JPH0338848Y2 - - Google Patents

Info

Publication number

JPH0338848Y2

JPH0338848Y2 JP15798185U JP15798185U JPH0338848Y2 JP H0338848 Y2 JPH0338848 Y2 JP H0338848Y2 JP 15798185 U JP15798185 U JP 15798185U JP 15798185 U JP15798185 U JP 15798185U JP H0338848 Y2 JPH0338848 Y2 JP H0338848Y2

Authority

JP

Japan

Prior art keywords

frame

hybrid integrated

sealing resin

integrated circuit

boards

Prior art date

1985-10-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 229920005989 resin Polymers 0.000 claims description 29
• 239000011347 resin Substances 0.000 claims description 29
• 238000007789 sealing Methods 0.000 claims description 23
• 238000005192 partition Methods 0.000 claims description 13
• 239000000758 substrate Substances 0.000 claims description 11
• 238000010396 two-hybrid screening Methods 0.000 claims description 5
• 238000002347 injection Methods 0.000 description 3
• 239000007924 injection Substances 0.000 description 3
• 229910052782 aluminium Inorganic materials 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
• 230000001105 regulatory effect Effects 0.000 description 2
• 239000003990 capacitor Substances 0.000 description 1
• 230000008602 contraction Effects 0.000 description 1
• 238000005336 cracking Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1