JPH0342998B2 - - Google Patents

Info

Publication number
JPH0342998B2
JPH0342998B2 JP63087067A JP8706788A JPH0342998B2 JP H0342998 B2 JPH0342998 B2 JP H0342998B2 JP 63087067 A JP63087067 A JP 63087067A JP 8706788 A JP8706788 A JP 8706788A JP H0342998 B2 JPH0342998 B2 JP H0342998B2
Authority
JP
Japan
Prior art keywords
wire
connection
tool
transducer
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63087067A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63268582A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS63268582A publication Critical patent/JPS63268582A/ja
Publication of JPH0342998B2 publication Critical patent/JPH0342998B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H10W72/07141—
    • H10W72/07521—
    • H10W72/07533—
    • H10W72/5363—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP63087067A 1987-04-08 1988-04-08 ミスワイヤの検出可能なワイヤ接続方法および装置 Granted JPS63268582A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US035,849 1987-04-08
US07/035,849 US4786860A (en) 1987-04-08 1987-04-08 Missing wire detector

Publications (2)

Publication Number Publication Date
JPS63268582A JPS63268582A (ja) 1988-11-07
JPH0342998B2 true JPH0342998B2 (en:Method) 1991-06-28

Family

ID=21885161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63087067A Granted JPS63268582A (ja) 1987-04-08 1988-04-08 ミスワイヤの検出可能なワイヤ接続方法および装置

Country Status (3)

Country Link
US (1) US4786860A (en:Method)
JP (1) JPS63268582A (en:Method)
DE (1) DE3810929A1 (en:Method)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887470A (en) * 1988-08-12 1989-12-19 Honeywell Inc. Wire bond force calibration meter
US5754329A (en) * 1992-12-22 1998-05-19 Monsanto Company Electrochromic display laminates
US5544804A (en) * 1994-06-08 1996-08-13 Texas Instruments Incorporated Capillary designs and process for fine pitch ball bonding
US5591920A (en) * 1995-11-17 1997-01-07 Kulicke And Soffa Investments, Inc. Diagnostic wire bond pull tester
US5876633A (en) * 1995-12-26 1999-03-02 Monsanto Company Electrochromic metal oxides
ATE240376T1 (de) * 1995-12-26 2003-05-15 Monsanto Co Electrochromes zinn-oxid
US5894981A (en) * 1996-11-27 1999-04-20 Orthodyne Electronics Corporation Integrated pull tester with an ultrasonic wire bonder
US5906706A (en) * 1997-06-12 1999-05-25 F & K Delvotec Bondtechnik Gmbh Wire guide for a bonding machine
US6189765B1 (en) 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
US6039234A (en) * 1998-06-16 2000-03-21 Kulicke & Soffa Investments, Inc. Missing wire detector
EP1755157A3 (en) * 1998-09-01 2008-09-03 Matsushita Electric Industrial Co., Ltd. Bump joining judging device and method
US6514016B1 (en) 1999-10-29 2003-02-04 International Engine Intellectual Property Company, L.L.C. Stuck tool detector and related method
DE50110953D1 (de) 2001-11-07 2006-10-19 F & K Delvotec Bondtech Gmbh Prüfverfahren für Bondverbindungen und Drahtbonder
DE10315639A1 (de) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung
US7896218B2 (en) 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5963929B1 (ja) * 2015-09-04 2016-08-03 株式会社日立パワーソリューションズ 超音波検査装置、超音波検査システム、及び超音波検査方法
CN209880543U (zh) * 2019-06-28 2019-12-31 成都精蓉创科技有限公司 锥形微电子微连接深腔焊劈刀

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2633019A (en) * 1947-09-20 1953-03-31 Glenn L Martin Co Strain gauge pulse system
US3784079A (en) * 1972-04-03 1974-01-08 Motorola Inc Ultrasonic bond control apparatus
US3818334A (en) * 1973-04-11 1974-06-18 J Rosenberg Determining cutting tool force by measuring electrical resistance of a bearing
JPS5114983A (en:Method) * 1974-07-30 1976-02-05 Mitsubishi Heavy Ind Ltd
US4068371A (en) * 1976-07-12 1978-01-17 Miller Charles F Method for completing wire bonds
US4213556A (en) * 1978-10-02 1980-07-22 General Motors Corporation Method and apparatus to detect automatic wire bonder failure
US4341574A (en) * 1980-08-25 1982-07-27 Texas Instruments Incorporated Ultrasonic bond energy monitor
US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method

Also Published As

Publication number Publication date
US4786860A (en) 1988-11-22
DE3810929C2 (en:Method) 1992-12-03
JPS63268582A (ja) 1988-11-07
DE3810929A1 (de) 1988-10-27

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