second bus bar are disposed on the solder paste via a second machine of the assembly line; and the first bus bar and the second bus bar are soldered via a reflow soldering oven of the assembly line.

13. The method of any of embodiments 6-12, wherein a second machine is disposed along the assembly line between the first machine and the reflow oven.

14. The method of any of embodiments 6-13, wherein the second machine includes a guard that restricts movement of particles from the bus bar wire during formation of the plurality of bus bars.

15. The method of any of embodiments 6-14, comprising: applying solder paste to the second circuit board; forming a second circuit board first bus bar from bus bar wires; disposing a second circuit board first bus bar on the solder paste on the second circuit board; and welding the second circuit board first bus bar with the second circuit board.

16. The method of any of embodiments 6-15, wherein the second circuit board first bus bar is formed at least partially while the plurality of bus bars are disposed on the solder paste and before the plurality of bus bars are soldered.

17. An apparatus comprising a circuit board; and a bus bar secured to the circuit board, the bus bar including a first end and a second end; wherein the bus bar is plated; the first end includes a first unplated portion; and the second end includes a second non-plated portion.

18. The apparatus of embodiment 17, wherein the first non-plated portion is formed via separating the bus bar from a first adjacent portion of the bus bar wire; and the second non-plated portion is formed via separating the bus bar from a second adjacent portion of the bus bar wire.

19. The apparatus of embodiment 17 or 18, comprising a second bus bar fixed to the circuit board;

wherein the second bus bar is formed by a second adjacent portion of the bus bar wire.

20. A method of assembling the apparatus of any one of embodiments 17-19, the method comprising: applying solder paste to the circuit board; forming a bus bar from a bus bar wire; and disposing the bus bar on the solder paste on the circuit board; wherein forming the bus bar includes cutting the bus bar from adjacent portions of the bus bar wire; and cutting the bus bar from the adjacent portion to expose a core of the bus bar to provide a first electroless portion or a second electroless portion.

22. The apparatus or method of any preceding embodiment, wherein the first bus bar has a circular cross section.

23. The apparatus or method of any preceding embodiment, wherein the first bus bar has a rectangular cross section.

24. The apparatus or method of any preceding embodiment, wherein the second bus bar has a different length than the first bus bar.

25. The apparatus or method of any preceding embodiment, wherein the second bus bar has a different shape than the first bus bar.

In an example, an ECU (e.g., ECU 200) may include an electronic controller and/or include an electronic processor, such as a programmable microprocessor and/or microcontroller. In an embodiment, the ECU may include, for example, an Application Specific Integrated Circuit (ASIC). The ECU may include a Central Processing Unit (CPU), memory (e.g., a non-transitory computer-readable storage medium), and/or an input/output (I/O) interface. The ECU may be configured to perform various functions, including those described in more detail herein, using suitable programming instructions and/or code embodied in software, hardware, and/or other media. In an embodiment, the ECU may include a plurality of controllers. In an embodiment, the ECU may be connected to a display, such as a touch screen display.

Various examples/embodiments for various devices, systems, and/or methods are described herein. Numerous specific details are set forth in order to provide a thorough understanding of the overall structure, function, manufacture, and use of the examples/embodiments described in the specification and illustrated in the accompanying drawings. However, it will be understood by those skilled in the art that the examples/embodiments may be practiced without such specific details. In other instances, well-known operations, components, and elements have not been described in detail so as not to obscure the examples/embodiments described in this description. It will be appreciated by persons of ordinary skill in the art that the examples/embodiments described and illustrated herein are non-limiting examples, and thus it is recognized that the specific structural and functional details disclosed herein may be representative and do not necessarily limit the scope of the embodiments.

Reference throughout this specification to "an example," "in an example," "according to an example," "various embodiments," "according to an embodiment," "in an embodiment," or "an embodiment," etc., means that a particular feature, structure, or characteristic described in connection with the example/embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in an example," "according to an example," "in various embodiments," "according to an embodiment," "in an embodiment," or "an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more examples/embodiments. Thus, a particular feature, structure, or characteristic described or illustrated in connection with one embodiment/example may be combined in whole or in part with features, structures, functions, and/or characteristics of one or more other embodiments/examples without limitation, provided such combination is not inconsistent or nonfunctional. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the scope thereof.

It should be understood that reference to a single element is not necessarily so limited, but may include one or more of such elements. Any directional references (e.g., positive, negative, upper, lower, upward, downward, left, right, leftward, rightward, top, bottom, above, below, vertical, horizontal, clockwise, and counterclockwise) are only used for identification purposes to aid the reader's understanding of the present disclosure, and do not create limitations, particularly as to the position, orientation, or use of the examples/embodiments.

"one or more" includes a function performed by one element, a function performed by more than one element (e.g., in a distributed fashion), a number of functions performed by one element, a number of functions performed by a number of elements, or any combination of the preceding.

It will be further understood that, although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the various embodiments described. Both the first element and the second element are elements, but they are not the same element.

The terminology used in the description of the various embodiments described herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and/or" as used herein relates to and encompasses any and all possible combinations of one or more of the associated listed items. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

References to joining (e.g., attaching, coupling, connecting, etc.) are to be construed broadly and may include intermediate members between a connection of elements, relative movement between elements, direct connection, indirect connection, fixed connection, movable connection, operative connection, indirect contact, and/or direct contact. Thus, reference to joining does not necessarily mean that the two elements are directly connected/coupled and in fixed relation to each other. The connection of electrical components (if any) may include mechanical, electrical, wired, and/or wireless connections, etc. The use of "e.g." and "such as" in this specification is to be construed broadly and is used to provide non-limiting examples of embodiments of the present disclosure, and the present disclosure is not limited to such examples.

Although processes, systems, and methods may be described herein in connection with one or more steps in a particular sequence, it should be understood that the methods may be practiced with steps in a different order, with certain steps performed concurrently, with additional steps, and/or with certain described steps omitted.

As used herein, the term "if" is optionally interpreted to mean "when..once" or "when..once..once" or "in response to a determination" or "in response to detection", depending on the context. Likewise, the phrase "if a determination" or "if a [ stated condition or event ] is detected" is optionally interpreted to mean "upon determination" or "in response to determination" or "upon detection of a [ stated condition or event ]" or "in response to detection of a [ stated condition or event ]" depending on the context.

It is intended that all matter contained in the above description or shown in the accompanying drawings shall be interpreted as illustrative only and not limiting. Changes in detail or structure may be made without departing from this disclosure.

It should be understood that the computer/computing device, electronic Control Unit (ECU), system and/or processor as described herein may comprise conventional processing devices known in the art capable of executing preprogrammed instructions stored in an associated memory, all of which perform in accordance with the functions described herein. To the extent that the methods described herein are implemented in software, the resulting software may be stored in an associated memory and may also constitute means for performing the methods. Such a system or processor may also be of the type having ROM, RAM, RAM and ROM, and/or a combination of nonvolatile memory and volatile memory, so that any software may be stored and also allow for the storage and processing of dynamically generated data and/or signals.

It should be further appreciated that an article of manufacture in accordance with the present disclosure may comprise a non-transitory computer readable storage medium having encoded thereon a computer program for implementing the logic and other functions described herein. The computer program may include code for performing one or more of the methods disclosed herein. Such embodiments may be configured to be executed via one or more processors (such as multiple processors) integrated into a single system or distributed across and connected together by a communication network, and the communication network may be wired and/or wireless. Code for implementing one or more of the features described in connection with one or more embodiments may cause a plurality of transistors to change from a first state to a second state when executed by a processor. The particular mode of change (e.g., which transistors change state and which transistors do not change state) may be determined, at least in part, by logic and/or code.

Claims (20)

1. An apparatus, comprising:

a circuit board; and

a plurality of bus bars fixed to the circuit board;

wherein the plurality of bus bars includes a first bus bar and a second bus bar, the first bus bar and the second bus bar being formed from adjacent portions of bus bar wires.

2. The apparatus of claim 1, wherein the first bus bar comprises a first bus bar first unplated portion and the second bus bar comprises a second bus bar first unplated portion, the first bus bar first unplated portion and the second bus bar first unplated portion being formed during formation of the first bus bar.

3. The apparatus of claim 1, wherein the first and second bus bars are surface mounted and do not extend into or through the circuit board.

4. The apparatus of claim 1, wherein the first and second bus bars are not secured to the circuit board via fasteners.

5. The apparatus of claim 1, wherein the second bus bar has a different length and/or a different shape than the first bus bar.

6. A method of assembling the apparatus of claim 1, the method comprising:

applying solder paste to the circuit board;

forming the first bus bar from the bus bar wire;

disposing the first bus bar on the solder paste on the circuit board;

forming the second bus bar from the bus bar wire;

disposing the second bus bar on the solder paste on the circuit board; and

the first bus bar and the second bus bar are soldered to the circuit board.

7. The method of claim 6, comprising disposing a plurality of electronic devices on the solder paste;

wherein the plurality of electronic devices are soldered to the circuit board when the plurality of bus bars are soldered to the circuit board.

8. The method of claim 6, wherein forming the first and second bus bars comprises cutting the first and second bus bars from the bus bar wire.

9. The method of claim 8, wherein forming the first bus bar comprises bending the first bus bar.

10. The method of claim 8, comprising forming a third bus bar from a second bus bar wire having a different material and/or cross section than the bus bar wire.

11. The method of claim 8, wherein cutting the first bus bar exposes a core of the first bus bar and a core of the second bus bar.

12. The method of claim 6, wherein the solder paste is applied to the circuit board via a first machine of an assembly line;

the first and second bus bars are formed via a second machine of the assembly line;

the first and second bus bars are disposed on the solder paste via the second machine of the assembly line; and

the first bus bar and the second bus bar are soldered via a reflow oven of the assembly line.

13. The method of claim 12, wherein the second machine is disposed along the assembly line between the first machine and the reflow oven.

14. The method of claim 12, wherein the second machine includes a guard that restricts movement of particles from the busbar wires during formation of the plurality of busbars.

15. The method of claim 6, comprising:

applying solder paste to the second circuit board;

forming a second circuit board first bus bar from the bus bar wires;

disposing the second circuit board first bus bar on the solder paste on the second circuit board; and

and welding the first bus bar of the second circuit board with the second circuit board.

16. The method of claim 15, wherein the second circuit board first bus bar is formed at least in part when the plurality of bus bars are disposed on the solder paste and before the plurality of bus bars are soldered.

17. An apparatus, comprising:

a circuit board; and

a bus bar secured to the circuit board, the bus bar including a first end and a second end;

wherein the bus bar is plated;

the first end includes a first unplated portion; and is also provided with

The second end includes a second non-plated portion.

18. The apparatus of claim 17, wherein the first unplated portion is formed via separating the bus bar from a first adjacent portion of bus bar wire; and

the second unplated portion is formed via separating the bus bar from a second adjacent portion of the bus bar wire.

19. The apparatus of claim 18, comprising a second bus bar secured to the circuit board;

wherein the second bus bar is formed from the second adjacent portion of the bus bar wire.

20. A method of assembling the apparatus of claim 17, the method comprising:

applying solder paste to the circuit board;

forming the bus bar from a bus bar wire; and

disposing the bus bar on the solder paste on the circuit board;

wherein forming the bus bar includes cutting the bus bar from adjacent portions of the bus bar wire; and

cutting the bus bar from the adjacent portion exposes a core of the bus bar to provide the first or second unplated portion.