JPH0340952B2 - - Google Patents

Info

Publication number
JPH0340952B2
JPH0340952B2 JP57049079A JP4907982A JPH0340952B2 JP H0340952 B2 JPH0340952 B2 JP H0340952B2 JP 57049079 A JP57049079 A JP 57049079A JP 4907982 A JP4907982 A JP 4907982A JP H0340952 B2 JPH0340952 B2 JP H0340952B2
Authority
JP
Japan
Prior art keywords
melting point
low melting
point metal
heat conductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57049079A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58166750A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57049079A priority Critical patent/JPS58166750A/ja
Publication of JPS58166750A publication Critical patent/JPS58166750A/ja
Publication of JPH0340952B2 publication Critical patent/JPH0340952B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/774—
    • H10W72/877—
    • H10W90/724—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57049079A 1982-03-29 1982-03-29 集積回路の冷却装置 Granted JPS58166750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57049079A JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57049079A JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Publications (2)

Publication Number Publication Date
JPS58166750A JPS58166750A (ja) 1983-10-01
JPH0340952B2 true JPH0340952B2 (enExample) 1991-06-20

Family

ID=12821080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57049079A Granted JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Country Status (1)

Country Link
JP (1) JPS58166750A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
DE68926211T2 (de) * 1988-10-28 1996-11-07 Sumitomo Electric Industries Träger für eine Halbleiteranordnung
US6243944B1 (en) * 1997-12-08 2001-06-12 Unisys Corporation Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
US6867976B2 (en) * 2002-02-12 2005-03-15 Hewlett-Packard Development Company, L.P. Pin retention for thermal transfer interfaces, and associated methods
FR3138563B1 (fr) * 2022-07-27 2025-04-11 Safran Electronics & Defense Drain thermique pour une carte électronique

Also Published As

Publication number Publication date
JPS58166750A (ja) 1983-10-01

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