JPH0347258Y2 - - Google Patents
Info
- Publication number
- JPH0347258Y2 JPH0347258Y2 JP1987000843U JP84387U JPH0347258Y2 JP H0347258 Y2 JPH0347258 Y2 JP H0347258Y2 JP 1987000843 U JP1987000843 U JP 1987000843U JP 84387 U JP84387 U JP 84387U JP H0347258 Y2 JPH0347258 Y2 JP H0347258Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- insulating base
- terminal
- printed circuit
- board terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 238000003780 insertion Methods 0.000 claims description 12
- 230000037431 insertion Effects 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 238000007747 plating Methods 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987000843U JPH0347258Y2 (US06486227-20021126-C00005.png) | 1987-01-07 | 1987-01-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987000843U JPH0347258Y2 (US06486227-20021126-C00005.png) | 1987-01-07 | 1987-01-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63109455U JPS63109455U (US06486227-20021126-C00005.png) | 1988-07-14 |
JPH0347258Y2 true JPH0347258Y2 (US06486227-20021126-C00005.png) | 1991-10-08 |
Family
ID=30778193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987000843U Expired JPH0347258Y2 (US06486227-20021126-C00005.png) | 1987-01-07 | 1987-01-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0347258Y2 (US06486227-20021126-C00005.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0411350Y2 (US06486227-20021126-C00005.png) * | 1987-01-19 | 1992-03-19 |
-
1987
- 1987-01-07 JP JP1987000843U patent/JPH0347258Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63109455U (US06486227-20021126-C00005.png) | 1988-07-14 |