JPH0346343A - Semiconductor manufacturing apparatus - Google Patents

Semiconductor manufacturing apparatus

Info

Publication number
JPH0346343A
JPH0346343A JP18231989A JP18231989A JPH0346343A JP H0346343 A JPH0346343 A JP H0346343A JP 18231989 A JP18231989 A JP 18231989A JP 18231989 A JP18231989 A JP 18231989A JP H0346343 A JPH0346343 A JP H0346343A
Authority
JP
Japan
Prior art keywords
bonded
electrode
lead
semiconductor chip
separately
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18231989A
Other languages
Japanese (ja)
Inventor
Masahiko Ishikuri
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18231989A priority Critical patent/JPH0346343A/en
Publication of JPH0346343A publication Critical patent/JPH0346343A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To bond an electrode and a metal lead with good accuracy by installing a single bonder which separately bonds an electrode to be bonded of a semiconductor chip and a lead.
CONSTITUTION: An electrode 16a to be bonded of a semiconductor chip 16 and a lead 17a are heated, pressurized and bonded by using a pressurization means 11 and a heating means 13. In this case, a bonding means 12 composed of a single bonder 12a which separately bonds the electrode 16a to be bonded of the semiconductor chip 16 and the lead 17a is installed. As a result, even when a height of the electrode 16a to be bonded is irregular, both 16a, 17a can be bonded and treated by separately pressurizing and bonding the electrode 16a to be bonded and the lead 17a. Thereby, reliability of a manufacturing apparatus can be enhanced.
COPYRIGHT: (C)1991,JPO&Japio
JP18231989A 1989-07-14 1989-07-14 Semiconductor manufacturing apparatus Pending JPH0346343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18231989A JPH0346343A (en) 1989-07-14 1989-07-14 Semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18231989A JPH0346343A (en) 1989-07-14 1989-07-14 Semiconductor manufacturing apparatus

Publications (1)

Publication Number Publication Date
JPH0346343A true JPH0346343A (en) 1991-02-27

Family

ID=16116229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18231989A Pending JPH0346343A (en) 1989-07-14 1989-07-14 Semiconductor manufacturing apparatus

Country Status (1)

Country Link
JP (1) JPH0346343A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04355940A (en) * 1991-03-27 1992-12-09 Nec Corp Joining method for tab inner lead and bonding tool for junction
JPH08172113A (en) * 1994-12-20 1996-07-02 Nec Corp Bonding device and bonding method using it

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04355940A (en) * 1991-03-27 1992-12-09 Nec Corp Joining method for tab inner lead and bonding tool for junction
JPH08172113A (en) * 1994-12-20 1996-07-02 Nec Corp Bonding device and bonding method using it

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