JPH0343717Y2 - - Google Patents

Info

Publication number
JPH0343717Y2
JPH0343717Y2 JP1984080295U JP8029584U JPH0343717Y2 JP H0343717 Y2 JPH0343717 Y2 JP H0343717Y2 JP 1984080295 U JP1984080295 U JP 1984080295U JP 8029584 U JP8029584 U JP 8029584U JP H0343717 Y2 JPH0343717 Y2 JP H0343717Y2
Authority
JP
Japan
Prior art keywords
radial bearing
connecting body
eccentric shaft
eccentric
radial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984080295U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6016541U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984080295U priority Critical patent/JPS6016541U/ja
Publication of JPS6016541U publication Critical patent/JPS6016541U/ja
Application granted granted Critical
Publication of JPH0343717Y2 publication Critical patent/JPH0343717Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1984080295U 1984-05-30 1984-05-30 ワイヤボンデイング装置 Granted JPS6016541U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984080295U JPS6016541U (ja) 1984-05-30 1984-05-30 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984080295U JPS6016541U (ja) 1984-05-30 1984-05-30 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6016541U JPS6016541U (ja) 1985-02-04
JPH0343717Y2 true JPH0343717Y2 (en)van) 1991-09-12

Family

ID=30210288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984080295U Granted JPS6016541U (ja) 1984-05-30 1984-05-30 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6016541U (en)van)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852684Y2 (ja) * 1979-01-29 1983-12-01 三菱電機株式会社 ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPS6016541U (ja) 1985-02-04

Similar Documents

Publication Publication Date Title
JP4560235B2 (ja) 角度調整テーブル装置
US3575333A (en) Beam-lead bonding apparatus
EP1127380A1 (en) Multidirectional motors
JP3718395B2 (ja) ボンディング装置のボンディングヘッド
JPH0343717Y2 (en)van)
JPH0612273Y2 (ja) トルク損失に応答する復帰機構
JPS6133643Y2 (en)van)
JP2562845Y2 (ja) 超音波モータ
JP3616705B2 (ja) 超音波駆動装置、アナログ式時計、及び電子機器
JPH0747199Y2 (ja) 加圧装置
JPH0578197U (ja) 超音波モータ
JP2975072B2 (ja) アクチュエータの駆動方法及びこの駆動方法を実現した超音波アクチュエータ
JPH0526368Y2 (en)van)
JPH03164075A (ja) 精密直動アクチュエーター
JPS6444384U (en)van)
JP2764285B2 (ja) 回転位置決め装置
JPH0755002Y2 (ja) ワイヤボンダの荷重制御構造
JPH0721992Y2 (ja) 移動装置
WO2004031781A1 (ja) 半導体加速度センサ及びその製造方法
JPH0533689U (ja) 超音波モータ
JPH0249526Y2 (en)van)
JPH0546816Y2 (en)van)
JPH02106182A (ja) 波動モータの加圧支持構造
JPH03145953A (ja) 軸部材の圧入装置
JPS5974316U (ja) 測量機の回転軸微動装置