KR100267561B1 - Hologram pickup module producing device and the same method - Google Patents

Abstract

PURPOSE: An apparatus and a method for manufacturing a hologram pickup module are provided to simplify a manufacturing process by improving a structure of a solder junction device. CONSTITUTION: A junction block(70) is controlled to adhere a laser diode(52) to a stem(51). The first supply unit(61) provides the stem(51) to an inside of the junction block(70) and extracts the stem(51) bonded with the laser diode(52). The second supply unit(62) and the third supply unit(63) are faced to each other at both sides of one linear movable guide. The second and the third supply units(62,63) provide a silicon serve(53) and the laser diode(52) to the inside of the junction block(70). A control portion(64) controls operations of the first, the second, and the third supply units(61,62,63) and a temperature of the junction block(70).

Description

Hologram Pickup Module Manufacturing Apparatus and Method. (Hologram Pickup Module Producing Device)

The present invention relates to a device for manufacturing a hologram pickup module, which is a key component for reading signals from an optical disk, and a method thereof, and more particularly, to a device for manufacturing a hologram pickup module that reduces production investment costs and simplifies a manufacturing process by improving a structure of a lead bonding device. And to a method thereof.

As shown in FIGS. 1A and 1B, the hologram pickup module 10 is attached to a stem 1, which is a body, and an upper surface of the stem 1, to heat heat generated by the laser diode 3 during operation of the hologram pickup module. A heat sink 4 for discharging, a laser diode 3 attached to the heat sink 4, a silicon sub 2 for stably attaching the laser diode 3 to the heat sink 4; And a lead wire 5 for transmitting a signal received from the laser diode 3.

The conventional apparatus for manufacturing the hologram pickup module 10 includes a clamp 11, which is a mechanism for fixing the silicon sub 2, as shown in FIGS. 2B and 2C, and transfers heat to the silicon sub 2. The first heater block 12, the second heater block 21 for transferring heat to the heat sink 4 of the stem 1, and the first adsorption head 14 through which the laser diode 3 is adsorbed and transported. And a second adsorption head 22 through which the laser diode 3 'bonded to the silicon sub 2 is adsorbed and transported, and a laser diode 3' bonded to the laser diode 3 and the silicon sub 2. ), A control unit 13 for outputting an operation signal to the first and second adsorption heads 14 and 22, a nitrogen supply pipe 15 for supplying compressed nitrogen, and a heat sink 4 It consists of a lead supply part 24 which supplies the lead 23 to the upper surface.

When manufacturing the hologram pickup module 10 it is necessary to adjust the temperature of the stem (1) according to the general lead junction temperature curve shown in Figure 2d.

First, as shown in FIG. 2B, the silicon sub is positioned in the first heater block 12 by the clamp 11, and then power is supplied to the heater so that the temperature of the heater block 12 is the junction temperature t3. To rise. When the temperature reaches the junction temperature t3, the lead applied to the upper surface of the silicon sub 2 is melted.

At this time, the laser diode 3 is adsorbed on the first adsorption head 14, the control unit 13 confirms the position of the silicon sub 2, and moves the first adsorption head 14 to the first heater block 12. By moving, the laser diode 3 is bonded to the upper surface of the silicon sub 2.

When the laser diode 3 and the silicon sub 2 are bonded together, the power supply of the heater is cut off, compressed nitrogen is supplied from the nitrogen supply pipe 15 so that the temperature of the first heater block 12 becomes the extraction temperature t1. Cools down. Thereafter, the laser diode 3 'bonded to the silicon sub 2 is taken out.

After the laser diode 3 ′ bonded to the silicon sub 2 is taken out, as shown in FIG. 2C, when the stem 1 is in close contact with the second heater block 21, power is supplied to the heater. The temperature of the second heater block 21 and the heat sink 4 rises to the working temperature t3, and a small amount of lead 23 is supplied quantitatively to the upper surface of the heat sink 4 through the lead supply unit 24. And melted. At this time, the laser diode 3 ′ bonded to the silicon sub 2 is adsorbed onto the second adsorption head 22, and the control unit 13 checks the position of the laser diode 3 ′ bonded to the silicon sub 2. Then, the second adsorption head 22 is moved to the second heater block 41 and bonded to the upper surface of the heat sink 4.

Subsequently, when the temperature of the stem 1 is lowered to the extraction temperature t1 by cutting off the power of the heater, the hologram pickup module 10 in which the silicon sub 2 and the laser diode 3 are joined to the stem 1 is taken out. do.

However, the conventional hologram pick-up module manufacturing apparatus and the method configured as described above require two apparatuses and undergo two processes, which is cumbersome, expensive to invest in production, and small amount of lead and quantitative supply of lead and sensitive temperature. There is a difficulty to be maintained, and since the heating and cooling of the heater must be repeated, the productivity per hour is lowered, there is a problem that shorten the life of the heater and the quality of the product.

Therefore, conventionally, in order to solve the above-mentioned problems, a silicon sub with a hologram pickup module manufacturing apparatus attached and cut to a sheet, a part supply means for supplying a laser diode to a specific work place, and a silicon sub supply supplied from the part supply means And a laser diode, which is used as a place to perform soldering using lead to a stem provided to the outside, and a plurality of temperature holding means according to respective temperature distributions required to increase the reliability of the lead bonding, and the temperature holding means. A plurality of component transfer means for supplying the stem from the outside and transferring the components worked in each temperature holding means to the temperature holding means in the next work step, and moving the component transferring means forward and backward and left and right by the interval between the respective temperature holding means. It consists of a synchronous feed means for moving to the Cited by 98-15348)

However, the conventional hologram pickup module manufacturing apparatus configured as described above quantifies a small amount of lead by compressing the process to perform continuous operation at one time by improving the production method that had to work through two processes using two equipments. Although it was possible to eliminate a difficult process that had to be supplied, a synchronous transfer means for using a plurality of temperature holding means and parts transferring means, moving the parts transferring means forward and backward, and moving left and right by the interval between the respective temperature holding means In addition to the cumbersome work process, there is a problem in that the production investment cost is high due to the use of a large number of expensive driving mechanisms requiring precision.

The present invention has been made to solve the above-mentioned problems of the prior art, and the object of the present invention is to provide a hologram pick-up module manufacturing apparatus that simply implements the structure of the lead bonding device to reduce the production process as well as the production investment cost. have.

1A is a configuration diagram of a hologram pickup module,

Figure 1b is a plan view and side cross-sectional view of the hologram pickup module,

Figure 2a is a flow chart according to a conventional method for manufacturing a hologram pickup module,

FIG. 2B is a block diagram of a junction of a conventional laser diode and a silicon sub,

FIG. 2C is a schematic diagram of bonding a laser diode bonded to a silicon sub-layer to a stem,

Figure 2d is a temperature curve in a typical lead junction,

Figure 3a is a flow chart according to the bonding method of the hologram pickup module according to the present invention,

3b is a flow chart of a continuous process in the present invention,

3c is a block diagram of the present invention,

Figure 3d is a detailed view of the junction block of the main component of the present invention,

Figure 3e is a temperature curve of the heater block and the stem when applying the hologram pickup module manufacturing method of the present invention.

* Explanation of symbols for main parts of the drawings

51 stem 52 laser diode

53 silicon sub 54 heat sink

61: 1st supply unit 62: 2nd supply unit

63: third supply unit 64: control unit

65: camera 66: sheet

70: junction block 71: case

72: heater block 73: heating nitrogen supply pipe

74: cooling nitrogen supply pipe 75: heater

The present invention bonds one end surface of a silicon sub-coated on both sides with lead to a heat sink formed on the stem after heating the stem, and corresponds to a cross section in which the heat sink is bonded among the surfaces of the silicon sub in the joined part. A device for manufacturing a hologram pick-up module by continuously joining a laser diode to another end face, the apparatus comprising: a junction block in which temperature is controlled to bond the laser diode to the stem, a stem supplied into the junction block, and a laser diode supplied to the stem Supply unit for taking out the bonded product, the second and third supply units for supplying the silicon sub and the laser diode in the junction block by advancing in a direction opposite to each other by one linear movement guide, and the first Characterized by consisting of a control unit for controlling the operation of the second and third supply units and the temperature in the junction block It shall be.

In addition, one end surface of the silicon sub-coated lead on both ends is bonded to the top surface of the heat sink of the stem, and the laser diode is continuously connected to the other end surface corresponding to the surface of the silicon sub joined with the heat sink in the bonded part. In the method of manufacturing a hologram pickup module by bonding to,

Heating the heater block in the junction block to a predetermined temperature and supplying heated nitrogen in the junction block; and supplying a stem with a heat sink in the junction block of the first stage to closely contact the heater block. At the same time, the second step of supplying nitrogen through the cooling nitrogen supply pipe in the junction block so that the temperature of the stem is maintained below the melting point of lead, and the second step of seating the silicon sub on the upper surface of the heat sink of the stem after the second step A third step; and a fourth step of seating a laser diode on the silicon sub-top surface of the third step; and stopping supply of nitrogen from the cooling nitrogen supply pipe and melting lead applied to both sides of the silicon sub-melt. And a fifth step of bonding the laser diode to the heat sink of the stem, and from the cooling nitrogen supply pipe It is characterized in that it comprises a sixth step of completing the product by supplying nitrogen and solidifying lead applied to both sides of the silicon sub, and the seventh step of taking out the stem bonded to the laser diode after the sixth step.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

First, the present invention supplies the stem 51 as shown in Fig. 3b (A), and the silicon sub 53, which is coated with lead on both sides, to the upper surface of the heat sink 54 (B), The laser diode 52 is supplied to the upper surface of the silicon sub 53 in the order of supplying (C).

According to the present invention, as shown in FIG. 3C, a junction block 70 in which temperature control is performed to bond the laser diode 52 to the stem 51, and a stem to which a heat sink 54 is attached to the junction block 70 are attached. A first supply unit 61 for supplying 51 and taking out a product having the laser diode 52 bonded to the stem 51, and a heat sink of the stem 51 supplied in the junction block 70; 54) The laser diode 52 is provided on the second supply unit 62 for supplying the silicon sub 53 on which both surfaces are coated with lead, and the upper surface of the silicon sub 53 supplied in the junction block 70. The control unit 64 and the laser diode for controlling the temperature of the third supply unit 63, the operation of the first, second, third supply units (61, 62, 63) and the junction block 70 for supplying 52 and the sheet 66 to which the silicon sub 53 is attached.

As shown in FIG. 3D, the junction block 70 includes a case 71 in which openings are formed in a front surface to which the stem 51 is supplied and an upper surface to which the laser diode 52 and the silicon sub 53 are supplied. A heater block 72 seated inside the case 71 and transferring heat to the stem 51, a heating nitrogen supply pipe 73 for supplying heated nitrogen to the inside of the case 71; It is composed of a cooling nitrogen supply pipe 74 introduced into the case 71 and one end is in close contact with the stem 51 to supply nitrogen to cool the stem 51 bonded to the laser diode 52.

The heating nitrogen supply pipe 73 is provided with a heater 75 for heating nitrogen therein.

The second and third supply units 62 and 63 check the suction positions of the silicon sub 53 and the laser diode 52 when the silicon sub 53 and the laser diode 52 are supplied to the control unit 64. Positioning cameras 65 for inputting a signal are provided respectively.

Referring to the manufacturing method of the hologram pickup module according to the present invention,

First, when the power is turned on, the heater block 72 is heated to increase the temperature of the heater block 72 to the junction temperature t'3 at which lead is completely melted, as shown in FIG. To maintain the temperature.

After the heater block 72 is heated, heated nitrogen from the heating nitrogen supply pipe 73 is continuously supplied into the junction block 70 surrounded by the case 71. The heating nitrogen prevents the heater block 72 and the stem 51 from coming into contact with the atmosphere to lower the temperature or oxidize.

After the heater block 72 is heated, the first supply unit 61 adheres the stem 51 to the heater block 72 of the junction block 70, and the stem is heated by heat transfer of the heated heater block 72. 51 is heated. At this time, the stem 51 is supplied with nitrogen from the cooling nitrogen supply pipe 74 whose one end is in close contact with the stem 51 so that the stem 51 is not heated to the lead melting temperature t'3. As shown in FIG. The temperature is controlled by the controller 64 so as to maintain the preparation temperature t'2.

After the temperature of the stem 51 is adjusted, the second supply unit 62 is attached to the sheet 66 and adsorbs the silicon sub 53 with lead on both sides, and the adsorption position of the adsorbed silicon sub 53 is applied. The positioning camera 65 installed in the second supply unit 62 confirms and inputs the signal to the control unit 64. When the control unit 64 receives the input signal and sends an output signal correcting the position of the second supply unit 62 to the second supply unit 62, the second supply unit 62 moves according to the signal. The silicon sub 53 is seated on an upper surface of the heat sink 54 attached to the stem 51.

After the silicon sub 53 is seated, the third supply unit 63 adsorbs the laser diode 52 attached to the sheet 66, and the adsorption position of the adsorbed laser diode 52 is changed to the third supply unit ( The positioning camera 65 installed at 63 checks and inputs the confirmed signal to the control unit 64. When the control unit 64 receives the input signal and sends an output signal correcting the position of the third supply unit 63 to the third supply unit 63, the third supply unit 63 moves in accordance with the signal. The laser diode 52 is mounted on the upper surface of the silicon sub 53 seated on the stem 51.

After the laser diode 52 is settled, if the supply of nitrogen supplied from the cooling nitrogen supply pipe 74 is stopped, the stem 51 is shown in FIG. 3E by heat transfer of the heater block 72 and the heating nitrogen. As such, it is heated to the junction temperature t'3 at which lead is melted. When the stem 51 reaches the joining temperature, the lead applied to both surfaces of the silicon sub 53 is melted.

After the molten lead of the silicon sub 53 is melted, when a strong nitrogen supply is made from the cooling nitrogen supply pipe 74, the temperature of the stem 51 is lower than the solidification temperature of the lead as shown in FIG. 3E (t′1). And the lead of the silicon sub53 solidified on the heat sink 54 of the stem 51 is solidified so that the laser diode 52 and the silicon sub 53 of the heat sink 54 of the stem 51 are solidified. It is bonded to the upper surface. At this time, the temperature of the heater block 72 is slightly lowered as shown in Figure 3e.

After the stem 51 and the laser diode 52 are joined, when the stem 51 reaches the extraction temperature t'1, the nitrogen supply from the cooling nitrogen supply pipe 74 is stopped and the first supply unit ( 61 pulls out the stem 51 to which the laser diode 52 and the silicon sub 53 are joined, wherein the heater block 72 has a melting point temperature t of lead before the new stem 51 is supplied. Return to '3).

Thus, the present invention is configured to heat the stem by a heater block having a fixed temperature in the junction block, and to maintain the temperature of the stem for joining the lead or to cool the stem after the joining by injecting nitrogen to cool it. As a result, the number of steps and the number of temperature transfer means are reduced, thereby reducing the number of manufacturing processes and reducing the number of parts transfer means, thereby reducing production investment costs.

In addition, there is an advantage in that the lead bonding is made in the junction block to reduce the contact with the atmosphere to improve the lead bonding strength.

Claims (8)

After heating the stem, one end surface of the silicon sub coated on both sides with lead is bonded to the heat sink formed on the stem, and the other cross section corresponding to the cross section of the heat sink bonded on the silicon sub surface of the bonded part. An apparatus for manufacturing a hologram pickup module by successively bonding a laser diode to A junction block having a temperature control such that the laser diode is bonded to the stem, a first supply unit supplying the stem to the junction block and extracting a product having the laser diode bonded to the stem, and one linear moving guide. A second and a third supply unit for supplying a silicon sub and a laser diode to the junction block in opposite directions, and a control unit for controlling the operation of the first, second and third supply units and the temperature in the junction block. Hologram pickup module manufacturing apparatus characterized in that. The method of claim 1, The junction block blocks the atmosphere when the stem is heated to prevent oxidation of lead, a heater block seated inside the case and transferring heat to the stem, and a heating nitrogen supply pipe for supplying heated nitrogen to the inside of the case. And a cooling nitrogen supply pipe which is introduced into the case and has one end adhered to the stem to supply nitrogen to cool the stem joined to the laser diode. The method of claim 2, The heating nitrogen supply pipe is a hologram pickup module manufacturing apparatus, characterized in that a heater for heating the nitrogen is installed therein. The method of claim 2, The case is a hologram pickup module manufacturing apparatus, characterized in that the opening is formed in the front and the upper surface to supply the laser diode and the silicon sub, respectively. The method of claim 1, The second and third supply unit is a hologram pickup module manufacturing characterized in that the positioning camera for inputting a signal to the control unit to check the suction position of the silicon sub and the laser diode when the silicon sub and the laser diode supplied Device. One end of the silicon sub-coated lead-coated on both ends is joined to the top surface of the heat sink of the stem, and the laser diode is continuously bonded to the other end of the silicon sub-surface corresponding to the surface of the silicon sub-interface bonded to the heat sink. In the method of manufacturing a hologram pickup module, Heating the heater block in the junction block to a predetermined temperature and supplying heated nitrogen in the junction block; and supplying a stem with a heat sink in the junction block of the first stage to closely contact the heater block. At the same time, the second step of supplying nitrogen through the cooling nitrogen supply pipe in the junction block so that the temperature of the stem is maintained below the melting point of lead, and the second step of seating the silicon sub on the upper surface of the heat sink of the stem after the second step A third step; and a fourth step of seating a laser diode on the silicon sub-top surface of the third step; and stopping supply of nitrogen from the cooling nitrogen supply pipe and melting lead applied to both sides of the silicon sub-melt. And a fifth step of joining the laser diode to the stem and the heat sink, and from the cooling nitrogen supply pipe. A hologram comprising a sixth step of completing a product by supplying nitrogen and solidifying lead coated on both sides of the silicon sub, and a seventh step of extracting a stem to which the laser diode is bonded after the sixth step How to make a pickup module. The method of claim 6, The fourth step is a first step of adsorbing the silicon sub adhered to the sheet through the supply unit and a second step of confirming the silicon sub adsorption position of the first process through a positioning camera to input a signal to the controller. And a third step of seating the silicon sub on the upper surface of the heat sink of the stem after correcting the position of the supply unit according to the signal output from the controller. The method of claim 6, In the sixth step, the first step of adsorbing the laser diode attached to the sheet through the supply unit and the step of checking a suction position of the laser diode of the first step through a positioning camera to input a signal to the controller And a third step of mounting the laser diode on the upper surface of the silicon sub by correcting the position of the supply unit according to the signal output from the controller.

Images