JPH0343783B2 - - Google Patents
Info
- Publication number
- JPH0343783B2 JPH0343783B2 JP58172885A JP17288583A JPH0343783B2 JP H0343783 B2 JPH0343783 B2 JP H0343783B2 JP 58172885 A JP58172885 A JP 58172885A JP 17288583 A JP17288583 A JP 17288583A JP H0343783 B2 JPH0343783 B2 JP H0343783B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- layer
- resin
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 51
- 239000011347 resin Substances 0.000 claims description 51
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 20
- 239000011111 cardboard Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000011162 core material Substances 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ICモジユールを含むICカードおよ
びその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC card including an IC module and a method for manufacturing the same.
従来のICカードは、カードの厚みが0.80mm以下
の規格により定められている。この厚みのカード
内に0.56〜0.60mmのICモジユールをカード基板に
埋設装着してICカードとする場合、ICモジユー
ルを塩化ビニルシートによりサンドイツチして加
熱加圧することができる。
Conventional IC cards are stipulated by standards that the card thickness must be 0.80 mm or less. When an IC module with a thickness of 0.56 to 0.60 mm is embedded in a card substrate to form an IC card, the IC module can be sandwiched with a vinyl chloride sheet and heated and pressurized.
ところが、このサンドイツチ型のICカードで
はシートの加熱加圧の熱熱によりカードの裏面に
凹凸が生じる欠点があつた。
However, this sandwich-style IC card had the disadvantage that the back surface of the card became uneven due to the heat generated by heating and pressing the sheet.
すなわちICモジユールをカード基板に嵌め込
み型でなくサンドイツチ型にする場合、塩化ビニ
ルのオーバレイフイルム、コア材を熱融着するた
め加熱加圧するが、塩化ビニルやコア材は公称厚
みと実寸法とが±３〜10％の厚み誤差を有するた
め、ICモジユール公称厚みの統一してもカード
化したときに裏面に凹凸が生じるし、また、従来
時計、電卓、カメラ等に使用されている薄型の
ICモジユールをサンドイツチ型にカード化する
場合、ICモジユールの裏面が熱収縮等により凹
凸となる欠点があつて、さらに従来のICモジユ
ールはシリコン系の封止樹脂を使用しているか
ら、加圧した時に、ボンデイング部分が破壊され
て機能を失う欠点もあつて問題であつた。 In other words, when the IC module is made into a sandwich type instead of a type that is inserted into a card board, the vinyl chloride overlay film and core material are heat-sealed and pressurized, but the nominal thickness and actual dimensions of the vinyl chloride and core material are ± Because there is a thickness error of 3 to 10%, even if the nominal thickness of the IC module is standardized, the back side will be uneven when it is made into a card.
When converting an IC module into a sandwich-type card, there is a drawback that the back side of the IC module becomes uneven due to heat shrinkage, etc. Furthermore, since conventional IC modules use silicone-based sealing resin, it is difficult to pressurize the module. There was also the problem that the bonding part was sometimes destroyed and lost its function.
本発明は、これら従来の欠点を排除しようとす
るもので、裏面に凹凸のないICカード、および
カード化したときに裏面に凹凸が生じる、均一な
厚み、均一な矩形寸法を有し、加圧によりボンデ
イング部分も破壊されることのないICカードお
よびその製造方法を提供することを目的とする。 The present invention aims to eliminate these conventional drawbacks, and is intended to provide an IC card that has no unevenness on the back surface, has a uniform thickness, has a uniform rectangular size, has unevenness on the back surface when it is made into a card, and has a uniform thickness and a uniform rectangular size. An object of the present invention is to provide an IC card and a method for manufacturing the same, in which the bonding part is not destroyed by the process.
本発明は、基板上のICチツプ、ワイヤーを封
止樹脂層で被覆構成したICモジユールを装着し
たICカードにおいて、該ICモジユールの基板、
ICチツプ、ワイヤー等に対して接着性が良く、
かつ硬度の高い樹脂の封止樹脂層を備え、該封止
樹脂層上に該封止樹脂と接着性が良く加熱加圧に
よる収縮の少ない樹脂の充填層を形成し、該充填
層上に熱軟化性の樹脂で凹凸吸収層を設けたIC
モジユールを、その凹凸吸収層を下面にして上面
に印刷を施したカード基板に設けられた装着孔に
装着し、該ICモジユールおよびカード基板の下
面に、熱軟化性のフイルムを介して、下面に印刷
を施した白色の塩化ビニル層を接着させ、該塩化
ビニル層の下面と、前記ICモジユールおよびカ
ード基板の上面とに、それぞれ透明なオーバレイ
フイルムを接着してなるICカードである。
The present invention provides an IC card equipped with an IC module in which an IC chip and a wire on a substrate are covered with a sealing resin layer, the substrate of the IC module,
Good adhesion to IC chips, wires, etc.
and a sealing resin layer made of a resin with high hardness, and on the sealing resin layer, a filling layer of a resin that has good adhesion to the sealing resin and has little shrinkage when heated and pressurized is formed, and a heating layer is formed on the filling layer. IC with uneven absorption layer made of softening resin
The module is installed in a mounting hole provided in a card board whose top surface is printed with the uneven absorbing layer facing down, and a heat-softening film is placed on the bottom surface of the IC module and the bottom surface of the card board. This IC card is made by adhering a printed white vinyl chloride layer and adhering transparent overlay films to the lower surface of the vinyl chloride layer and the upper surfaces of the IC module and card substrate, respectively.
また、本発明で重要なな特徴は基板上にICチ
ツプ及びワイヤーを備え、この基板、ICチツプ
及びワイヤーに対して接着性が良く、かつ硬度の
高い樹脂の封止樹脂層を形成し、かつ該封止樹脂
層上に該封止樹脂との接着性が良く加熱加圧によ
る収縮の少ない樹脂の充填層を形成し、さらに該
充填層上に熱軟化性樹脂で凹凸吸収層を設けた
ICモジユールをカード基板に設けられた装着孔
に装着して備えたICカードの製造方法において、
上面に印刷を施した塩化ビニル樹脂のカード基板
に前記ICモジユールが嵌合する寸法の装着孔を
設け、該装着孔にICモジユールの前記凹凸吸収
層を下面にしてICモジユールを装着したのち、
ICモジユールの部分を除いてカード基板の下面
に、熱軟化性フイルムを介在させて印刷のある塩
化ビニル層を印刷を下面にして重ねて、さらに該
塩化ビニル層の下面とICモジユール及びカード
基板の上面とに透明なオーバレイフイルムをそれ
ぞれ積層させてからICカードの裏面に鏡面板の
マツトを置いて一旦加熱加圧したのち再度加圧す
る熱プレスすることを特徴とするICカードの製
造方法である。 Furthermore, an important feature of the present invention is that an IC chip and wires are provided on a substrate, and a sealing resin layer of a resin with good adhesiveness and high hardness is formed on the substrate, IC chips, and wires, and On the sealing resin layer, a filling layer of a resin that has good adhesion to the sealing resin and shrinks little when heated and pressurized is formed, and an uneven absorbing layer made of a heat-softening resin is further provided on the filling layer.
In a method for manufacturing an IC card including an IC module mounted in a mounting hole provided on a card board,
A mounting hole sized to fit the IC module is provided in a vinyl chloride resin card substrate with printing on the top surface, and the IC module is mounted in the mounting hole with the uneven absorbing layer of the IC module facing downward;
A printed vinyl chloride layer is layered on the bottom surface of the card substrate except for the IC module part, with a heat-softening film interposed between them, and the printed vinyl chloride layer is placed on the bottom surface of the card substrate, excluding the IC module part, and then the bottom surface of the vinyl chloride layer and the IC module and card substrate are layered. This method of manufacturing an IC card is characterized by hot pressing, in which a transparent overlay film is laminated on the top surface and the top surface, a mirror plate mat is placed on the back surface of the IC card, the card is heated and pressurized once, and then pressurized again.
本発明の一実施例を第１〜２図により説明す
る。ICモジユールの製造方法を説明すると、第
１図に示すように塩化ビニル樹脂、シリコン樹脂
等のコア材１にICモジユールの嵌合寸法のICモ
ジユール成型穴２をプレス打抜き等により形成す
る。
An embodiment of the present invention will be described with reference to FIGS. 1 and 2. To explain the method of manufacturing an IC module, as shown in FIG. 1, an IC module molding hole 2 having a size to fit the IC module is formed in a core material 1 made of vinyl chloride resin, silicone resin, etc. by press punching or the like.
次にコア材１の下面にポリエチレンシート３を
接触させ、ICモジユール４を前記ICモジユール
成型穴２に装着する。 Next, the polyethylene sheet 3 is brought into contact with the lower surface of the core material 1, and the IC module 4 is installed in the IC module molding hole 2.
このICモジユール４は基板５上のICチツプ６、
ワイヤー７等を封止する封止樹脂層８を形成した
ものであり、この封止樹脂は、基板５、ICチツ
プ６、ワイヤー７等に対して接着性が良く、かつ
硬度の高い樹脂、例えばエポキシ樹脂、不飽和ポ
リエステル樹脂、シリコン樹脂等を使用する。 This IC module 4 includes an IC chip 6 on a substrate 5,
A sealing resin layer 8 is formed to seal the wire 7, etc., and this sealing resin is made of a resin that has good adhesion to the substrate 5, the IC chip 6, the wire 7, etc., and has high hardness, such as a hard resin. Epoxy resin, unsaturated polyester resin, silicone resin, etc. are used.
なお、硬度の増加および熱収縮の防止のため、
これらの樹脂に充填剤を入れてもよい。この充填
剤は絶縁性のものが好ましい。 In addition, in order to increase hardness and prevent heat shrinkage,
Fillers may be added to these resins. This filler is preferably insulating.
次にICモジユール成型穴２のICモジユール４
の封止樹脂層８上に樹脂９を注入する。この樹脂
９は封止樹脂層８と接着性が良く、加熱加圧によ
る収縮の少ない樹脂例えば充填剤入りエポキシ樹
脂、不飽和ポリエステル樹脂、充填剤入りシリコ
ン樹脂、アクリル樹脂、充填剤入りアクリル樹脂
を用い、コア材１よりも高くなる程度に注入する
が、この樹脂９は無溶剤タイプが好ましく、充填
剤はICチツプの静電破壊防止のため導電性充填
剤が好ましいが、入れなくてもよい。 Next, insert IC module 4 in IC module molding hole 2.
A resin 9 is injected onto the sealing resin layer 8 of. This resin 9 has good adhesion to the sealing resin layer 8 and is a resin that shrinks little when heated and pressurized, such as a filled epoxy resin, an unsaturated polyester resin, a filled silicone resin, an acrylic resin, or a filled acrylic resin. The resin 9 is preferably a solvent-free type, and the filler is preferably a conductive filler to prevent electrostatic damage to the IC chip, but it is not necessary to add it. .
次に樹脂９およびコア材１上に凹凸吸収層とし
て塩化ビニル樹脂等の熱軟化性のフイルム１０を
重ね、該フイルム１０の上面を加圧ローラ１１で
加圧して表面を平面状とする。このフイルム１０
は、ポリエチレン、塩化ビニリデン、アイオノマ
ー、軟質塩化ビニルのいずれか又はこれらの組合
せを使用する。その後に封止樹脂層８上に注入し
た樹脂９を硬化させて充填層９′として備える。 Next, a heat-softening film 10 such as vinyl chloride resin is layered on the resin 9 and the core material 1 as an uneven absorbing layer, and the upper surface of the film 10 is pressed with a pressure roller 11 to make the surface planar. This film 10
uses polyethylene, vinylidene chloride, ionomer, soft vinyl chloride, or a combination thereof. Thereafter, the resin 9 injected onto the sealing resin layer 8 is cured and provided as a filling layer 9'.
次にポリエステルシート３を除去し、プレス、
ビク抜き等の除去具１２によりICモジユール
４′をコア材１から離脱させてICモジユール４′
が得られる。 Next, remove the polyester sheet 3, press,
Remove the IC module 4' from the core material 1 using a removing tool 12 such as a remover, and remove the IC module 4'.
is obtained.
次にこのICモジユール４′を使用するICカード
では、第２図に示すように、上面に印刷１３を施
した白色の塩化ビニル樹脂のカード基板１４に、
ICモジユール４′が嵌合する寸法の装着孔１５を
設け、該装着孔１５にICモジユール４′を塩化ビ
ニルのフイルム層１０′を下面にして装着する。
カード基板１４は白色以外の塩化ビニル樹脂であ
つてもさしつかえない。 Next, in the IC card using this IC module 4', as shown in FIG.
A mounting hole 15 having a size to fit the IC module 4' is provided, and the IC module 4' is mounted in the mounting hole 15 with the vinyl chloride film layer 10' facing downward.
The card substrate 14 may be made of vinyl chloride resin other than white.
次にICモジユール４′の部分を除くカード基板
１４の下面に、熱軟化性の良い、例えばポリエチ
レン、塩化ビニリデン、アイオノマー樹脂、軟質
塩ビ等のいずれか又はこれらの組合せからなるフ
イルム１６を接触させ、該フイルム１６の下面に
は印刷１７を下面に施した白色の塩化ビニル層１
８を接触させ、該塩化ビニル層１８の下面および
カード基板１４の上面に、透明なオーバレイフイ
ルム１９を接触させ、オーバレイフイルム１９の
外側から矢印で示すように加熱加圧することによ
つて各層を熱圧着してICカードが得られる。こ
の加圧は２回行なうのが好ましく、その場合、１
回目はマツトの鏡面板を使用し、気泡が逃れ易く
して加圧し、再度加圧すると良好な鏡面が得られ
る。前記フイルム１６は前記フイルム１０と同一
の材質であることが好ましい。２０はオーバレイ
フイルムに設けた穴であり、ICモジユール４の
外部端子２１が露出するためのものである。 Next, a film 16 made of a material having good heat softening property, such as polyethylene, vinylidene chloride, ionomer resin, soft vinyl chloride, etc. or a combination thereof, is brought into contact with the lower surface of the card substrate 14 excluding the IC module 4'. On the lower surface of the film 16 is a white vinyl chloride layer 1 with printing 17 on the lower surface.
8 and the transparent overlay film 19 is brought into contact with the lower surface of the vinyl chloride layer 18 and the upper surface of the card substrate 14, and each layer is heated and pressurized from the outside of the overlay film 19 as shown by the arrow. You can get an IC card by crimping it. It is preferable to apply this pressure twice; in that case, once
For the second time, use a matte mirror plate to make it easier for air bubbles to escape, then pressurize, and press again to obtain a good mirror surface. Preferably, the film 16 is made of the same material as the film 10. Reference numeral 20 denotes a hole provided in the overlay film, through which the external terminal 21 of the IC module 4 is exposed.
本発明は、封止樹脂として硬度の高い樹脂を使
用するから、加熱加圧の時にボンデイング部分が
破壊されて機能を失うことがなく、熱収縮の少な
い樹脂により充填層とその上に加熱加圧により凹
凸吸収層を形成するからICモジユールの裏面が
熱収縮により凹凸となることもなく、均一な厚
み、均一な寸法のICモジユールとしてカードに
備えられると共に、熱軟化性の良いフイルムがバ
ツフアの機能を有し、厚みのバラツキを修正する
から、均一な厚みの凹凸のないカードが得られる
し、ICモジユールを用いてサンドイツチ型にカ
ード化しても従来の欠点はなく、カード裏面の平
滑性も容易に維持でき機能上安全で体裁良好な製
品とし、商品価値を大幅に高められる効果があ
る。
Since the present invention uses a resin with high hardness as the sealing resin, the bonding part will not be destroyed and lose its function when heated and pressurized. Because it forms an uneven absorbing layer, the back side of the IC module does not become uneven due to heat shrinkage, and the card can be equipped with an IC module of uniform thickness and size. Since it corrects thickness variations, cards with uniform thickness and no unevenness can be obtained, and even if the card is made into a sandwich type card using an IC module, it does not have the disadvantages of conventional cards, and the back surface of the card can be easily made smooth. This has the effect of significantly increasing the product value by making the product functionally safe and good-looking, as well as maintaining its quality.
第１図Ａ〜Ｅは本発明の一実施例のICモジユ
ールの製造工程の縦断説明図、第２図Ａ，Ｂは
ICカードの製造工程の縦断説明図である。
１……コア材、２……ICモジユール成型穴、
３……ポリエチレンシート、４，４′……ICモジ
ユール、５……基板、６……ICチツプ、７……
ワイヤー、８……封止樹脂層、９……樹脂、９′
……充填層、１０……フイルム、１０′……フイ
ルム層、１１……加圧ローラ、１２……除去具、
１３……印刷、１４……カード基板、１５……装
着孔、１６……フイルム、１７……印刷、１８…
…塩化ビニル層、１９……オーバレイフイルム、
２０……穴、２１……外部端子。
FIGS. 1A to 1E are longitudinal explanatory views of the manufacturing process of an IC module according to an embodiment of the present invention, and FIGS. 2A and 2B are
FIG. 2 is a longitudinal explanatory diagram of the manufacturing process of an IC card. 1... Core material, 2... IC module molding hole,
3...Polyethylene sheet, 4,4'...IC module, 5...Substrate, 6...IC chip, 7...
Wire, 8...Sealing resin layer, 9...Resin, 9'
...Filled layer, 10...Film, 10'...Film layer, 11...Pressure roller, 12...Removal tool,
13...Printing, 14...Card board, 15...Mounting hole, 16...Film, 17...Printing, 18...
...vinyl chloride layer, 19...overlay film,
20...hole, 21...external terminal.
Claims (1)
で被覆構成したICモジユールを装着したICカー
ドにおいて、該ICモジユールの基板、ICチツプ、
ワイヤー等に対して接着性が良く、かつ硬度の高
い樹脂の封止樹脂層を備え、該封止樹脂層上に該
封止樹脂と接着性が良く加熱加圧による収縮の少
ない樹脂の充填層を形成し、該充填層上に熱軟化
性樹脂で凹凸吸収層を設けたICモジユールを、
その凹凸吸収層を下面にして、上面に印刷を施し
たカード基板に設けられた装着孔に装着し、該
ICモジユールおよびカード基板の下面に、熱軟
化性のフイルムを介して、下面に印刷を施した白
色の塩化ビニル層を接着させ、該塩化ビニル層の
下面と、前記ICモジユールおよびカード基板の
上面とに、それぞれ透明なオーバレイフイルムを
接着してなるICカード。 ２ 基板上に、ICチツプ及びワイヤーを備え、
この基板、ICチツプ及びワイヤーに対して接着
性が良く、かつ硬度の高い樹脂の封止樹脂層を形
成し、かつ、該封止樹脂層上に該封止樹脂との接
着性が良く加熱加圧による収縮の少ない樹脂の充
填層を形成し、さらに該充填層上に熱軟化性樹脂
で凹凸吸収層を設けたICモジユールを、カード
基板に設けられた装着孔に装着して備えたICカ
ードの製造方法において、上面に印刷を施した塩
化ビニル樹脂のカード基板に前記ICモジユール
が嵌合する寸法の装着孔を設け、該装着孔にIC
モジユールの前記凹凸吸収層を下面にしてICモ
ジユールを装着したのち、ICモジユールの部分
を除いてカード基板の下面に、熱軟化性フイルム
を介在させて印刷のある塩化ビニル層を印刷を下
面にして重ねて、さらに該塩化ビニル層の下面と
ICモジユール及びカード基板の上面とに透明な
オーバレイフイルムをそれぞれ積層させてから、
ICカードの裏面に鏡面板のマツトを置いて一旦
加熱加圧したのち再度加圧する熱プレスすること
を特徴とするICカードの製造方法。[Scope of Claims] 1. An IC card equipped with an IC module in which an IC chip and wires on a substrate are covered with a sealing resin layer, including the substrate of the IC module, the IC chip,
Equipped with a sealing resin layer made of a resin that has good adhesion to wires etc. and high hardness, and on the sealing resin layer is a filling layer of a resin that has good adhesion to the sealing resin and has little shrinkage when heated and pressurized. and an IC module with an uneven absorbing layer made of a heat-softening resin on the filling layer,
With the uneven absorption layer facing down, attach it to the mounting hole provided on the card board with printing on the top surface, and then
A white vinyl chloride layer with printing on the bottom surface is adhered to the bottom surface of the IC module and the card board through a heat-softening film, and the bottom surface of the vinyl chloride layer and the top surface of the IC module and card board are bonded together. An IC card made by adhering a transparent overlay film to each. 2. Equipped with an IC chip and wires on the board,
A sealing resin layer made of a resin with good adhesion and high hardness is formed on the substrate, IC chip, and wire, and the sealing resin layer has good adhesion with the sealing resin and is heated. An IC card equipped with an IC module in which a filling layer of resin that has little shrinkage due to pressure is formed, and an uneven absorbing layer made of a heat-softening resin is provided on the filling layer, which is mounted in a mounting hole provided on a card substrate. In the manufacturing method, a mounting hole sized to fit the IC module is provided in a card board made of vinyl chloride resin with printing on the top surface, and an IC is inserted into the mounting hole.
After installing the IC module with the uneven absorbing layer of the module on the bottom side, a thermosetting film is interposed on the bottom side of the card board except for the IC module part, and a printed vinyl chloride layer is placed on the bottom side of the card board, with the printing side on the bottom side. Overlap the bottom surface of the vinyl chloride layer.
After laminating a transparent overlay film on the top surface of the IC module and card board,
A method for manufacturing an IC card, which is characterized by hot pressing, in which a mirror-plated mat is placed on the back of the IC card, heated and pressed once, and then pressed again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58172885A JPS6065552A (en) | 1983-09-21 | 1983-09-21 | Ic module and ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58172885A JPS6065552A (en) | 1983-09-21 | 1983-09-21 | Ic module and ic card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6065552A JPS6065552A (en) | 1985-04-15 |
| JPH0343783B2 true JPH0343783B2 (en) | 1991-07-03 |
Family
ID=15950122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58172885A Granted JPS6065552A (en) | 1983-09-21 | 1983-09-21 | Ic module and ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6065552A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6265270U (en) * | 1985-10-15 | 1987-04-23 | ||
| CN1079053C (en) * | 1996-06-17 | 2002-02-13 | 三菱电机株式会社 | Method for producing thin IC cards and construction thereof |
| US6207004B1 (en) | 1996-06-17 | 2001-03-27 | Mitsubishi Denki Kabushiki Kaisha | Method for producing thin IC cards and construction thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113625A (en) * | 1974-07-19 | 1976-02-03 | Kubota Ltd | KONBAIN |
-
1983
- 1983-09-21 JP JP58172885A patent/JPS6065552A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113625A (en) * | 1974-07-19 | 1976-02-03 | Kubota Ltd | KONBAIN |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6065552A (en) | 1985-04-15 |
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