JPH0340947B2 - - Google Patents
Info
- Publication number
- JPH0340947B2 JPH0340947B2 JP57104111A JP10411182A JPH0340947B2 JP H0340947 B2 JPH0340947 B2 JP H0340947B2 JP 57104111 A JP57104111 A JP 57104111A JP 10411182 A JP10411182 A JP 10411182A JP H0340947 B2 JPH0340947 B2 JP H0340947B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- measurement
- shield plate
- chuck top
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 39
- 238000005259 measurement Methods 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 35
- 238000000034 method Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 239000000523 sample Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57104111A JPS58220438A (ja) | 1982-06-17 | 1982-06-17 | 半導体ウエハ測定載置台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57104111A JPS58220438A (ja) | 1982-06-17 | 1982-06-17 | 半導体ウエハ測定載置台 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58220438A JPS58220438A (ja) | 1983-12-22 |
JPH0340947B2 true JPH0340947B2 (de) | 1991-06-20 |
Family
ID=14372012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57104111A Granted JPS58220438A (ja) | 1982-06-17 | 1982-06-17 | 半導体ウエハ測定載置台 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58220438A (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH067562B2 (ja) * | 1986-12-01 | 1994-01-26 | 東京エレクトロン株式会社 | プロ−バ用載置台の構造 |
JPS63151039A (ja) * | 1986-12-16 | 1988-06-23 | Hitachi Electronics Eng Co Ltd | 誘電体絶縁層ステ−ジによるウエハlsiの検査方法 |
US4884026A (en) * | 1987-06-24 | 1989-11-28 | Tokyo Electron Limited | Electrical characteristic measuring apparatus |
JPH0762691B2 (ja) * | 1987-06-24 | 1995-07-05 | 東京エレクトロン株式会社 | 電気特性測定装置 |
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
JP3565496B2 (ja) * | 2000-04-13 | 2004-09-15 | イビデン株式会社 | セラミックヒータ、静電チャックおよびウエハプローバ |
JP2006128351A (ja) * | 2004-10-28 | 2006-05-18 | Tokyo Seimitsu Co Ltd | 容量測定システム及び容量測定方法 |
JP4912056B2 (ja) * | 2006-06-22 | 2012-04-04 | 株式会社東京精密 | プローバ用チャック |
JP4965287B2 (ja) * | 2007-03-14 | 2012-07-04 | 東京エレクトロン株式会社 | 載置台 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5330992A (en) * | 1976-06-28 | 1978-03-23 | Minnesota Mining & Mfg | Luminescent phosphorescnt substances* composites thereof and sensitizing screens using same |
JPS54153A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Ltd | Panel device |
-
1982
- 1982-06-17 JP JP57104111A patent/JPS58220438A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5330992A (en) * | 1976-06-28 | 1978-03-23 | Minnesota Mining & Mfg | Luminescent phosphorescnt substances* composites thereof and sensitizing screens using same |
JPS54153A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Ltd | Panel device |
Also Published As
Publication number | Publication date |
---|---|
JPS58220438A (ja) | 1983-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6917195B2 (en) | Wafer probe station | |
US6902941B2 (en) | Probing of device elements | |
US8323991B2 (en) | Method for detecting stress migration properties | |
CN103323486B (zh) | 一种高阻值材料的塞贝克系数的测试芯片 | |
US20120249176A1 (en) | Test structure and measurement method thereof | |
JPH0340947B2 (de) | ||
CN102082107B (zh) | 芯片测温方法 | |
JPH0436625A (ja) | 等温端子ブロック | |
US3416078A (en) | Method of determining resistivity of a thin layer | |
US3787764A (en) | Solid dielectric capacitance gauge for measuring fluid pressure having temperature compensation and guard electrode | |
CN111736052B (zh) | 探针卡、具有其的晶圆检测设备及使用其的裸晶测试流程 | |
CN117169277A (zh) | 传感器、芯片内部接触热阻的测试系统及方法 | |
JPH067562B2 (ja) | プロ−バ用載置台の構造 | |
JP4912056B2 (ja) | プローバ用チャック | |
US6864676B2 (en) | Substrate-holding device for testing circuit arrangements on substrates | |
JPH0762691B2 (ja) | 電気特性測定装置 | |
JP2618926B2 (ja) | 電気的特性測定システム | |
JPS618939A (ja) | 半導体装置 | |
JPH07235577A (ja) | 配線評価装置およびその使用方法 | |
KR100430419B1 (ko) | 반도체 소자의 전기적 특성 검사방법 | |
JPH02166746A (ja) | 測定装置 | |
Halperin et al. | Latent open defect detection using phase-sensitive nonlinearity detection technique | |
JPH109963A (ja) | 測温抵抗体素子によるシリコンウェハー等の温度計測構造 | |
Subramanian et al. | Comparison of predictive methods for analysis of electromigration | |
JP2006128351A (ja) | 容量測定システム及び容量測定方法 |