JPH0348253U - - Google Patents
Info
- Publication number
- JPH0348253U JPH0348253U JP10846689U JP10846689U JPH0348253U JP H0348253 U JPH0348253 U JP H0348253U JP 10846689 U JP10846689 U JP 10846689U JP 10846689 U JP10846689 U JP 10846689U JP H0348253 U JPH0348253 U JP H0348253U
- Authority
- JP
- Japan
- Prior art keywords
- lens
- light emitting
- emitting diode
- molded
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012780 transparent material Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第1図は本考案によるLEDの一実施例の概略
斜視図、第2図Aは第1図のLEDのレンズの成
形時を、また同図Bは成形後を示す概略断面図で
ある。第3図は従来のLEDの一例を示す概略断
面図、第4図Aは第3図のLEDのレンズ成形前
の要部を示す斜視図、同図Bはレンズ成形時を示
す概略断面図である。 10……LED、11,12……リードフレー
ム、13……LEDチツプ、14……レンズ、1
5……ウエブ、16……ガイド。
斜視図、第2図Aは第1図のLEDのレンズの成
形時を、また同図Bは成形後を示す概略断面図で
ある。第3図は従来のLEDの一例を示す概略断
面図、第4図Aは第3図のLEDのレンズ成形前
の要部を示す斜視図、同図Bはレンズ成形時を示
す概略断面図である。 10……LED、11,12……リードフレー
ム、13……LEDチツプ、14……レンズ、1
5……ウエブ、16……ガイド。
Claims (1)
- 【実用新案登録請求の範囲】 リードフレームの一端部に取り付けられた発光
ダイオードチツプと、該発光ダイオードチツプを
包囲するように樹脂モールドにより成形されたレ
ンズとを含んでいる発光ダイオードにおいて、 上記リードフレームに対して、レンズ成形前に
、成形されるべきレンズの下端に対応する位置に
、該レンズの下端の外周縁を画成する透明材料か
ら成る円板状のガイドが一体的に形成されている
ことを特徴とする、発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10846689U JPH0348253U (ja) | 1989-09-16 | 1989-09-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10846689U JPH0348253U (ja) | 1989-09-16 | 1989-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0348253U true JPH0348253U (ja) | 1991-05-08 |
Family
ID=31657107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10846689U Pending JPH0348253U (ja) | 1989-09-16 | 1989-09-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0348253U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19833245B4 (de) * | 1997-07-30 | 2007-08-02 | Rohm Co. Ltd., Kyoto | Halbleiterlichtemissionseinrichtung mit blasenfreiem Gehäuse |
-
1989
- 1989-09-16 JP JP10846689U patent/JPH0348253U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19833245B4 (de) * | 1997-07-30 | 2007-08-02 | Rohm Co. Ltd., Kyoto | Halbleiterlichtemissionseinrichtung mit blasenfreiem Gehäuse |